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Research Papers

Influence of Secondary Impact on Printed Wiring Assemblies—Part I: High-Frequency “Breathing Mode” Deformations in the Printed Wiring Board

[+] Author and Article Information
Jingshi Meng

Center for Advanced Life
Cycle Engineering (CALCE),
Mechanical Engineering Department,
University of Maryland,
College Park, MD 20742

Abhijit Dasgupta

Fellow ASME
Center for Advanced Life
Cycle Engineering (CALCE),
Mechanical Engineering Department,
University of Maryland,
College Park, MD 20742
e-mail: dasgupta@umd.edu

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received September 26, 2015; final manuscript received January 6, 2016; published online March 10, 2016. Assoc. Editor: Jeffrey C. Suhling.

J. Electron. Packag 138(1), 010914 (Mar 10, 2016) (12 pages) Paper No: EP-15-1101; doi: 10.1115/1.4032495 History: Received September 26, 2015; Revised January 06, 2016

Design rules for portable electronic device are continuously striving for thinner printed wiring assemblies (PWAs) and smaller clearances because of ever-increasing demand for functionality and miniaturization. As a result, during accidental drop and impact events, there is an increased probability of internal secondary impact between a PWA and adjacent internal structures. In particular, compared to the initial impact, acceleration pulses caused by contact during secondary impacts are typically characterized by significant increase of amplitudes and frequency bandwidth. The resonant response in the thickness direction of printed wiring boards (PWBs) (termed the dynamic “breathing mode” of response, in this study) acts as a mechanical bandpass filter and places miniature internal structures in some components (such as microelectromechanical systems (MEMS)) at risk of failure, if any of them have resonant frequencies within the transmitted frequency bandwidth. This study is the first part of a two-part series, presenting qualitative parametric insights into the effect of secondary impacts in a PWA. This first part focuses on analyzing the frequency spectrum of: (i) the impulse caused by secondary impact, (ii) the energy transmitted by the dynamic “breathing” response of multilayer PWBs, and (iii) the consequential dynamic response of typical structures with high resonant frequencies that are mounted on the PWB. Examples include internal deformable structures in typical surface mount technology (SMT) components and in MEMS components. The second part of this series will further explore the effects of the breathing mode of vibration on failures of various SMT components of different frequencies.

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Figures

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Fig. 1

Background and approach

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Fig. 2

FE model for secondary impact tests

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Fig. 3

Free vibration, Rayleigh damping

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Fig. 4

Pressure-overclosure correlation, slop defines contact stiffness

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Fig. 5

Secondary impact, soft contact

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Fig. 6

Sample impact acceleration input to the PWB

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Fig. 7

Spectrum of input pulses with different shapes

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Fig. 8

Multilayered 1D unit cell structure for PWB

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Fig. 10

Acceleration amplitude transfer function H(ω) obtained based on random vibration simulation (example condition: three-layer model, ζ = 0.04)

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Fig. 11

Sample output from time domain simulation (three-layer PWB, ζ = 0.04, pulse shape = triangle, tp = 1.5 × 10−5 s)

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Fig. 12

Quantities used in the definition of amplitude ratio γ

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Fig. 13

Amplitude transfer functions for multilayer PWBs

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Fig. 14

Amplitude ratio γ of high-frequency acceleration

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