Technical Brief

Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate

[+] Author and Article Information
Zhiyuan Zhu, Yufeng Jin

National Key Laboratory of Science and
Technology on Micro/Nano Fabrication,
Peking University,
No. 5, Yiheyuan Road,
Haidian District,
Beijing 100871, China

Min Yu

National Key Laboratory of Science and
Technology on Micro/Nano Fabrication,
Peking University,
No. 5, Yiheyuan Road,
Haidian District,
Beijing 100871, China
e-mail: yum@pku.edu.cn

Lisha Liu

School of Chemical and Biomolecular Engineering,
Georgia Institute of Technology,
311 Ferst Drive NW,
Atlanta, GA 30332

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received June 30, 2015; final manuscript received September 30, 2015; published online October 20, 2015. Assoc. Editor: Yi-Shao Lai.

J. Electron. Packag 137(4), 044501 (Oct 20, 2015) (3 pages) Paper No: EP-15-1062; doi: 10.1115/1.4031750 History: Received June 30, 2015; Revised September 30, 2015

This paper researches temporary bonding/debonding based on propylene carbonate (PPC). The highest shear strength of 4.1 MPa was achieved when pure PPC was used as bonding adhesive. Room temperature debonding methods were investigated and compared with thermal debonding. Chemical debonding at room temperature was realized for bonding with the pure PPC. Several different chemicals can be used for chemical debonding. A photo acid generator (PAG)-assisted debonding method was demonstrated at room temperature when PAG-loaded PPC (PAG-PPC) was used as bonding adhesive. The ultraviolet (UV) radiation was used to enhance the PAG-assisted debonding.

Copyright © 2015 by ASME
Your Session has timed out. Please sign back in to continue.


Laplante, P. A. , 2005, Comprehensive Dictionary of Electrical Engineering, CRC Press, Boca Raton, pp. 603–629.
Fisher, G. , Seacrist, M. R. , and Standley, R. W. , 2012, “ Silicon Crystal Growth and Wafer Technologies,” Proc. IEEE, 100, pp. 1454–1474. [CrossRef]
Lindroos, V. , Tilli, M. , Lehto, A. , and Motooka, T. , 2010, Handbook of Silicon Based MEMS Materials and Technologies, William Andrew, Norwich, NY, pp. 3–136.
Johnson, R. W. , and Shen, Y. L. , 2015, “ Analysis of Thermal Stress and Its Influence on Carrier Mobility in Three-Dimensional Microelectronic Chip Stack,” ASME J. Electron. Packag., 137(2), p. 021011. [CrossRef]
Sun, Y. , Thompson, S. E. , and Nishida, T. , 2007, “ Physics of Strain Effects in Semiconductors and Metal-Oxide-Semiconductor Field-Effect Transistors,” J. Appl. Phys., 101(10), p. 104503. [CrossRef]
Hoyt, J. L. , Nayfeh, H. M. , Eguchi, S. , Aberg, I. , Xia, G. , Drake, T. , Fitzgerald, E. A. , and Antoniadis, D. A. , 2002, “ Strained Silicon MOSFET Technology,” Tech. Dig.-Int. Electron Devices Meet., 2002, pp. 23–26.
Chou, C. H. , Chan, W. S. , Lee, I . C. , Wang, C. L. , Wu, C. Y. , Yang, P. Y. , Liao, C. Y. , Wang, K. Y. , and Cheng, H. C. , 2015, “ High-Performance Single-Crystal-Like Strained-Silicon Nanowire Thin-Film Transistors Via Continuous-Wave Laser Crystallization,” IEEE Electron Device Lett., 36(4), pp. 348–350. [CrossRef]
Poborchii, V. , Hara, M. , Morita, Y. , and Tada, T. , 2015, “ Raman Spectroscopy of Ultrathin Strained-Silicon-on-Insulator: Size Effects in Strain, Elastic, and Phonon Properties,” Appl. Phys. Lett., 106(9), p. 093107. [CrossRef]
Azadeh, S. S. , Merget, F. , Nezhad, M. P. , and Witzens, J. , 2015, “ On the Measurement of the Pockels Effect in Strained Silicon,” Opt. Lett., 40(8), pp. 1877–1880. [CrossRef] [PubMed]
Chen, K. Y. , Zenner, R. L. D. , Ameson, M. , and Mountain, D. , 2000, “ Ultra-Thin Electronic Device Package,” IEEE Trans. Adv. Packag., 23(1), pp. 22–26. [CrossRef]
Priyabadini, S. , 2013, “ 3D-Stacking of Ultra-Thin Chips and Chip Packages,” Ph.D. thesis, Ghent University, Ghent, Belgium.
Liu, D. P. , and Park, S. , 2014, “ Three-Dimensional and 2.5 Dimensional Interconnection Technology: State of the Art,” ASME J. Electron. Packag., 136(1), p. 014001. [CrossRef]
John, H. L. , 2014, “ Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration,” ASME J. Electron. Packag., 136(4), p. 040801. [CrossRef]
Yan, H. , Cannon, W. R. , and Shanefield, D. , 1998, “ Thermal Decomposition Behaviour of Poly(Propylene Carbonate),” Ceram. Int., 24(6), pp. 433–439. [CrossRef]
Sain, M. M. , Ghosh, A. , and Banik, I. , 2007, “ Effect of Propylene Carbonate on the Properties of Composite Fiberboard From Wood Fiber Bonded With Renewable Wood Resin,” J. Reinf. Plast. Compos., 26(7), pp. 705–713. [CrossRef]
Fritz, N. , Dao, H. , Ann, S. , Allen, B. , and Kohl, P. A. , 2012, “ Polycarbonates as Temporary Adhesives,” Int. J. Adhes. Adhes., 38, pp. 45–49. [CrossRef]


Grahic Jump Location
Fig. 4

Debonding time for thermal and chemical debonding methods when pure PPC was used as bonding adhesive

Grahic Jump Location
Fig. 3

Microscopic image of the fracture surface when pure PPC was used as bonding adhesive

Grahic Jump Location
Fig. 2

Shear strength dependence on (a) bonding temperature and (b) storage time. Pure PPC, unexposed PAG-PPC, and exposed PAG-PPC were used as bonding adhesive.

Grahic Jump Location
Fig. 1

TGA results of pure PPC, unexposed PAG-PPC, and exposed PAG-PPC



Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In