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Research Papers

Thermal Modeling of Microfluidic Channels for Cooling High Power Resistors on Multilayer Organic Liquid Crystal Polymer Substrate

[+] Author and Article Information
Outmane Lemtiri Chlieh

School of Electrical and Computer Engineering,
Georgia Institute of Technology,
Technology Square Research Building,
85 Fifth Street NW,
Atlanta, GA 30308
e-mail: olemtiri@gatech.edu

Wasif T. Khan

School of Electrical and Computer Engineering,
Georgia Institute of Technology,
Technology Square Research Building,
85 Fifth Street NW,
Atlanta, GA 30308;
Department of Electrical Engineering,
Lahore University of Management Sciences,
Opposite Sector U, D.H.A,
Lahore Cantt,
Lahore, Punjab 54000, Pakistan
e-mail: wasif.tanveer@lums.edu.pk

John Papapolymerou

School of Electrical and Computer Engineering,
Georgia Institute of Technology,
Technology Square Research Building,
85 Fifth Street NW,
Atlanta, GA 30308
e-mail: john.papapolymerou@ece.gatech.edu

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received November 24, 2014; final manuscript received May 15, 2015; published online June 8, 2015. Assoc. Editor: Pradip Dutta.

J. Electron. Packag 137(3), 031009 (Sep 01, 2015) (12 pages) Paper No: EP-14-1104; doi: 10.1115/1.4030643 History: Received November 24, 2014; Revised May 15, 2015; Online June 08, 2015

Thermal management is an important aspect for any packaging technology incorporating high power devices. In this paper, we present an integrated microfluidic cooling solution for high power surface mount thin film resistors on liquid crystal polymer (LCP) substrate. High power resistors are mounted on top of a 50.8 μm (2 mil) LCP layer, a coolant can circulate, thanks to a micropump, inside a Duroid micromachined channel beneath the LCP layer in order to take away the generated heat. A thermal model is combined from existing thermal models in literature to predict the overall thermal resistance of the organic heat sink in the case of a moving coolant inside the microfluidic channel. Four sets of microfluidic channels with different thicknesses are fabricated and tested. Temperature measurements of resistors with different power ratings and sizes on top of these channels agree with the model predictions and the simulations in the case of static (nonmoving) and dynamic (moving) distilled (DI) water. With this integrated solution, the case temperature of the 40 W resistor, which is mounted on the 254 μm (10 mil) microchannel, can be cooled down to 121 °C at room temperature while the resistor is dissipating 23.2 W of power; this resistor fails to operate beyond 13.3 W in the absence of fluid circulation. This is, to the best of our knowledge, the best thermal cooling performance ever achieved on multilayer organic substrates.

