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Research Papers

Development of a Mini Heat Sink Model With Homogeneous Heat Transfer Capability

[+] Author and Article Information
J. F. Zhou

Jiangsu Key Laboratory of Process Enhancement
and New Energy Equipment Technology,
College of Mechanical and Power Engineering,
Nanjing Tech University,
30 Puzhu Road,
Nanjing, Jiangsu 211816, China
e-mail: zhoujianfeng@njtech.edu.cn

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received July 24, 2013; final manuscript received March 26, 2014; published online April 29, 2014. Assoc. Editor: Gongnan Xie.

J. Electron. Packag 136(2), 021004 (Apr 29, 2014) (8 pages) Paper No: EP-13-1076; doi: 10.1115/1.4027338 History: Received July 24, 2013; Revised March 26, 2014

A model of mini heat sink with microchannels was developed to obtain homogeneous heat transfer capability. The channels are constructed in the form of eight triangular arrays based on a square substrate. Air is sucked from the periphery to the center of the substrate by a vacuum pump and heat transferred from the bottom surface of substrate can be removed by air flowing through channels. Corresponding to the given heat transfer power and the target temperature of substrate, the relationship among length, width and depth of channel was analytically established. By numerical simulation, local pressure drops at the joint of channels and air duct are first obtained and then the dimensions of each channel in a triangular array can be determined one by one. The investigation reveals that the widths of channels will vary with their depths, lengths and pressure differences between two ends. Since all channels are required for the same cooling power, the homogeneous heat transfer of heat sink can be realized. By assembling a certain number of heat sink units, the area of dissipation of heat sink can be enlarged and contoured to fit close to heating surface.

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Figures

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Fig. 1

Substrate with channels

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Fig. 2

Assembly of heat sink units

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Fig. 3

Control volume in heat sink model: (a) structure of mini heat sink, and (b) heat transfer unit

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Fig. 4

Solving process for microchannel width

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Fig. 5

Arrangement of microchannels in substrate

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Fig. 6

Control volume of four-way joint for calculating pressure drop

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Fig. 7

Calculation process of channel dimensions

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Fig. 8

Models of parallel arranged channels in heat sink: (a) an array of channels with same sectional dimensions and (b) an array of channels with different sectional dimensions

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Fig. 9

Model of four-way joint

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Fig. 10

Pressure drop at four-way joint when air duct inlet velocity is 1 m·s−1

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Fig. 11

Pressure drop at four-way joint when air duct inlet velocity is 2 m·s−1

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