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Research Papers

Analytical Solution for Electronic Assemblies Under Vibration

[+] Author and Article Information
Mohammad A. Gharaibeh

Mechanical Engineering Department,
Thomas J. Watson School of Engineering and Applied Sciences,
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: mgharai1@binghamton.edu

Quang T. Su

Mechanical Engineering Department,
Thomas J. Watson School of Engineering and Applied Sciences,
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: qsu@binghamton.edu

James M. Pitarresi

Mechanical Engineering Department,
Thomas J. Watson School of Engineering and Applied Sciences,
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: jmp@binghamton.edu

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received October 11, 2015; final manuscript received December 30, 2015; published online March 10, 2016. Assoc. Editor: Eric Wong.

J. Electron. Packag 138(1), 011003 (Mar 10, 2016) (10 pages) Paper No: EP-15-1113; doi: 10.1115/1.4032497 History: Received October 11, 2015; Revised December 30, 2015

An analytical solution using Ritz method for the electronic assembly vibration problem has been presented in detail. In this solution, a special treatment for plate-mounted-on-standoffs boundary conditions scheme was required, and hence described. Also, a simple equation for estimating ball grid array (BGA) solder joint axial stiffness was developed. The results of the analytical solution were validated with modal analysis measurements and finite element (FE) models data in terms of natural frequencies and mode shapes. Then, the analytical solution was used to estimate the most critical solder joint deformations and stresses. Finally, the so developed solution provided an effective tool to examine the effect of several geometric and material configurations of electronic package structure on the fatigue performance of electronic products under mechanical vibration loadings.

