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Technical Brief

A Note on the Normalized Approach to Simulating Moisture Diffusion in a Multimaterial System Under Transient Thermal Conditions Using ansys 14 and 14.5

[+] Author and Article Information
Dapeng Liu

Mechanical Engineering,
State University of New York at Binghamton,
P.O. Box 6000,
Binghamton, NY 13902
e-mail: dliu5@binghamton.edu

Seungbae Park

Mechanical Engineering,
State University of New York at Binghamton,
P.O. Box 6000,
Binghamton, NY 13902
e-mail: sbpark@binghamton.edu

PLANE238, SOLID239, and SOLID240 (version 14.5 or later).

PLANE223, SOLID226, and SOLID227 (version 14 or later).

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received August 23, 2013; final manuscript received January 29, 2014; published online May 5, 2014. Assoc. Editor: Shidong Li.

J. Electron. Packag 136(3), 034501 (May 05, 2014) (3 pages) Paper No: EP-13-1094; doi: 10.1115/1.4026661 History: Received August 23, 2013; Revised January 29, 2014

Moisture can have significant effects on the performance and reliability of electronic components. Accurately simulating moisture diffusion is important for designers and manufacturers to obtain a realistic reliability evaluation. Beginning with version 14, ansys is capable of simulating diffusion and related behaviors, such as hygroscopic swelling, with newly developed elements. However, a normalized approach is still required to deal with the discontinuity of concentrations at the material boundaries, and normalization of the moisture concentration in transient thermal conditions is tricky. Case studies have shown that normalizing the moisture concentration with respect to a time- or temperature-dependent material property will lead to erroneous results. This paper re-addresses the issues of performing diffusion simulations under transient thermal conditions and more general anisothermal conditions (temporally and spatially), and suggests an easy-to-use approach to cope with the limitations of the current version for users in the electronic packaging industry.

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References

Figures

Grahic Jump Location
Fig. 1

Geometry and boundary conditions for the case study (Ta = 25 + t/60 °C, Pv = 3207 Pa)

Grahic Jump Location
Fig. 2

Moisture concentration in a bimaterial specimen subject to transient loading conditions (t = 1800 s)

Grahic Jump Location
Fig. 3

Moisture concentration in a bimaterial specimen subject to transient loading conditions (t = 3600 s)

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