0
Technical Brief

Fabrication of Anodic Aluminum Oxide Template and Copper Nanowire Surface Fastener

[+] Author and Article Information
Hiromasa Teshima

Department of Mechanical Science and Engineering,
Nagoya University,
Furo-cho,
Chikusa-ku, Nagoya 464-8601, Japan
e-mail: teshima.hiromasa@f.mbox.nagoya-u.ac.jp

Kohei Kojima

Department of Mechanical Science and Engineering, Nagoya University,
Furo-cho,
Chikusa-ku, Nagoya 464-8601, Japan
e-mail: kojima.kouhei@f.mbox.nagoya-u.ac.jp

Yang Ju

Department of Mechanical Science and Engineering,
Nagoya University,
Furo-cho,
Chikusa-ku, Nagoya 464-8601, Japan
e-mail: ju@mech.nagoya-u.ac.jp

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received December 2, 2013; final manuscript received August 14, 2014; published online September 19, 2014. Assoc. Editor: Nils Høivik.

J. Electron. Packag 136(4), 044501 (Sep 19, 2014) (4 pages) Paper No: EP-13-1132; doi: 10.1115/1.4028316 History: Received December 02, 2013; Revised August 14, 2014

Through-hole anodic aluminum oxide (AAO) was fabricated by two steps anodization method. The pore diameter of the AAO was 40 nm. Cu nanowire array was prepared using the fabricated AAO as a template by electrochemical deposition. The mechanical and electrical performances of Cu nanowire surface fastener (NSF) were realized by the interconnection of Cu nanowire arrays. The shear and normal bonding strengths for the Cu NSF with 40 nm diameter nanowires were 3.38 × 10−3 and 2.46 × 10−3 N/cm2, respectively, and the parasitic resistance of it was approximately 22.5 Ω · cm2.

FIGURES IN THIS ARTICLE
<>
Copyright © 2014 by ASME
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Fig. 1

Schematic of fabricating the AAO: (a) a first step anodization, (b) wet etching of AAO fabricated in a first step anodization, (c) a second step anodization, (d) extending the pores, (e) sputtering Au film, (f) dissolving aluminium substrate, and (g) dissolving barrier layer and extending pores

Grahic Jump Location
Fig. 2

Schematic of characterization of Cu NSF: (a) electric measurement and (b) bonding strength measurement

Grahic Jump Location
Fig. 3

Image of aluminum foil after a second anodization step: (a) SEM image in the top view, (b) AFM image, (c) cross sections of AFM image: line A, (d) cross sections of AFM image: line B, and (e) SEM image in the cross view

Grahic Jump Location
Fig. 4

SEM images of Cu nanowires after the etching: (a) 40 nm, (b) 60 nm, and (c) 80 nm

Grahic Jump Location
Fig. 5

Results of electric and strength measurement: (a) relationship between voltage and current and (b) relationship between bonding strength and diameter of nanowire

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In