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References

Wong, E. H. , Seah, S. K. W. , and Shim, V . P. W. , 2008, “ A Review of Board Level Solder Joints for Mobile Applications,” Microelectron. Reliab., 48(11), pp. 1747–1758. [CrossRef]
Wong, E. H. , Lim, K. M. , Lee, N. , Seah, S. , Hoe, C. , and Wang, J. , 2002, “ Drop Impact Test—Mechanics and Physics of Failure,” 4th Electronics Packaging Technology Conference, Singapore, Dec. 10–12, pp. 327–333.
Pitarresi, J. M. , and Primavera, A. A. , 1992, “ Comparison of Modeling Techniques for the Vibration Analysis of Printed Circuit Cards,” ASME J. Electron. Packag., 114(4), pp. 378–383. [CrossRef]
Pitarresi, J. M. , and Akanda, A. , 1993, “ Random Vibration Response of a Surface Mount Lead/Solder Joint,” ASME International Electronics Packaging Conference, Binghamton, NY, Sept. 29–Oct. 2, Vol. 1, pp. 207–215.
Pitarresi, J. M. , 1990, “ Modeling of Printed Circuit Cards Subject to Vibration,” IEEE International Symposium on Circuits and Systems, New Orleans, LA, May 1–3, pp. 2104–2107.
Pitarresi, J. M. , Caletka, D. V. , Caldwell, R. , and Smith, D. E. , 1991, “ The ‘Smeared’ Property Technique for the FE Vibration Analysis of Printed Circuit Cards,” ASME J. Electron. Packag., 113(3), pp. 250–257. [CrossRef]
Pitarresi, J. , Roggeman, B. , Chaparala, S. , and Geng, P. , 2004, “ Mechanical Shock Testing and Modeling of PC Motherboards,” 54th Electronic Components and Technology Conference, Las Vegas, NV, June 1–4, pp. 1047–1054.
Pitarresi, J. , Geng, P. , Beltman, W. , and Ling, Y. , 2002, “ Dynamic Modeling and Measurement of Personal Computer Motherboards,” 52nd Electronic Components and Technology Conference, San Diego, CA, May 31, pp. 597–603.
Su, Q. , Pitarresi, J. , Gharaibeh, M. , Stewart, A. , Joshi, G. , and Anselm, M. , 2014, “ Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking,” 64th Electronic Components and Technology Conference, Orlando, FL, May 27–30, pp. 119–125.
Ernst, M. , Habtour, E. , Dasgupta, A. , Pohland, M. , Robeson, M. , and Paulus, M. , 2015, “ Comparison of Electronic Component Durability Under Uniaxial and Multiaxial Random Vibrations,” ASME J. Electron. Packag., 137(1), p. 011009. [CrossRef]
Lall, P. , Shantaram, S. , Suhling, J. , and Locker, D. , 2015, “ Stress–Strain Behavior of SAC305 at High Strain Rates,” ASME J. Electron. Packag., 137(1), p. 011010. [CrossRef]
Mindlin, R. D. , 1945, “ Dynamics of Package Cushioning,” Bell Syst. Tech. J., 24(3), pp. 353–461. [CrossRef]
Aytekin, B. , and Ozguven, H. N. , 2008, “ Vibration Analysis of a Simply Supported PCB With a Component—An Analytical Approach,” 10th Electronic Packaging Technology Conference, Singapore, Dec. 9–12, pp. 1178–1183.
Perkins, A. , and Sitaraman, S. K. , 2004, “ Vibration-Induced Solder Joint Failure of a Ceramic Column Grid Array (CCGA) Package,” 54th Electronic Components and Technology Conference, Las Vegas, NV, June 1–4, pp. 1271–1278.
Wang, F. , and Fan, D. , 2015, “ Modeling and Experimental Study of a Wire Clamp for Wire Bonding,” ASME J. Electron. Packag., 137(1), p. 011012. [CrossRef]
Suhir, E. , 1988, “ On a Paradoxical Phenomenon Related to Beams on Elastic Foundation: Could External Compliant Leads Reduce the Strength of a Surface-Mounted Device?,” ASME J. Appl. Mech., 55(4), pp. 818–821. [CrossRef]
Engle, P. A. , 1990, “ Structural Analysis for Circuit Card Systems Subjected to Bending,” ASME J. Electron. Packag., 112(1), pp. 2–10. [CrossRef]
Pitarresi, J. M. , 1999, “ Elastically Coupled Beams Loaded by a Point Force,” 13th Engineering Mechanics Conference, Baltimore, MD, June 13–16, pp. 397–403.
Wong, E. H. , Mai, Y. W. , Seah, S. K. , Lim, K. M. , and Lim, T. B. , 2007, “ Analytical Solutions for Interconnect Stress in Board Level Drop Impact,” IEEE Trans. Adv. Packag., 30(4), pp. 654–664. [CrossRef]
Wong, E. H. , Mai, Y. W. , Seah, S. K. , Lim, K. M. , and Lim, T. B. , 2006, “ Analytical Solutions for Interconnect Stress in Board Level Drop Impact,” 56th Electronic Components and Technology Conference, San Diego, CA, May 30–June 2, pp. 1808–1815.
Spectral Dynamics, “ STAR Modal 7.0,” Spectral Dynamics, Troy, MI, http://www.spectraldynamics.com/index.php/products/star/star-modal
ANSYS, “ ANSYS 15.0,” ANSYS, Inc., Canonsburg, PA, http://www.ansys.com
Montgomery, D. C. , and Runger, G. C. , 2010, Applied Statistics and Probability for Engineers, Wiley, New York.
Shames, I. H. , and Pitarresi, J. M. , 2000, Introduction to Solid Mechanics, Prentice-Hall, New Delhi, India.

Figures

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Fig. 1

Test vehicle description

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Fig. 2

Modal analysis experiment

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Fig. 3

FE model: (a) assembly and (b) solder joint mesh

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Fig. 4

Two parallel plate configuration

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Fig. 5

SDOF system: (a) conservative and (b) nonconservative

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Fig. 6

A comparison between (a) FEA and (b) least square fit mode shapes

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Fig. 7

Comparison between FEA and least square fit mode shapes across the PCB diagonal line

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Fig. 8

BGA solder joint configuration

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Fig. 9

Effect of (a) solder ball width and (b) standoff height on BGA solder axial stiffness

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Fig. 10

Assembly's first mode shapes from (a) experiment, (b) FEA model, and (c) analytical solution

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Fig. 11

Outermost solder joint axial deflection response

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Fig. 12

BGA configuration showing the smallest area in the solder

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Fig. 13

Effect of PCB stiffness: (a) elastic modulus E1 and (b) thickness h1 on solder nominal stresses

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Fig. 14

Effect of solder ball (a) diameter and (b) height on solder nominal stresses

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