Research Papers

Experimental Characterization of Various Cold Aisle Containment Configurations for Data Centers

[+] Author and Article Information
Vikneshan Sundaralingam

G.W. Woodruff School of
Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: vikneshan@gatech.edu

Vaibhav K. Arghode, Yogendra Joshi

G.W. Woodruff School of
Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332

Wally Phelps

Degree Controls Inc.,
Milford, NH 03055

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received June 20, 2013; final manuscript received September 7, 2014; published online October 7, 2014. Assoc. Editor: Pradip Dutta.

J. Electron. Packag 137(1), 011007 (Oct 07, 2014) (8 pages) Paper No: EP-13-1052; doi: 10.1115/1.4028520 History: Received June 20, 2013; Revised September 07, 2014

The data center industry has experienced significant growth over the last decade, mainly due to the increased use of the internet for our day to day activities such as e-commerce, social media, video streaming, and healthcare. This growth in demand results in higher energy costs, as data centers can be energy intensive facilities. A significant portion of the energy used in data centers is for cooling purposes. Hence, it is one of the important areas of optimization to be addressed to create more efficient data centers. Among the many ways to increase data center efficiencies, air flow management is a key solution to many existing data centers. Fundamentally, there are three main schemes: hot-aisle containment, cold-aisle containment, and exhaust chimney containment. This paper's focus is to experimentally characterize the following cold aisle configurations: open aisle, partially contained aisle, and fully contained aisles. Experimental data presented to evaluate the effectiveness of the different configurations are rack inlet contour plots, tile and rack flow rates, pressure measurements, and server central processing unit (CPU) temperatures.

Copyright © 2015 by ASME
Your Session has timed out. Please sign back in to continue.



Grahic Jump Location
Fig. 1

DCL layout schematic

Grahic Jump Location
Fig. 2

Cold aisle containment system

Grahic Jump Location
Fig. 3

Measurement devices

Grahic Jump Location
Fig. 4

Regions occupied by active servers for partially filled racks

Grahic Jump Location
Fig. 5

RLT rack flow rate calibration results

Grahic Jump Location
Fig. 6

Cold aisle configurations tested

Grahic Jump Location
Fig. 7

Contour slice at rank inlet

Grahic Jump Location
Fig. 8

Rack inlet contour plots for different UP cold aisle configurations

Grahic Jump Location
Fig. 9

Rack inlet contour plots for different OP cold aisle configurations

Grahic Jump Location
Fig. 10

Total tile flow rates

Grahic Jump Location
Fig. 11

Total rack flow rates

Grahic Jump Location
Fig. 12

Cold aisle and plenum pressures

Grahic Jump Location
Fig. 13

CPU temperatures for runs 1–4

Grahic Jump Location
Fig. 14

CPU temperatures for runs 5–8

Grahic Jump Location
Fig. 15

Heat removed by CRACH versus RDHX




Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In