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Technical Brief

Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate

[+] Author and Article Information
Zhiyuan Zhu, Yufeng Jin

National Key Laboratory of Science and
Technology on Micro/Nano Fabrication,
Peking University,
No. 5, Yiheyuan Road,
Haidian District,
Beijing 100871, China

Min Yu

National Key Laboratory of Science and
Technology on Micro/Nano Fabrication,
Peking University,
No. 5, Yiheyuan Road,
Haidian District,
Beijing 100871, China
e-mail: yum@pku.edu.cn

Lisha Liu

School of Chemical and Biomolecular Engineering,
Georgia Institute of Technology,
311 Ferst Drive NW,
Atlanta, GA 30332

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received June 30, 2015; final manuscript received September 30, 2015; published online October 20, 2015. Assoc. Editor: Yi-Shao Lai.

J. Electron. Packag 137(4), 044501 (Oct 20, 2015) (3 pages) Paper No: EP-15-1062; doi: 10.1115/1.4031750 History: Received June 30, 2015; Revised September 30, 2015

This paper researches temporary bonding/debonding based on propylene carbonate (PPC). The highest shear strength of 4.1 MPa was achieved when pure PPC was used as bonding adhesive. Room temperature debonding methods were investigated and compared with thermal debonding. Chemical debonding at room temperature was realized for bonding with the pure PPC. Several different chemicals can be used for chemical debonding. A photo acid generator (PAG)-assisted debonding method was demonstrated at room temperature when PAG-loaded PPC (PAG-PPC) was used as bonding adhesive. The ultraviolet (UV) radiation was used to enhance the PAG-assisted debonding.

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Figures

Grahic Jump Location
Fig. 1

TGA results of pure PPC, unexposed PAG-PPC, and exposed PAG-PPC

Grahic Jump Location
Fig. 2

Shear strength dependence on (a) bonding temperature and (b) storage time. Pure PPC, unexposed PAG-PPC, and exposed PAG-PPC were used as bonding adhesive.

Grahic Jump Location
Fig. 3

Microscopic image of the fracture surface when pure PPC was used as bonding adhesive

Grahic Jump Location
Fig. 4

Debonding time for thermal and chemical debonding methods when pure PPC was used as bonding adhesive

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