Research Papers

Thermal Performance of Nanofluid Charged Heat Pipe With Phase Change Material for Electronics Cooling

[+] Author and Article Information
Sandesh S. Chougule

Discipline of Mechanical Engineering,
Indian Institute of Technology Indore,
Indore 453446, Madhya Pradesh, India
e-mail: sandesh_chougule@yahoo.com

S. K. Sahu

Assistant Professor
Discipline of Mechanical Engineering,
Indian Institute of Technology Indore
Indore 453446, Madhya Pradesh, India
e-mail: santosh.sahu04@@gmail.com

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received February 22, 2014; final manuscript received October 31, 2014; published online December 3, 2014. Assoc. Editor: Siddharth Bhopte.

J. Electron. Packag 137(2), 021004 (Jun 01, 2015) (7 pages) Paper No: EP-14-1024; doi: 10.1115/1.4028994 History: Received February 22, 2014; Revised October 31, 2014; Online December 03, 2014

The paper reports the thermal performance of a nanofluid (MCNT/water) charged heat pipe with phase change material (PCM) as energy storage material (ESM) for electronic cooling. The adiabatic section of heat pipe is covered by the PCM stored in a container made of acrylic material. Here, paraffin is used as PCM. PCM can absorb and release thermal energy depending upon the fluctuations in the heating load. Tests are conducted to obtain the temperature distributions in PCM during charge/discharge processes. Present study utilizes two different ESM (water and paraffin), different fan speeds and heating powers in the PCM cooling module. The cooling module with heat pipe and paraffin as ESM found to save higher fan power consumption compared to the cooling module that utilities only a heat pipe.

Copyright © 2015 by ASME
Your Session has timed out. Please sign back in to continue.



Grahic Jump Location
Fig. 1

(a) SEM image at magnification of 20,000× of MWCNT particles and (b) photograph of functionalized MCNT–water nanofluid

Grahic Jump Location
Fig. 2

(a) Schematic diagram of heat pipe cooling module test facility and thermocouple location. (b) Photograph of heat pipe cooling module.

Grahic Jump Location
Fig. 3

Temperature growth in charge process for different ESM (a) water, (b) PCM (paraffin), and (c) without ESM

Grahic Jump Location
Fig. 4

Comparison between efficiency curves at different cooling mass flow rate

Grahic Jump Location
Fig. 5

Temperature growth in different ESM for simultaneous charge and discharge process for different heating power: (a) 10 W and (b) 30 W

Grahic Jump Location
Fig. 6

Schematic of thermal resistance–capacitor model for the heat pipe-PCM module

Grahic Jump Location
Fig. 7

Comparison of experimental and simulation values of temperature growth in PCM in charge process




Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In