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research-article

Bio-Based Epoxy Resins Derived From Eugenol with Low Dielectric Constant

[+] Author and Article Information
Yuan Liu

Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, (P. R. China)Engineering Research Center for Materials Protection of Wear and Corrosion of Guizhou Province, Guiyang University, Guiyang 550005, (P. R. China)University of Chinese Academy of Sciences, Beijing 100049 (P. R. China)
littleliuyuan@126.com

Jinyue Dai

Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, (P. R. China)University of Chinese Academy of Sciences, Beijing 100049 (P. R. China)
daijinyue@nimte.ac.cn

Xiaoqing Liu

Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, (P. R. China)University of Chinese Academy of Sciences, Beijing 100049 (P. R. China)
liuxq@nimte.ac.cn

Jun Luo

Engineering Research Center for Materials Protection of Wear and Corrosion of Guizhou Province, Guiyang University, Guiyang 550005, (P. R. China)
luojun_gyu@sina.com

Shusen You

Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, (P. R. China)University of Chinese Academy of Sciences, Beijing 100049 (P. R. China)
youshusen@nimte.ac.cn

Jin Zhu

Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, (P. R. China)University of Chinese Academy of Sciences, Beijing 100049 (P. R. China)
jzhu@nimte.ac.cn

Songqi MA

Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, (P. R. China)University of Chinese Academy of Sciences, Beijing 100049 (P. R. China)
masongqi@nimte.ac.cn

Zhen Jia

Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, (P. R. China)University of Chinese Academy of Sciences, Beijing 100049 (P. R. China)
jiazhen@nimte.ac.cn

1Corresponding author.

ASME doi:10.1115/1.4036818 History: Received February 11, 2017; Revised April 19, 2017

Abstract

In this paper, a serials of bio-based epoxy resins containing organic silicone were prepared from eugenol through a mild synthetic route. Then 4,4'-diaminophenyl methane (DDM) was employed to cure these epoxy resins and bisphenol A epoxy resin (DGEBA) was used as a control. The chemical structures of the synthesized resins were characterized by Nuclear Magnetic Resonance (1H-NMR). Properties of the cured epoxy resins were investigated by dielectric test, Differential Scanning Calorimetry (DSC), Thermogravimetric Analysis (TGA), Dynamic Mechanical Analysis (DMA) and Scanning Electron Microscopy (SEM). Compared with DGEBA, the bio-based epoxy resin containing cyclic organic silicon structure exhibited a dramatically lower dielectric constant at both low and high frequencies (3.46, 1kHz, room temperature). Moreover, the silicone-modified bio-based epoxy resins demonstrated no weight loss below 325 °C and higher residues at 800 °C than that of DGEBA.

Copyright (c) 2017 by ASME
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