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Research Papers

Bio-Based Epoxy Resins Derived From Eugenol With Low Dielectric Constant

[+] Author and Article Information
Yuan Liu

Polymer and Composites Division,
Ningbo Institute of Materials Technology and Engineering,
Chinese Academy of Sciences,
Ningbo 315201, China;
Engineering Research Center for Materials Protection of
Wear and Corrosion of Guizhou Province,
Guiyang University,
Guiyang 550005, China;
University of Chinese Academy of Sciences,
Beijing 100049, China

Jinyue Dai

Polymer and Composites Division,
Ningbo Institute of Materials Technology and Engineering,
Chinese Academy of Sciences,
Ningbo 315201, China;
University of Chinese Academy of Sciences,
Beijing 100049, China

Xiaoqing Liu

Polymer and Composites Division,
Ningbo Institute of Materials Technology and Engineering,
Chinese Academy of Sciences,
Ningbo 315201, China;
University of Chinese Academy of Sciences,
Beijing 100049, China
e-mail: liuxq@nimte.ac.cn

Jun Luo

Engineering Research Center for Materials Protection of
Wear and Corrosion of Guizhou Province,
Guiyang University,
Guiyang 550005, China

Shusen You, Jin Zhu, Songqi Ma

Polymer and Composites Division,
Ningbo Institute of Materials Technology
and Engineering,
Chinese Academy of Sciences,
Ningbo 315201, China;
University of Chinese Academy of Sciences,
Beijing 100049, China

Zhen Jia

Ningbo Institute of Materials Technology
and Engineering,
Chinese Academy of Sciences,
Ningbo 315201, China;
University of Chinese Academy of Sciences,
Beijing 100049, China

1Both authors contributed equally to this paper.

2Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received February 11, 2017; final manuscript received April 19, 2017; published online June 30, 2017. Assoc. Editor: Yi-Shao Lai.

J. Electron. Packag 139(3), 031006 (Jun 30, 2017) (7 pages) Paper No: EP-17-1016; doi: 10.1115/1.4036818 History: Received February 11, 2017; Revised April 19, 2017

In this paper, a series of bio-based epoxy resins containing organic silicone were prepared from eugenol through a mild synthetic route. Then, 4,4′-diaminophenyl methane (DDM) was applied to cure these epoxy resins, and bisphenol A epoxy resin (DGEBA) was used as a control. The chemical structures of the synthesized resins were characterized by nuclear magnetic resonance (1H-NMR). Properties of the cured epoxy resins were investigated by dielectric test, differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA), and scanning electron microscopy (SEM). Compared with DGEBA, the bio-based epoxy resin containing cyclic organic silicon structure exhibited a dramatically lower dielectric constant at both low and high frequencies (3.46, 1 kHz, room temperature). Moreover, the silicone-modified bio-based epoxy resins demonstrated no weight loss below 325 °C and higher residues at 800 °C than that of DGEBA.

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Figures

Grahic Jump Location
Fig. 2

Chemical structure and synthetic route of TMDPSPMP

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Fig. 1

Chemical structure and synthetic route of TMDSPMP

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Fig. 3

Chemical structure and synthetic route of TMTOSTPTMP

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Fig. 4

Chemical structures and synthetic route of TMDSPMP-EP

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Fig. 5

Chemical structure and synthetic route of TMDPSPMP-EP

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Fig. 6

Chemical structure and synthetic route of TMTOSTPTMP-EP

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Fig. 7

1H-NMR spectrum of TMDSPMP, TMDPSPMP, and TMTOSTPTMP

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Fig. 8

1H-NMR spectrum of TMDSPMP-EP, TMDPSPMP-EP, and TMTOSTPTMP-EP

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Fig. 11

SEM morphologies of tensile cross sections for the different cured systems

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Fig. 9

TGA curves for the different cured epoxy resins

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Fig. 10

Tensile curves of the different cured system

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