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Research Papers

Ultraminiaturized Three-Dimensional IPAC Packages With 100 μm Thick Glass Substrates for Radio Frequency Front-End Modules

[+] Author and Article Information
Zihan Wu

3D Systems Packaging Research Center,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: zwu77@gatech.edu

Junki Min, Vanessa Smet, Markondeya Raj Pulugurtha, Venky Sundaram, Rao R. Tummala

3D Systems Packaging Research Center,
Georgia Institute of Technology,
Atlanta, GA 30332

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received December 31, 2016; final manuscript received March 28, 2017; published online July 27, 2017. Assoc. Editor: Eric Wong.

J. Electron. Packag 139(4), 041001 (Jul 27, 2017) (9 pages) Paper No: EP-16-1151; doi: 10.1115/1.4037221 History: Received December 31, 2016; Revised March 28, 2017

This paper presents innovative compact three-dimensional integrated passive and active components (3D IPAC) packages with ultrathin glass substrates for radio frequency (RF) long-term evolution (LTE) front-end modules (FEMs). High component density was achieved through double-side integration of substrate-embedded passives for impedance matching networks and three-dimensional (3D) double-side assembly of filters onto glass substrates. Glass with 100 μm thickness formed the core of the package, while four build-up layers with 15 μm thickness each were used to embed passives and form redistribution layers (RDLs). Advanced panel-scale double-side assembly processes were developed with low-cost mass reflow. Board-level assembly was realized with paste-printed solder balls and reflow on printed circuit board (PCB) with no intermediate substrates. Electrical performance of filters with substrate-embedded impedance matching networks was characterized and compared to simulations.

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Figures

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Fig. 1

Concept of 3D IPAC glass packages

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Fig. 2

Schematic diagram of impedance matching networks for SAW and BAW filters

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Fig. 3

Circuit-level simulation results of impedance matching networks for (a) BAW filters and (b) SAW filters

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Fig. 4

3D glass package stack-up and design rules

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Fig. 5

Glass substrate model with embedded passives

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Fig. 6

EM simulation results with impedance matching networks for (a) BAW filters and (b) SAW filters

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Fig. 7

Glass substrate fabrication process flow

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Fig. 8

TPV formation inside glass substrates

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Fig. 9

Fabrication results of glass substrates: (a) electroless SAP metalized layers M1–M4 and (b) an embedded 1.65 nH inductor for SAW filters

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Fig. 10

Process flow of panel-level double-side assembly of 3D glass packages

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Fig. 11

Results of double-side assembled 3D glass packages: (a) panel-level assembly of SAW filters on the top side of substrates by mass reflow, (b) panel-level BGA balling by paste printing, (c) panel-level assembly of BAW filters on the backside of substrates by mass reflow, and (d) measured profile of paste-printed BGA ball

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Fig. 12

Cross-sectional views of (a) the 3D glass package assembled onto the board and (b) BGA solder balls after board-level assembly

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Fig. 13

Measured performance of (a) BAW filters with their impedance matching networks and (b) SAW filters with their impedance matching networks

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