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research-article

Ultra-miniaturized 3D IPAC Packages with 100um Thick Glass Substrates for RF Front-end Modules

[+] Author and Article Information
Zihan Wu

3D System Packaging Research Center, Georgia Institute of Technology, Atlanta, GA USA
zwu77@gatech.edu

Junki Min

3D System Packaging Research Center, Georgia Institute of Technology, Atlanta, GA USA
junki.min@ece.gatech.edu

Vanessa Smet

3D System Packaging Research Center, Georgia Institute of Technology, Atlanta, GA USA
vanessa.smet@prc.gatech.edu

P. Markondeya Raj

3D System Packaging Research Center, Georgia Institute of Technology, Atlanta, GA USA
raj.pulugurtha@ece.gatech.edu

Venky Sundaram

3D System Packaging Research Center, Georgia Institute of Technology, Atlanta, GA USA
Vs24@mail.gatech.edu

Rao Tummala

3D System Packaging Research Center, Georgia Institute of Technology, Atlanta, GA USA
rtummala@ece.gatech.edu

1Corresponding author.

ASME doi:10.1115/1.4037221 History: Received December 31, 2016; Revised March 28, 2017

Abstract

This paper presents innovative compact three-dimensional integrated passive and active components (3D IPAC) packages with ultra-thin glass substrates for RF long-term evolution (LTE) front-end modules (FEMs). High component density was achieved through double-side integration of substrate-embedded passives for impedance matching networks and 3D double-side assembly of filters onto glass substrates. Glass with 100 µm thickness forms the core the package while four build-up layers with 15 µm thickness each are used to embed passives and form redistribution layers (RDL). Advanced panel-scale double-side assembly processes were developed with low-cost mass reflow. Board-level assembly and characterization was realized with paste-printed solder balls and reflow on PCB with no intermediate substrates. Electrical performance of filters with substrate-embedded impedance matching networks was characterized and compared to simulations.

Copyright (c) 2017 by ASME
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