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References

Wenquan, S., and Tongyi, L., 2008, “High-Speed Mixed-Signal SoC Design for Basestation Application,” IEEE Asia Pacific Conference on Circuits and Systems (APCCAS 2008), Macao, China, Nov. 30-Dec. 3, pp. 1562–1565. [CrossRef]
Ng, R. W. T., Laurent, A., and Sie, B. C., 2011, “Ultra Low Power SOC for Portable Health Monitoring Platforms,” IEEE 13th International Symposium On Integrated Circuits (ISIC), Singapore, Dec. 12–14, pp. 293–296. [CrossRef]
Lyne, K., 2005, “Cellular Handset Integration—SIP vs. SOC and Best Design Practices for SIP,” IEEE Custom Integrated Circuits Conference (CICC), San Jose, CA, Sept. 21, pp. 765–770. [CrossRef]
Sundaram, V., Tummala, R., Wiedenman, B., Liu, F., Markondeya Raj, P., Abothu, I. R., Bhattacharya, S., Varadarajan, M., Bongio, E., and Sherwood, W., 2006, “Recent Advances in Low CTE and High Density System-on-a-Package (SOP) Substrate With Thin Film Component Integration,” 56th IEEE Electronic Components and Technology Conference (ECTC), San Diego, CA, May 30-June 2. [CrossRef]
Lu, H. J., Guo, Y. X., Faeyz, K., Cheng, C. K., and Wei, J., 2009, “Liquid Crystal Polymer (LCP) for Characterization of Millimer-Wave Transmission Lines and Bandpass Filters,” ASME Paper No. IMECE2009-10573. [CrossRef]
Poh, C. H. J., Patterson, C. E., Bhattacharya, S. K., Philips, S. D., Lourenco, N. E., Cressler, J. D., and Papapolymerou, J., 2012, “Packaging Effects of Multiple X-Band SiGe LNAs Embedded in an Organic LCP Substrate,” IEEE Trans. Compon. Packag. Manuf. Technol., 2(8), pp. 1351–1360. [CrossRef]
Miller, A., and Hong, J., 2012, “Cascaded Coupled Line Filter With Reconfigurable Bandwidths Using LCP Multilayer Circuit Technology,” IEEE Trans. Microwave Theory Tech., 60(6), pp. 1577–1586. [CrossRef]
Chung, D. J., Amadjikpe, A. L., and Papapolymerou, J., 2011, “Multilayer Integration of Low-Cost 60-GHz Front-End Transceiver on Organic LCP,” IEEE Antennas Wirel. Propag. Lett., 10, pp. 1329–1332. [CrossRef]
Savrun, E., Nguyen, V., and Gilmore, N., 2004, “High Thermal Conductivity Aluminum Nitride Ceramics for High Power Microwave Windows,” 5th IEEE International Vacuum Electronics Conference (IVEC 2004), Monterey, CA, Apr. 27–29, pp. 45–46. [CrossRef]
Su, Z., Malen, J. A., Freedman, J. P., Davis, R. F., Leach, J. H., and Preble, E. A., 2013, “Dependence of Thermal Conductivities of the AlN Film in the LED Architecture on Surface Roughness and Lattice Mismatch,” ASME Paper No. HT2013-17116. [CrossRef]
Barisich, G. C., Pavlidis, S., Morcillo, C. A. D., Chlieh, O. L., Papapolymerou, J., and Gebara, E., 2013, “An X-Band GaN HEMT Hybrid Power Amplifier With Low-Loss Wilkinson Division on AlN Substrate,” IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems (COMCAS), Tel Aviv, Israel, Oct. 21–23. [CrossRef]
Ling, J. H. L., and Tay, A. A. O., 2014, “A New Accurate Closed-Form Analytical Solution for Junction Temperature of High-Powered Devices,” ASME J. Electron. Packag., 136(1), p. 011007. [CrossRef]
Kandlikar, S. G., 2014, “Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated Circuits,” ASME J. Electron. Packag., 136(2), p. 024001. [CrossRef]
Li, J., and Miyashita, H., 2006, “Post Placement Thermal via Planning for 3D Integrated Circuit,” IEEE Asia Pacific Conference on Circuits and Systems (APCCAS 2006), Singapore, Dec. 4–7, pp. 808–811. [CrossRef]
Mirza, F., Naware, G., Jain, A., and Agonafer, D., 2014, “Effect of Through-Silicon-Via Joule Heating on Device Performance for Low-Powered Mobile Applications,” ASME J. Electron. Packag., 136(4), p. 041008. [CrossRef]
Peters, T. B., McCarthy, M., Allison, J., Dominguez-Espinosa, F. A., Jenicek, D., Kariya, H. A., Staats, W. L., Brisson, J. G., Lang, J. H., and Wang, E. N., 2012, “Design of an Integrated Loop Heat Pipe Air-Cooled Heat Exchanger for High Performance Electronics,” IEEE Trans. Compon. Packag. Manuf. Technol., 2(10), pp. 1637–1648. [CrossRef]
Chougule, S. S., and Sahu, S. K., 2015, “Thermal Performance of Nanofluid Charged Heat Pipe With Phase Change Material for Electronics Cooling,” ASME J. Electron. Packag., 137(2), p. 021004. [CrossRef]
Mudawar, I., 2001, “Assessment of High-Heat-Flux Thermal Management Schemes,” IEEE Trans. Compon. Packag. Technol., 24(2), pp. 122–141. [CrossRef]
Kim, S.-M., and Kim, K.-Y., 2014, “Optimization of a Hybrid Double-Side Jet Impingement Cooling System for High-Power Light Emitting Diodes,” ASME J. Electron. Packag., 136(1), p. 011010. [CrossRef]
Garimella, S. V., Singhal, V., and Liu, D., 2006, “On-Chip Thermal Management With Microchannel Heat Sinks and Integrated Micropumps,” Proc. IEEE, 94(8), pp. 1534–1548. [CrossRef]
