Research Papers

Modeling and Experimental Study of a Wire Clamp for Wire Bonding

[+] Author and Article Information
Fuliang Wang

State Key Laboratory of High Performance
Complex Manufacturing,
Changsha 410083, China
e-mail: wangfuliang@csu.edu.cn

Dengke Fan

School of Mechanical
and Electrical Engineering,
Central South University,
Changsha 410083, China

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received March 17, 2014; final manuscript received September 25, 2014; published online November 17, 2014. Assoc. Editor: Paul Conway.

J. Electron. Packag 137(1), 011012 (Mar 01, 2015) (6 pages) Paper No: EP-14-1035; doi: 10.1115/1.4028836 History: Received March 17, 2014; Revised September 25, 2014; Online November 17, 2014

A wire clamp is used to grip a gold wire with in 1–2 ms during thermosonic wire bonding. Modern wire bonders require faster and larger opening wire clamps. In order to simplify the design process and find the key parameters affecting the opening of wire clamps, a model analysis based on energy conservation was developed. The relation between geometric parameters and the amplification ratio was obtained. A finite element (FE) model was also developed in order to calculate the amplification ratio and natural frequency. Experiments were carried out in order to confirm the results of these models. Model studies show that the arm length was the major factor affecting the opening of the wire clamp.

Copyright © 2015 by ASME
Topics: Wire , Clamps (Tools)
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Fig. 1

Schematic diagram of a beam-based flexure hinge

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Fig. 2

Wire clamp prototype

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Fig. 3

Half model of wire clamp (a) before and (b) after clamp open

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Fig. 4

Equivalent model of outside elastic beam

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Fig. 5

Deformed shape and von Mises stress distribution of the wire clamp (unit: Pa)

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Fig. 6

Experimental setup to measure the amplification ratio

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Fig. 7

Comparison of clamp opening between analytic, FE model, and experimental results

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Fig. 8

Frequency response of the wire clamp

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Fig. 9

Effect of parameters on amplification ratio

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Fig. 10

Effect of parameters on amplification ratio




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