Research Papers

Double-Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface Materials

[+] Author and Article Information
Andrew J. McNamara, Yogendra Joshi, Zhuomin Zhang

George W. Woodruff School of
Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332

Kyoung-sik Moon, Ziyin Lin, Yagang Yao, Ching-Ping Wong

School of Materials Science and Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332

Wei Lin

Albany Nanotechnology Center,
Albany, NY 12203

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received December 4, 2014; final manuscript received April 22, 2015; published online July 14, 2015. Assoc. Editor: Gongnan Xie.

J. Electron. Packag 137(3), 031014 (Sep 01, 2015) (6 pages) Paper No: EP-14-1043; doi: 10.1115/1.4030802 History: Received December 04, 2014; Revised April 22, 2015; Online July 14, 2015

Recently, much attention has been given to reducing the thermal resistance attributed to thermal interface materials (TIMs) in electronic devices, which contribute significantly to the overall package thermal resistance. Thermal transport measured experimentally through several vertically aligned carbon nanotube (VACNT) array TIMs anchored to copper and silicon substrates is considered. A steady-state infrared (IR) microscopy experimental setup was designed and utilized to measure the cross-plane total thermal resistance of VACNT TIMs. Overall thermal resistance for the anchored arrays ranged from 4to50mm2KW-1. These values are comparable to the best current TIMs used for microelectronic packaging. Furthermore, thermal stability after prolonged exposure to a high-temperature environment and thermal cycling tests shows limited deterioration for an array anchored using a silver-loaded thermal conductive adhesive (TCA).

