0
Research Papers

Modeling and Experimental Study of a Wire Clamp for Wire Bonding

[+] Author and Article Information
Fuliang Wang

State Key Laboratory of High Performance
Complex Manufacturing,
Changsha 410083, China
e-mail: wangfuliang@csu.edu.cn

Dengke Fan

School of Mechanical
and Electrical Engineering,
Central South University,
Changsha 410083, China

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received March 17, 2014; final manuscript received September 25, 2014; published online November 17, 2014. Assoc. Editor: Paul Conway.

J. Electron. Packag 137(1), 011012 (Mar 01, 2015) (6 pages) Paper No: EP-14-1035; doi: 10.1115/1.4028836 History: Received March 17, 2014; Revised September 25, 2014; Online November 17, 2014

A wire clamp is used to grip a gold wire with in 1–2 ms during thermosonic wire bonding. Modern wire bonders require faster and larger opening wire clamps. In order to simplify the design process and find the key parameters affecting the opening of wire clamps, a model analysis based on energy conservation was developed. The relation between geometric parameters and the amplification ratio was obtained. A finite element (FE) model was also developed in order to calculate the amplification ratio and natural frequency. Experiments were carried out in order to confirm the results of these models. Model studies show that the arm length was the major factor affecting the opening of the wire clamp.

FIGURES IN THIS ARTICLE
<>
Copyright © 2015 by ASME
Topics: Wire , Clamps (Tools)
Your Session has timed out. Please sign back in to continue.

References

Harman, G. G., 2010, Wire Bonding In Microelectronics (Third Edition), McGraw-Hill, New York.
Wang, F., and Chen, Y., 2013, “Experimental and Modeling Studies of Looping Process for Wire Bonding,” ASME J. Electron. Packag., 135(4), p. 041009. [CrossRef]
Wang, F., Tang, W., Li, J., and Han, L., 2013, “Variable-Length Link-Spring Model for Kink Formation During Wire Bonding,” ASME J. Electron. Packag., 135(4), p. 041004. [CrossRef]
Xu, W., and King, T., 1996, “Flexure Hinges for Piezoactuator Displacement Amplifiers: Flexibility, Accuracy, and Stress Considerations,” Precis. Eng., 19(1), pp. 4–10. [CrossRef]
Nah, S. K., and Zhong, Z. W., 2007, “A Microgripper Using Piezoelectric Actuation for Micro-Object Manipulation,” Sens. Actuators A, 133(1), pp. 218–224. [CrossRef]
Mohd Zubir, M. N., and Shirinzadeh, B., 2009, “Development of a High Precision Flexure-Based Microgripper,” Precis. Eng., 33(4), pp. 362–370. [CrossRef]
Solano, B., and Wood, D., 2007, “Design and Testing of a Polymeric Microgripper for Cell Manipulation,” Microelectron. Eng., 84(5–4), pp. 1219–1222. [CrossRef]
Wierzbicki, R., Houston, K., Heerlein, H., Barth, W., Debski, T., Eisinberg, A., Menciassi, A., Carrozza, M. C., and Dario, P., 2006, “Design and Fabrication of an Electrostatically Driven Microgripper for Blood Vessel Manipulation,” Microelectron. Eng., 83(4–9), pp. 1651–1654. [CrossRef]
Giouroudi, I., Hötzendorfer, H., Kosel, J., Andrijasevic, D., and Brenner, W., 2008, “Development of a Microgripping System for Handling of Microcomponents,” Precis. Eng., 32(2), pp. 148–152. [CrossRef]
Kohl, M., Krevet, B., and Just, E., 2002, “SMA Microgripper System,” Sens. Actuators A, 97–98(5), pp. 646–652. [CrossRef]
Volland, B. E., Heerlein, H., and Rangelow, I. W., 2002, “Electrostatically Driven Microgripper,” Microelectron. Eng., 61–62(7), pp. 1015–1023. [CrossRef]
Li, J., Han, L., Duan, J., and Zhong, J., 2007, “Interface Mechanism of Ultrasonic Flip Chip Bonding,” Appl. Phys. Lett., 90(24), p. 242902. [CrossRef]
Junhui, L., Linggang, L., Luhua, D., Bangke, M., Fuliang, W., and Lei, H., 2011, “Interfacial Microstructures and Thermodynamics of Thermosonic Cu-Wire Bonding,” IEEE Electron Device Lett., 32(12), pp. 1433–1435. [CrossRef]
Dowell, R. K., and Johnson, T. P., 2011, “Shear and Bending Flexibility in Closed-Form Moment Solutions for Continuous Beams and Bridge Structures,” Eng. Struct., 33(12), pp. 3238–3245. [CrossRef]
Li, J., Liu, L., Ma, B., Deng, L., and Han, L., 2011, “Dynamics Features of Cu-Wire Bonding During Overhang Bonding Process,” IEEE Electron Device Lett., 32(11), pp. 1731–1733. [CrossRef]
Li, J.-h., Han, L., Duan, J.-a., and Zhong, J., 2007, “Microstructural Characteristics of Au/Al Bonded Interfaces,” Mater. Charact., 58(2), pp. 103–107. [CrossRef]
Ma, H.-W., Yao, S.-M., Wang, L.-Q., and Zhong, Z., 2006, “Analysis of the Displacement Amplification Ratio of Bridge-Type Flexure Hinge,” Sens. Actuators A, 132(2), pp. 730–736. [CrossRef]
Pai, P. F., and Palazotto, A. N., 1996, “Large-Deformation Analysis of Flexible Beams,” Int. J. Solids Struct., 33(9), pp. 1335–1353. [CrossRef]
Gummadi, L. N. B., and Palazotto, A. N., 1998, “Large Strain Analysis of Beams and Arches Undergoing Large Rotations,” Int. J. Non-Linear Mech., 33(4), pp. 615–645. [CrossRef]
Lobontiu, N., Paine, J. S. N., O'Malley, E., and Samuelson, M., 2002,” Parabolic and Hyperbolic Flexure Hinges: Flexibility, Motion Precision and Stress Characterization Based on Compliance Closed-Form Equations,” Precis. Eng., 26(9), pp. 183–192. [CrossRef]
Pei, X., Yu, J., Zong, G., and Bi, S., 2010, “An Effective Pseudo-Rigid-Body Method for Beam-Based Compliant Mechanisms,” Precis. Eng., 34(4), pp. 634–639. [CrossRef]
Teo, T. J., Chen, I. M., Yang, G., and Lin, W., 2010, “A Generic Approximation Model for Analyzing Large Nonlinear Deflection of Beam-Based Flexure Joints,” Precis. Eng., 34(3), pp. 607–618. [CrossRef]

Figures

Grahic Jump Location
Fig. 1

Schematic diagram of a beam-based flexure hinge

Grahic Jump Location
Fig. 2

Wire clamp prototype

Grahic Jump Location
Fig. 3

Half model of wire clamp (a) before and (b) after clamp open

Grahic Jump Location
Fig. 4

Equivalent model of outside elastic beam

Grahic Jump Location
Fig. 5

Deformed shape and von Mises stress distribution of the wire clamp (unit: Pa)

Grahic Jump Location
Fig. 6

Experimental setup to measure the amplification ratio

Grahic Jump Location
Fig. 7

Comparison of clamp opening between analytic, FE model, and experimental results

Grahic Jump Location
Fig. 8

Frequency response of the wire clamp

Grahic Jump Location
Fig. 9

Effect of parameters on amplification ratio

Grahic Jump Location
Fig. 10

Effect of parameters on amplification ratio

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In