Xie, Y., Shen, Z., Zhang, D., and Lan, J., 2014, “Thermal Performance of a Water-Cooled Microchannel Heat Sink With Grooves and Obstacles,” ASME J. Electron. Packag., 136(2), p. 021001. [CrossRef]
Zhang, Y., Dembla, A., Joshi, Y., and Bakir, M., 2012, “3D Stacked Microfluidic Cooling for High Performance 3D ICs,” IEEE 62nd Electronic Components and Technology Conference (ECTC), San Diego, CA, May 29-June 1, pp. 1644–1650. [CrossRef]
Lemtiri Chlieh, O., Morcillo, C. A. D., Pavlidis, S., Khan, W. T., and Papapolymerou, J., 2013, “Integrated Microfluidic Cooling for GaN Devices on Multilayer Organic LCP Substrate,” IEEE MTT-S International Microwave Symposium Digest (IMS), Seattle, WA, June 2–7. [CrossRef]
Jo, B.-H., Van Lerberghe, L. M., Motsegood, K. M., and Beebe, D. J., 2000, “Three-Dimensional Micro-Channel Fabrication in Polydimethylsiloxane (PDMS) Elastomer,” IEEE J. Microelectromech. Syst., 9(1), pp. 76–81. [CrossRef]
Metz, S., Trautmann, A., and Renaud, Ph., 2003, “Polyimide Microfluidic Devices With Integrated Nanoporous Filtration Areas Manufactured by Micromachining and Ion Track Technology,” J. Micromech. Microeng., 14(3), pp. 324–331. [CrossRef]
Lemtiri Chlieh, O., Khan, W. T., and Papapolymerou, J., 2014, “Integrated Microfluidic Cooling of High Power Passive and Active Devices on Multilayer Organic Substrate,” IEEE MTT-S International Microwave Symposium (IMS), Tampa, FL, June 1–6. [CrossRef]
Lemczyk, T. F., Mack, B., Culham, J. R., and Yovanovich, M. M., 1991, “PCB Trace Thermal Analysis and Effective Conductivity,” Seventh Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM VII), Phoenix, AZ, Feb. 12–14, pp. 15–22. [CrossRef]
Albers, J., 1995, “An Exact Recursion Relation Solution for the Steady-State Surface Temperature of a General Multilayer Structure,” IEEE Trans. Compon. Packag. Manuf. Technol. Part A, 18(1), pp. 31–38. [CrossRef]
Lee, S., Song, S., Au, V., and Moran, K. P., 1995, “Constriction/Spreading Resistance Model for Electronics Packaging,” 4th ASME/JSME Thermal Engineering Joint Conference, Maui, HI, Mar. 19–24, Vol. 4, pp. 199–206.
Lee, P. S., Garimella, S. V., and Liu, D., 2005, “Investigation of Heat Transfer in Rectangular Microchannels,” Int. J. Heat Mass Transfer, 48(9), pp. 1688–1704. [CrossRef]
Thirumaleshwar, M., 2009, Fundamentals of Heat & Mass Transfer, Pearson Education, New Delhi, India, Chap. 9, pp. 382–476.
Shah, R. K., and London, A. L., 1978, Laminar Flow Forced Convection in Ducts (Advances in Heat Transfer: Supplement, Vol. 1), Academic, New York.
Smith, A. N., and Nochetto, H., 2014, “Laminar Thermally Developing Flow in Rectangular Channels and Parallel Plates: Uniform Heat Flux,” Heat Mass Transfer J., 50(11), pp. 1627–1637. [CrossRef]
Corcione, M., 2008, “Natural Convection Heat Transfer Above Heated Horizontal Surfaces,” 5th WSEAS International Conference on Heat and Mass Transfer (HMT'08), Acapulco, Mexico, Jan. 25–27, pp. 206–211. http://www.wseas.us/e-library/conferences/2008/mexico/hmt/hmt.pdf
Prasher, R. S., 2001, “Surface Chemistry and Characteristics Based Model for the Thermal Contact Resistance of Fluidic Interstitial Thermal Interface Materials,” ASME J. Heat Transfer, 123(5), pp. 969–975. [CrossRef]
Savija, I., Culham, J. R., and Yovanovich, M. M., 2003, “Effective Thermophysical Properties of Thermal Interface Materials: Part I—Definitions and Models,” ASME Paper No. IPACK2003-35088. [CrossRef]
Khalsa, S., and Subbarayan, G., 2011, “Squeeze Flow Models for Thermal Interface Materials Contained Between Parallel Plates and Plates With Posts,” ASME Paper No. IPACK2011-52170. [CrossRef]
Antonetti, V. W., Whittle, T. D., and Simons, R. E., 1993, “An Approximate Thermal Contact Conductance Correlation,” ASME J. Electron. Packag., 115(1), pp. 131–134. [CrossRef]
Jackson, R. L., Ghaednia, H., Elkady, Y. A., Bhavnani, S. H., and Knight, R. W., 2012, “A Closed-Form Multiscale Thermal Contact Resistance Model,” IEEE Trans. Compon. Packag. Manuf. Technol., 2(7), pp. 1158–1171. [CrossRef]
Samson, E. C., Machiroutu, S. V., Chang, J. Y., Santos, I., Hermerding, J., and Dani, A., 2005, “Interface Material Selection and a Thermal Management Technique in Second-Generation Platforms Built on Intel® Centrino Mobile Technology,” Intel Technol. J., 9(1), pp. 75–86. http://www.intel.com/content/dam/www/public/us/en/documents/research/2005-vol09-iss-1-intel-technology-journal.pdf
Darvin, E., 2012, “Semiconductor and IC Package Thermal Metrics,” Texas Instruments, Dallas, TX, Application Report No. SPRA953B, available at: http://www.ti.com/lit/an/spra953b/spra953b.pdf
Freescale Semiconductor, 2008, “Thermal Analysis of Semiconductor Systems,” Freescale Semiconductor Inc., Chandler, AZ, White Paper No. BASICTHERMALWP/REV 0, see http://cache.freescale.com/files/analog/doc/white_paper/BasicThermalWP.pdf

