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Research Papers

Thermal Resistance Analysis of Sn-Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications

[+] Author and Article Information
Rui Zhang

State Key Laboratory of New Ceramics
and Fine Processing,
School of Materials Science and Engineering,
Tsinghua University,
Beijing 100084, China

Jian Cai

Institute of Microelectronics,
Tsinghua University,
Tsinghua National Laboratory for Information
Science and Technology,
Beijing 100084, China

Qian Wang, Jingwei Li, Yang Hu

Institute of Microelectronics,
Tsinghua University,
Beijing 100084, China

Hongda Du

City Key Laboratory of Thermal
Management Engineering and Materials,
Graduate School at Shenzhen,
Tsinghua University,
Shenzhen City,
Guangdong Province 518055, China

Liangliang Li

State Key Laboratory of New Ceramics
and Fine Processing,
School of Materials Science and Engineering,
Tsinghua University,
Beijing 100084, China
e-mail: liliangliang@mail.tsinghua.edu.cn

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received June 4, 2013; final manuscript received January 26, 2014; published online February 18, 2014. Assoc. Editor: Gamal Refai-Ahmed.

J. Electron. Packag 136(1), 011012 (Feb 18, 2014) (5 pages) Paper No: EP-13-1045; doi: 10.1115/1.4026616 History: Received June 04, 2013; Revised January 26, 2014

To promote heat dissipation in power electronics, we investigated the thermal conduction performance of Sn-Bi solder paste between two Cu plates. We measured the thermal resistance of Sn-Bi solder paste used as thermal interface material (TIM) by laser flash technique, and a thermal resistance less than 5 mm2 K/W was achieved for the Sn-Bi TIM. The Sn-Bi solder also showed a good reliability in terms of thermal resistance after thermal cycling, indicating that it can be a promising candidate for the TIM used for power electronics applications. In addition, we estimated the contact thermal resistance at the interface between the Sn-Bi solder and the Cu plate with the assistance of scanning acoustic microscopy. The experimental data showed that Sn-Bi solder paste could be a promising adhesive material used to attach power modules especially with a large size on the heat sink.

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References

Figures

Grahic Jump Location
Fig. 1

Actual temperature–time curve during thermal cycling

Grahic Jump Location
Fig. 2

SAM images of the samples listed in Table 1. (a) ID 2 before thermal cycling; (b) ID 4 before thermal cycling; (c) ID 7 before thermal cycling; (d) ID 8 before thermal cycling; (e) ID 1 after thermal cycling; (f) ID 2 after thermal cycling; (g) ID 3 after thermal cycling; (h) ID 4 after thermal cycling; (i) ID 5 after thermal cycling; (j) ID 6 after thermal cycling; (k) ID 7 after thermal cycling; (l) ID 8 after thermal cycling; (m) ID 9 after thermal cycling; and (n) ID 10 after thermal cycling.

Grahic Jump Location
Fig. 3

(a) Optical image of the Sn-Bi layer between two Cu plates and (b) thermal conduction model of TIM for the Sn-Bi layer with a defect

Grahic Jump Location
Fig. 4

Dependence of RTIM on d and x: (a) top view of the fitting plane and (b) side view of the fitting plane

Tables

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