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Research Papers

Molecular Dynamics Study on Explosive Boiling of Thin Liquid Argon Film on Nanostructured Surface Under Different Wetting Conditions

[+] Author and Article Information
Sheikh Mohammad Shavik

Department of Mechanical Engineering,
Bangladesh University of Engineering and Technology,
Dhaka 1000, Bangladesh
e-mail: shavik@me.buet.ac.bd

Mohammad Nasim Hasan, A. K. M. Monjur Morshed

Department of Mechanical Engineering,
Bangladesh University of Engineering and Technology,
Dhaka 1000, Bangladesh

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received September 20, 2015; final manuscript received November 25, 2015; published online March 10, 2016. Assoc. Editor: Toru Ikeda.

J. Electron. Packag 138(1), 010904 (Mar 10, 2016) (8 pages) Paper No: EP-15-1086; doi: 10.1115/1.4032463 History: Received September 20, 2015; Revised November 25, 2015

Molecular dynamics (MDs) simulations have been performed to investigate the boiling phenomena of thin liquid film adsorbed on a nanostructured solid surface with particular emphasis on the effect of wetting condition of the solid surface. The molecular system consists of liquid and vapor argon and solid platinum wall. The nanostructures which reside on top of the solid wall have shape of rectangular block. The solid–liquid interfacial wettability, in other words whether the solid surface is hydrophilic or hydrophobic, has been altered for different cases to examine its effect on boiling phenomena. The initial configuration of the simulation domain comprises a three-phase system (solid platinum, liquid argon, and vapor argon), which was equilibrated at 90 K. After equilibrium period, the wall temperature was suddenly increased from 90 K to 250 K which is far above the critical point of argon and this initiates rapid or explosive boiling. The spatial and temporal variation of temperature and density as well as the variation of system pressure with respect to time were closely monitored for each case. The heat flux normal to the solid surface was also calculated to illustrate the effectiveness of heat transfer for different cases of wetting conditions of solid surface. The results show that the wetting condition of surface has significant effect on explosive boiling of the thin liquid film. The surface with higher wettability (hydrophilic) provides more favorable conditions for boiling than the low-wetting surface (hydrophobic), and therefore, the liquid argon responds quickly and shifts from liquid to vapor phase faster in the case of hydrophilic surface. The heat transfer rate is also much higher in the case of hydrophilic surface.

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Figures

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Fig. 1

Initial configuration of the simulation

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Fig. 2

Solid wall configurations: (a) flat surface, (b) nanostructured surface 1, (c) nanostructured surface 2, and (d) nanostructured surface 3

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Fig. 3

Number density profile of argon on a flat hydrophilic (εAr–PtAr–Ar = 2) surface during equilibrium period

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Fig. 4

Temporal variation of system energy

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Fig. 5

Temperature history of argon (Ar) and solid wall for hydrophilic surface case

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Fig. 6

Temperature history of argon (Ar) and solid wall for hydrophobic surface case

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Fig. 7

Pressure history of the simulation domain for hydrophilic surface case

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Fig. 8

Pressure history of the simulation domain for hydrophobic surface case

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Fig. 9

Snapshots from the simulation domain for hydrophilic surface case: (a) flat surface, (b) surface 1, (c) surface 2, and (d) surface 3

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Fig. 10

Snapshots from the simulation domain for hydrophobic surface case: (a) flat surface, (b) surface 1, (c) surface 2, and (d) surface 3

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Fig. 11

Spatial temperature distribution of argon in the case of flat hydrophilic surface at different times

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Fig. 12

Number density profile of argon in the case of flat hydrophilic surface at different times

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Fig. 13

Spatial temperature distribution of argon at 3 ns for hydrophilic surface case

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Fig. 14

Number density profile of argon at 3 ns for hydrophilic surface case

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Fig. 15

Spatial temperature distribution of argon at 3 ns for hydrophobic surface case

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Fig. 16

Number density profile of argon at 3 ns for hydrophobic surface case

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Fig. 17

Heat flux normal to solid wall for hydrophilic surface case

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Fig. 18

Heat flux normal to solid wall for hydrophobic surface case

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Fig. 19

Net evaporation number for hydrophilic surface case

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Fig. 20

Net evaporation number for hydrophobic surface case

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Fig. 21

Nonevaporating layer in the case of hydrophilic surface: (a) surface 2 and (b) surface 3

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Fig. 22

Nonevaporating layer in the case of hydrophobic surface: (a) surface 2 and (b) surface 3

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