Figures

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Fig. 1

Two-dimensional (2D) cross section of the multilayer organic structure with heat circulation paths

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Fig. 2

Multilayer model adapted to the microfluidic case study

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Fig. 3

Convective model adapted to the microfluidic case study

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Fig. 4

Flow in rectangular microchannels

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Fig. 5

Variation of the forced convection thermal resistance with (a) channel thickness and (b) channel width

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Fig. 6

Lumped thermal model for the microfluidic multilayer structure

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Fig. 7

comsol 3D model for (a) dynamic case and (b) static case

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Fig. 8

Top view pictures of the high power resistors: (a) 30 W and (b) 40 W

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Fig. 9

Resistors power derating curves

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Fig. 10

Cross section of the laminated multilayer stack-up

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Fig. 11

Package fabrication flow. (1) Double cladded Duroid + 2 bondplies, (2) copper etching from both sides of Duroid, (3) cavity ablating on Duroid and bondplies, (4) double cladded LCP, (5) copper etching from one side of LCP, (6) via drilling, (7) lamination, and (8) final micromachined structure.

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Fig. 12

5 × 3 samples: (a) bottom view (before lamination) and (b) top view (after lamination)

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Fig. 13

Disassembled microfluidic channel

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Fig. 14

Resistors on microfluidic channels: (a) 30 W resistor and (b) 40 W resistor

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Fig. 15

(a) Temperature measurement test bench and (b) picture of the measurement setup

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Fig. 16

Junction-to-ambient thermal resistance comparison between measured data, model, and simulation for (a) static water and (b) dynamic water

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