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McNamara, A. J., Joshi, Y., and Zhang, Z. M., 2011, “Characterization of Nanostructured Thermal Interface Materials—A Review,” Int. J. Therm. Sci., 62, pp. 2–11. [CrossRef]
Kim, P., Shi, L., Majumdar, A., and McEuen, P., 2001, “Thermal Transport Measurements of Individual Multiwalled Nanotubes,” Phys. Rev. Lett., 87(21), p. 215502. [CrossRef] [PubMed]
Pop, E., Mann, D., Wang, Q., Goodson, K., and Dai, H., 2006, “Thermal Conductance of an Individual Single-Wall Carbon Nanotube Above Room Temperature,” Nano Lett., 6(1), pp. 96–100. [CrossRef] [PubMed]
Pettes, M. T., and Shi, L., 2009, “Thermal and Structural Characterizations of Individual Single-, Double-, and Multi-Walled Carbon Nanotubes,” Adv. Funct. Mater., 19(24), pp. 3918–3925. [CrossRef]
Mingo, N., and Broido, D., 2005, “Carbon Nanotube Ballistic Thermal Conductance and Its Limits,” Phys. Rev. Lett., 95(9), p. 096105. [CrossRef] [PubMed]
Choi, S. U. S., Zhang, Z. G., Yu, W., Lockwood, F. E., and Grulke, E. A., 2001, “Anomalous Thermal Conductivity Enhancement in Nanotube Suspensions,” Appl. Phys. Lett., 79(14), pp. 2252–2254. [CrossRef]
Marconnet, A. M., Yamamoto, N., Panzer, M. A., Wardle, B. L., and Goodson, K. E., 2011, “Thermal Conduction in Aligned Carbon Nanotube-Polymer Nanocomposites With High Packing Density,” ACS Nano, 5(6), pp. 4818–4825. [CrossRef] [PubMed]
Xu, J., and Fisher, T. S., 2006, “Enhancement of Thermal Interface Materials With Carbon Nanotube Arrays,” Int. J. Heat Mass Transfer, 49(9–10), pp. 1658–1666. [CrossRef]
Cola, B. A., Amama, P. B., Xu, X., and Fisher, T. S., 2008, “Effects of Growth Temperature on Carbon Nanotube Array Thermal Interfaces,” ASME J. Heat Transfer, 130(11), p. 114503. [CrossRef]
Cola, B. A., Xu, J., and Fisher, T. S., 2009, “Contact Mechanics and Thermal Conductance of Carbon Nanotube Array Interfaces,” Int. J. Heat Mass Transfer, 52(15–16), pp. 3490–3503. [CrossRef]
Panzer, M. A., Duong, H. M., Okawa, J., Shiomi, J., Wardle, B. L., Maruyama, S., and Goodson, K. E., 2010, “Temperature-Dependent Phonon Conduction and Nanotube Engagement in Metalized Single Wall Carbon Nanotube Films,” Nano Lett., 10(7), pp. 2395–2400. [CrossRef] [PubMed]
Cross, R., Cola, B. A., Fisher, T. S., Xu, X., Gall, K., and Graham, S., 2010, “A Metallization and Bonding Approach for High Performance Carbon Nanotube Thermal Interface Materials,” Nanotechnology, 21(44), p. 445705. [CrossRef] [PubMed]
Yao, Y., Moon, K. S., McNamara, A. J., and Wong, C. P., 2013, “Water Vapor Treatment for Decreasing the Adhesion Between Vertically Aligned Carbon Nanotubes and the Growth Substrate,” Chem. Vap. Deposition, 19(7–9), pp. 224–227. [CrossRef]
McNamara, A. J., Sahu, V., Joshi, Y., and Zhang, Z. M., 2011, “Infrared Imaging Microscope as an Effective Tool for Measuring Thermal Resistance of Emerging Interface Materials,” ASME Paper No. AJTEC2011-44421. [CrossRef]
Yao, Y., Li, Z., and Wong, C. P., 2013, “Quality Control of Vertically Aligned Carbon Nanotubes Grown by Chemical Vapor Deposition,” IEEE Trans. Compon., Packag., Manuf. Technol., 3(11), pp. 1804–1810. [CrossRef]
Lin, W., Shang, J., Gu, W., and Wong, C. P., 2012, “Parametric Study of Intrinsic Thermal Transport in Vertically Aligned Multi-Walled Carbon Nanotubes Using a Laser Flash Technique,” Carbon, 50(4), pp. 1591–1603. [CrossRef]
Lin, Z., Li, Z., Moon, K. S., Fang, Y., Yao, Y., Li, L., and Wong, C. P., 2013, “Robust Vertically Aligned Carbon Nanotube–Carbon Fiber Paper Hybrid as Versatile Electrodes for Supercapacitors and Capacitive Deionization,” Carbon, 63, pp. 547–553. [CrossRef]
Nan, C. W., Liu, G., Lin, Y., and Li, M., 2004, “Interface Effect on Thermal Conductivity of Carbon Nanotube Composites,” Appl. Phys. Lett., 85(16), pp. 3549–3551. [CrossRef]
Xue, Q. Z., 2006, “Model for the Effective Thermal Conductivity of Carbon Nanotube Composites,” Nanotechnology, 17(6), pp. 1655–1660. [CrossRef]
Lin, W., Moon, K. S., and Wong, C. P., 2009, “A Combined Process of In Situ Functionalization and Microwave Treatment to Achieve Ultrasmall Thermal Expansion of Aligned Carbon Nanotube–Polymer Nanocomposites: Toward Applications as Thermal Interface Materials,” Adv. Mater., 21(23), pp. 2421–2424. [CrossRef]
Volkov, A. N., Shiga, T., Nicholson, D., Shiomi, J., and Zhigilei, L. V., 2012, “Effect of Bending Buckling of Carbon Nanotubes on Thermal Conductivity of Carbon Nanotube Materials,” J. Appl. Phys., 111(5), p. 053501. [CrossRef]


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Fig. 1

(a) SEM of TCA-bonded VACNT TIM and (b) zoomed-in SEM showing bonding between CNT and polymer

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Fig. 2

Metalized CNT used for In solder attachment

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Fig. 3

(a) Steady-state and IR microscope, QFI Infrascope II, and (b) steady-state IR test fixture

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Fig. 4

IR representative image showing interfacial TIM region and regions used to compute R"tot

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Fig. 5

R"tot measurement uncertainty for IR steady-state measurement at various applied sample heat fluxes

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Fig. 6

(a) Measured R"tot of TCA-based VACNT TIM as a function of array grown length and (b) R"tot for TCA-based VACNT TIM of varying total interfacial layer thicknesses

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Fig. 7

Thermal degradation of TCA-based VACNT TIM due to thermal cycling and aging tests

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Fig. 8

R"tot of solder-based attachment and R"tot after thermal cycling and aging tests




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