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Research Papers

Accurate Predetermination of the Process Parameters for Glass/Glass Laser Bonding Based on the Temperature Distribution Analysis

[+] Author and Article Information
Yanyi Xiao

School of Mechatronic Engineering
and Automation,
Shanghai University,
Shanghai 200072, China
e-mail: xiaoyanyi2014@163.com

Wen Wang

School of Mechatronic Engineering
and Automation,
Shanghai University,
Shanghai 200072, China
e-mail: wangwen713@163.com

Jianhua Zhang

School of Mechatronic Engineering
and Automation,
Shanghai University,
Shanghai 200072, China
e-mail: jhzhang@oa.shu.edu.cn

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received May 17, 2015; final manuscript received March 17, 2016; published online April 15, 2016. Assoc. Editor: Susan Lu.

J. Electron. Packag 138(2), 021006 (Apr 15, 2016) (7 pages) Paper No: EP-15-1051; doi: 10.1115/1.4033106 History: Received May 17, 2015; Revised March 17, 2016

Temperature distribution is the key factor affecting the bonding quality in the glass/glass laser bonding process. In this work, the finite element method was used to establish three-dimensional (3D) numerical analysis model of the temperature field during bonding. Based on the result of the finite element analysis, the crucial parameters and their influences on the temperature distribution were discussed. In order to predetermine the necessary process parameter values for bonding, a nonlinear multiparameter fitting formula was established to predict the maximum temperature. The fitting model was validated experimentally by recording the maximum temperature during laser bonding via an infrared thermal imager.

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References

Figures

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Fig. 1

Glass/glass laser encapsulation schematic diagram

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Fig. 2

The transmittance of the glass frit and the glass substrate

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Fig. 3

Mesh and load path of the finite element analysis: (a) mesh and (b) load path

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Fig. 4

The temperature distribution contour at 10 s obtained for (a) the upper surface of the upper substrate and (b) the upper surface of the lower substrate with the glass frit

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Fig. 5

The upper and lower glass substrate laser center point temperature–time

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Fig. 6

Temperature distribution under two different laser powers: (a) 0.5 W and (b) 4 W

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Fig. 7

Temperature distribution under two different laser spot diameters: (a) 0.4 mm and (b) 1.8 mm

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Fig. 8

Temperature distribution under two different laser sealing speeds: (a) the laser sealing speed is 2 mm/s and (b) the laser sealing speed is 16 mm/s

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Fig. 9

The uniformized variation ratio of the maximum temperature versus that of the parameters

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Fig. 10

Interaction effects of the power and the spot diameter on the maximum temperature during bonding at the laser power of 3 W

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Fig. 11

The setup of the infrared thermal imager

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Fig. 12

Temperature measuring schematic model (unit: mm)

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Fig. 13

The measured and calculated maximum temperatures

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