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Research Papers

Hygrothermal Behavior of Advanced Polymers Above Water Boiling Temperatures

[+] Author and Article Information
Changsoo Jang

Department of Mechanical Engineering,
University of Maryland,
College Park, MD 20742

Bongtae Han

Fellow ASME
Department of Mechanical Engineering,
University of Maryland,
College Park, MD 20742
e-mail: bthan@umd.edu

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received August 18, 2013; final manuscript received January 24, 2014; published online February 18, 2014. Assoc. Editor: Shidong Li.

J. Electron. Packag 136(1), 011013 (Feb 18, 2014) (6 pages) Paper No: EP-13-1091; doi: 10.1115/1.4026626 History: Received August 18, 2013; Revised January 24, 2014

Hygroscopic and thermal expansion behavior of advanced polymers is investigated when subjected to combined high temperature and moisture conditions. An enhanced experimental–numerical hybrid procedure is proposed to overcome the limitations of the existing methods when used at temperatures above the water boiling temperature. The proposed procedure is implemented to measure the hygrothermal strains of three epoxy molding compounds and a no-filler underfill over a wide range of temperatures including temperatures beyond the water boiling temperature. The effects of moisture content on the glass transition temperature (Tg) and coefficient of thermal expansion (CTE) are evaluated from the measurement data. A formulation to predict the Tg change as a function of moisture content is also presented.

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References

Jang, C., Han, B., and Yoon, S., 2010, “Comprehensive Moisture Diffusion Characteristics of Epoxy Molding Compounds Over Solder Reflow Process Temperature,” IEEE Trans. Compon. Packag. Technol., 33(4), pp. 809–818. [CrossRef]
Kelly, F. N., and Bueche, F., 1961, “Viscosity and Glass Temperature Relations for Polymer-Diluent Systems,” J. Polym. Sci., 50(154), pp. 549–556. [CrossRef]
Kaimin, I. F., Apinis, A. P., and Galvanovskii, A. Ya., 1975, “The Effect of the Moisture Content on the Transition Temperatures of Polycaproamide,” Vysokomol. Soyed., A17(1), pp. 41–45. [CrossRef]
Browning, C. E., 1978, “The Mechanisms of Elevated Temperature Property Losses in High Performance Structural Epoxy Resin Matrix Materials After Exposures to High Humidity Environments,” Polym. Eng. Sci., 18(1), pp. 16–24. [CrossRef]
Smith, L. S. A., and Schmitz, V., 1988, “The Effect of Water on the Glass Transition Temperature of Poly(Methyl Methacrylate),” Polymer, 29(10), pp. 1871–1878. [CrossRef]
Zhang, Z., Britt, I. J., and Tung, M. A., 1999, “Water Absorption in EVOH Films and Its Influence on Glass Transition Temperature,” J. Polym. Sci., Part B: Polym. Phys., 37(7), pp. 691–699. [CrossRef]
Baschek, G., Hartwig, G., and Zahradnik, F., 1999, “Effect of Water Absorption in Polymers at Low and High Temperatures,” Polymer, 40(12), pp. 3433–3441. [CrossRef]
Yoon, Y., Jang, C., and Han, B., 2008, “Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading,” ASME J. Electron. Packag., 130(2), p. 024502. [CrossRef]
Berry, B. S., and Pritchet, W. C., 1984, “Bending Cantilever Method for the Study of Moisture Swelling in Polymers,” IBM J. Res. Dev., 28(6), pp. 662–667. [CrossRef]
Xiao, G. Z., and Shanahan, M. E. R., 1998, “Swelling of DGEBA/DDA Epoxy Resin During Hygrothermal Ageing,” Polymer, 39(14), pp. 3253–3260. [CrossRef]
Buchhold, R., Nakladal, A., Gerlach, V., Sahre, K., Eichhorn, K.-J., and Müller, M., 1998, “Reduction of Mechanical Stress in Micromachined Components Caused by Humidity-Induced Volume Expansion of Polymer Layers,” Microsyst. Technol., 5(1), pp. 3–12. [CrossRef]
Ardebelli, H., Wong, E. H., and Pecht, M., 2003, “Hygroscopic Swelling and Sorption Characteristics of Epoxy Molding Compounds Used in Electronic Packaging,” IEEE Trans. Compon. Packag. Technol., 26(1), pp. 206–214. [CrossRef]
Stellrecht, E., Han, B., and Pecht, M., 2004, “Characterization of Hygroscopic Swelling Behavior of Mold Compounds and Plastic Packages,” IEEE Trans. Compon. Packag. Technol., 27(3), pp. 499–506. [CrossRef]
Jang, C., Yoon, S., and Han, B., 2010, “Measurement of the Hygroscopic Swelling Coefficient of Thin Film Polymers Used in Semiconductor Packaging,” IEEE Trans. Compon. Packag. Technol., 33(2), pp. 340–346. [CrossRef]
Jang, C., Park, S., Yoon, S., and Han, B., 2008, “Advanced Thermal-Moisture Analogy Scheme for an Isothermal Moisture Diffusion Problem,” ASME J. Electron. Packag., 130(1), p. 011004. [CrossRef]
Foreman, J., Kelsey, M., and Widmann, G., 2000, “Factors Affecting the Accuracy of TMA Measurements,” Limitations of Test Methods for Plastics, J. S. Perado, ed., ASTM, West Conshohocken, PA, pp. 181–196.
Perepechko, I. I., 1981, An Introduction to Polymer Physics, Mir Publishers, Moscow, Chap. 4.
Adamson, M. J., 1980, “Thermal Expansion and Swelling of Cured Epoxy Resin Used in Graphite/Epoxy Composite Materials,” J. Mater. Sci., 15(7), pp. 1736–1745. [CrossRef]
Gordon, M., and Taylor, J. S., 1952, “Ideal Copolymers and the Second-Order Transitions of Synthetic Rubbers. I. Non-Crystalline Copolymers,” J. Appl. Chem., 2(9), pp. 493–500. [CrossRef]
Williams, M. L., Landel, R. F., and Ferry, J. D., 1955, “The Temperature Dependence of Relaxation Mechanisms in Amorphous Polymers and Other Glass-Forming Liquids,” J. Am. Chem. Soc., 77(14), pp. 3701–3707. [CrossRef]

Figures

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Fig. 1

Illustration of strain curves obtained at each step

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Fig. 2

Moisture weight loss of EMC A at various ramp rates

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Fig. 3

Moisture weight loss in step 4 at the ramp rate of 30 °C/min

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Fig. 4

Strain evolutions of EMC A: (a) TMA result of dry specimen (step 2), (b) TMA results of wet specimen before and after compensation (steps 4 and 5), and (c) final hygrothermal strain (step 6)

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Fig. 5

DIC result of EMC A used in hygroscopic strain measurement (step 3)

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Fig. 6

Strain evolutions of (a) EMC B, (b) EMC C, and (c) no-filler underfill

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Fig. 7

CTE (a) below Tg and (b) above Tg of test materials as a function of moisture content

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Fig. 8

Tg as a function of moisture content (symbols: experimental data, lines: predictions)

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