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Research Papers

Thermo-Fluid-Stress-Deformation Analysis of Two-Layer Microchannels for Cooling Chips With Hot Spots

[+] Author and Article Information
Abas Abdoli

MAIDROC Laboratory,
Department of Mechanical and
Materials Engineering,
Florida International University,
Miami, FL 33174
e-mail: aabdo004@fiu.edu

George S. Dulikravich

MAIDROC Laboratory,
Department of Mechanical and
Materials Engineering,
Florida International University,
Miami, FL 33174
e-mail: dulikrav@fiu.edu

Genesis Vasquez

MAIDROC Laboratory,
Department of Mechanical and
Materials Engineering,
Florida International University,
Miami, FL 33174
e-mail: gvasq007@fiu.edu

Siavash Rastkar

MAIDROC Laboratory,
Department of Mechanical and
Materials Engineering,
Florida International University,
Miami, FL 33174
e-mail: srast002@fiu.edu

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received June 20, 2014; final manuscript received March 2, 2015; published online April 16, 2015. Assoc. Editor: Mehmet Arik.

J. Electron. Packag 137(3), 031003 (Sep 01, 2015) (8 pages) Paper No: EP-14-1061; doi: 10.1115/1.4030005 History: Received June 20, 2014; Revised March 02, 2015; Online April 16, 2015

Two-layer single phase flow microchannels were studied for cooling of electronic chips with a hot spot. A chip with 2.45 × 2.45 mm footprint and a hot spot of 0.5 × 0.5 mm in its center was studied in this research. Two different cases were simulated in which heat fluxes of 1500 W cm−2 and 2000 W cm−2 were applied at the hot spot. Heat flux of 1000 W cm−2 was applied on the rest of the chip. Each microchannel layer had 20 channels with an aspect ratio of 4:1. Direction of the second microchannel layer was rotated 90 deg with respect to the first layer. Fully three-dimensional (3D) conjugate heat transfer analysis was performed to study the heat removal capacity of the proposed two-layer microchannel cooling design for high heat flux chips. In the next step, a linear stress analysis was performed to investigate the effects of thermal stresses applied to the microchannel cooling design due to variations of temperature field. Results showed that two-layer microchannel configuration was capable of removing heat from high heat flux chips with a hot spot.

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Figures

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Fig. 1

Expanded view of two-layer microchannel cooling design

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Fig. 2

Hybrid computational grid with an enlarged view

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Fig. 3

Temperature distribution in case 1 (uniform heat flux of the hot spot was 1500 W cm−2): (a) entire cooling design, (b) top surface of the chip, (c) microchannels, and (d) five slices of the entire model

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Fig. 4

Coolant velocity distribution in case 1 (uniform heat flux of the hot spot is 1500 W cm−2): (a) microchannels and (b) a slice view of velocity contours

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Fig. 5

Temperature distribution in case 2 (uniform heat flux of the hot spot is 2000 W cm−2): (a) entire cooling design, (b) top surface of the chip, (c) microchannels, and (d) five slices of the entire model

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Fig. 6

Velocity distribution in case 2 (uniform heat flux of the hot spot is 2000 W cm−2): (a) microchannels and (b) a slice view of the microchannels

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Fig. 7

Heat flux at the bottom surface of the microchannels: (a) case 1 and (b) case 2

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Fig. 8

Stress distribution for case 1 (uniform heat flux of the hot spot is 1500 W cm−2): (a) entire cooling design, (b) top surface of the chip, (c) microchannels, and (d) five slices of the entire model

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Fig. 9

Stress distribution on case 2 (uniform heat flux of the hot spot is 2000 W cm−2): (a) entire cooling design, (b) the top surface of the chip, (c) microchannels, and (d) five slices of the entire model

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Fig. 10

Displacement distribution: (a) entire cooling design in case 1, (b) five sliced views in case 1, (c) entire cooling design in case 2, and (d) five sliced views in case 2

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