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research-article

Modified constitutive creep laws with micro-mechanical modelling of Pb-free solder alloys

[+] Author and Article Information
Joel Thambi

Innovation center for advanced electronics Continental Automotive GmbH, 93055 Regensburg, Germany
luthersjoel@gmail.com

Andreas Schiessl

Innovation center for advanced electronics Continental Automotive GmbH, 93055 Regensburg, Germany
Andreas.schiessl@continental-corporation.com

Manuela Waltz

Faculty of mechanical engineering Technische Hochschule Ingolstadt, Esplanade 10, 85049 Ingolstadt, Germany
Manuela.Waltz@thi.de

Klaus-Dieter Lang

Faculty of electrical engineering and computer science Technische Universität Berlin, 10623 Berlin, Germany
Klaus-dieter.lang@izm.fraunhofer.de

Ulrich Tetzlaff

Faculty of mechanical engineering Technische Hochschule Ingolstadt Esplanade 10, 85049 Ingolstadt, Germany
Ulrich.Tetzlaff@thi.de

1Corresponding author.

ASME doi:10.1115/1.4035850 History: Received May 18, 2016; Revised January 03, 2017

Abstract

This paper, explicitly establishes a modified creep model of a Sn3.8Ag0.7Cu alloy using a physical based micro-mechanical modelling technique. Through experimentation and reformulation steady-state creep behavior, is analyzed with minimum strain rates for different temperatures 35°C, 80°C, and 125°C. The new modified physical creep model is proposed, by understanding the respective precipitate strengthened deformation mechanism, seeing the dependency of the activation energy over the temperature along with stress and fi-nally by integrating the subgrain size dependency λss. The new model is found to accurately modelling the creep behavior of Lead free solder alloy by combining the physical state variables. The features of the creep model can be explored further by changing the physical variable such as subgrain size to establish a struc-ture - property relationship for a better solder joint reliability performance.

Copyright (c) 2017 by ASME
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