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Research Papers

HDPE Matrix Composites Filled With Ca4La6(SiO4)4(PO4)2O2 for Microwave Substrate Applications

[+] Author and Article Information
Dhanesh Thomas

Materials Science and Technology Division,
National Institute for Interdisciplinary Science and Technology,
CSIR,
Trivandrum 695019, India;
Department of Physics,
Government College,
Kasaragod 671123, India

Mailadil T. Sebastian

Materials Science and Technology Division,
National Institute for Interdisciplinary Science and Technology,
CSIR,
Trivandrum 695019, India
e-mail: mailadils@yahoo.com

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received September 27, 2012; final manuscript received March 4, 2014; published online May 5, 2014. Assoc. Editor: Kaustubh Nagarkar.

J. Electron. Packag 136(3), 031002 (May 05, 2014) (5 pages) Paper No: EP-12-1085; doi: 10.1115/1.4027089 History: Received September 27, 2012; Revised March 04, 2014

Polymer–ceramic composites have been prepared by dispersing Ca4La6(SiO4)4(PO4)2O2 (CLSP) ceramic filler in high density polyethylene (HDPE) matrix through melt mixing. Scanning electron micrographs reveal the extent of filler dispersion. The dielectric properties at 1 MHz and 5 GHz have been investigated as a function of filler content. The relative permittivity increases with filler loading, maintaining a low dielectric loss. The composite with highest filler loading of 0.4 volume fraction shows a relative permittivity of 5.1 and dielectric loss of 2.3 × 10−3 at 5 GHz. Experimentally observed values of relative permittivity at 5 GHz have been compared with the values calculated using various theoretical models. Both the coefficient of linear thermal expansion and tensile strength have been observed to decrease with filler loading, reaching a minimum value of 117 ppm/ °C and 20.7 MPa, respectively, at 0.4 volume fraction of filler. The composite with maximum filler loading of 0.4 volume fraction shows the highest thermal conductivity (TC) and is 1.2 W m−1 K−1.

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References

Figures

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Fig. 1

Powder XRD pattern and SEM image (in the inset) of CLSP filler

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Fig. 2

SEM images of fractured surfaces of (a) HDPE-0.2 Vf CLSP and (b) HDPE-0.4 Vf CLSP

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Fig. 3

Dependence of microwave dielectric properties on filler concentration

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Fig. 4

Comparison of theoretical and experimental values of εr at 5 GHz

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Fig. 5

Temperature variation of εr at 1 MHz

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Fig. 6

Variation of linear CTE and TC with filler loading

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Fig. 7

Tensile strength as a function of filler concentration

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