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Research Papers

Thermal Resistance Analysis of Sn-Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications

[+] Author and Article Information
Rui Zhang

State Key Laboratory of New Ceramics
and Fine Processing,
School of Materials Science and Engineering,
Tsinghua University,
Beijing 100084, China

Jian Cai

Institute of Microelectronics,
Tsinghua University,
Tsinghua National Laboratory for Information
Science and Technology,
Beijing 100084, China

Qian Wang, Jingwei Li, Yang Hu

Institute of Microelectronics,
Tsinghua University,
Beijing 100084, China

Hongda Du

City Key Laboratory of Thermal
Management Engineering and Materials,
Graduate School at Shenzhen,
Tsinghua University,
Shenzhen City,
Guangdong Province 518055, China

Liangliang Li

State Key Laboratory of New Ceramics
and Fine Processing,
School of Materials Science and Engineering,
Tsinghua University,
Beijing 100084, China
e-mail: liliangliang@mail.tsinghua.edu.cn

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received June 4, 2013; final manuscript received January 26, 2014; published online February 18, 2014. Assoc. Editor: Gamal Refai-Ahmed.

J. Electron. Packag 136(1), 011012 (Feb 18, 2014) (5 pages) Paper No: EP-13-1045; doi: 10.1115/1.4026616 History: Received June 04, 2013; Revised January 26, 2014

To promote heat dissipation in power electronics, we investigated the thermal conduction performance of Sn-Bi solder paste between two Cu plates. We measured the thermal resistance of Sn-Bi solder paste used as thermal interface material (TIM) by laser flash technique, and a thermal resistance less than 5 mm2 K/W was achieved for the Sn-Bi TIM. The Sn-Bi solder also showed a good reliability in terms of thermal resistance after thermal cycling, indicating that it can be a promising candidate for the TIM used for power electronics applications. In addition, we estimated the contact thermal resistance at the interface between the Sn-Bi solder and the Cu plate with the assistance of scanning acoustic microscopy. The experimental data showed that Sn-Bi solder paste could be a promising adhesive material used to attach power modules especially with a large size on the heat sink.

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References

Sarvar, F., Whalley, D. C., and Conway, P. P., 2006, “Thermal Interface Materials—A Review of the State of the Art,” First Electronic System Integration Technology Conference, Dresden, Germany, September 5–7, pp. 1292–1302. [CrossRef]
Prasher, R., 2006, “Thermal Interface Materials: Historical Perspective, Status, and Future Directions,” Proc. IEEE, 94(8), pp. 1571–1586. [CrossRef]
Otiaba, K. C., Ekere, N. N., Bhatti, R. S., Mallik, S., Alam, M. O., and Amalu, E. H., 2011, “Thermal Interface Materials for Automotive Electronic Control Unit: Trends, Technology and R&D Challenges,” Microelectron. Reliab., 51(12), pp. 2031–2043. [CrossRef]
McNamara, A. J., Joshi, Y., and Zhang, Z. M., 2012, “Characterization of Nanostructured Thermal Interface Materials—A Review,” Int. J. Therm. Sci., 62(SI), pp. 2–11. [CrossRef]
Chung, D. D. L., 2001, “Thermal Interface Materials,” J. Mater. Eng. Perform., 10(1), pp. 56–59. [CrossRef]
Narumanchi, S., Mihalic, M., Kelly, K., and Eesley, G., 2008, “Thermal Interface Materials for Power Electronics Applications,” 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM 2008), Orlando, FL, May 28–31, pp. 395–404. [CrossRef]
Yu, H., Li, L., and Zhang, Y., 2012, “Silver Nanoparticle-Based Thermal Interface Materials With Ultra-Low Thermal Resistance for Power Electronics Applications,” Scr. Mater., 66(11), pp. 931–934. [CrossRef]
Yang, C., Wong, C. P., and Yuen, M. M. F., 2013, “Printed Electrically Conductive Composites: Conductive Filler Designs and Surface Engineering,” J. Mater. Chem. C, 1(26), pp. 4052–4069. [CrossRef]
Chen, G., Cao, Y., Mei, Y., Han, D., and Lu, G. Q., 2012, “Pressure-Assisted Low-Temperature Sintering of Nanosilver Paste for 5 × 5-mm2 Chip Attachment,” IEEE Trans. Compon. Packag. Manuf. Technol., 2(11), pp. 1759–1767. [CrossRef]
Chen, G., Han, D., Mei, Y. H., Cao, X., Wang, T., Chen, X., and Lu, G. Q., 2012, “Transient Thermal Performance of IGBT Power Modules Attached by Low-Temperature Sintered Nanosilver,” IEEE Trans. Dev. Mater. Reliab., 12(1), pp. 124–132. [CrossRef]
Yan, J., Zou, G., Wu, A. P., Ren, J., Yan, J., Hu, A., and Zhou, Y., 2012, “Pressureless Bonding Process Using Ag Nanoparticle Paste for Flexible Electronics Packaging,” Scr. Mater., 66(8), pp. 582–585. [CrossRef]
Buttay, C., Masson, A., Li, J., Johnson, M. C., Lazar, M., Raynaud, C., and Morel, H., 2011, “Die Attach of Power Devices Using Silver Sintering-Bonding Process Optimization and Characterization,” IMAPS International Conference on High Temperature Electronics Network (HiTEN 2011), Oxford, UK, July 18–20, pp. 84–90.
Liang, Q., Yao, X., Wang, W., Liu, Y., and Wong, C. P., 2011, “A Three-Dimensional Vertically Aligned Functionalized Multilayer Graphene Architecture: An Approach for Graphene-Based Thermal Interfacial Materials,” ACS Nano, 5(3), pp. 2392–2401. [CrossRef] [PubMed]
Jagannadham, K., 2011, “Influence of Laser and Thermal Treatment on the Thermal Conductivity of In-Graphene Composites,” J. Appl. Phys., 110(9), p. 094907. [CrossRef]
Wang, H., Feng, J. Y., Hu, X. J., and Ng, K. M., 2010, “Reducing Thermal Contact Resistance Using A Bilayer Aligned CNT Thermal Interface Material,” Chem. Eng. Sci., 65(3), pp. 1101–1108. [CrossRef]
Yu, A., Ramesh, P., Itkis, M. E., Bekyarova, E., and Haddon, R. C., 2007, “Graphite Nanoplatelet-Epoxy Composite Thermal Interface Materials,” J. Phys. Chem. C, 111(21), pp. 7565–7569. [CrossRef]
Cross, R., Cola, B. A., Fisher, T., Xu, X., Gall, K., and Graham, S., 2010, “A Metallization and Bonding Approach for High Performance Carbon Nanotube Thermal Interface Materials,” Nanotechnology, 21(44), p. 445705. [CrossRef] [PubMed]
Aoyagi, Y., and Chung, D. D. L., 2008, “Antioxidant-Based Phase-Change Thermal Interface Materials With High Thermal Stability,” J. Electron. Mater., 37(4), pp. 448–461. [CrossRef]
Yu, H., Li, L., Kido, T., Xi, G., Xu, G., and Guo, F., 2012, “Thermal and Insulating Properties of Epoxy/Aluminum Nitride Composites Used for Thermal Interface Material,” J. Appl. Polym. Sci., 124(1), pp. 669–677. [CrossRef]
Sahoo, N. G., Rana, S., Cho, J. W., Li, L., and Chan, S. H., 2010, “Polymer Nanocomposites Based on Functionalized Carbon Nanotubes,” Prog. Polym. Sci., 35(7), pp. 837–867. [CrossRef]
Terao, T., Zhi, C., Bando, Y., Mitome, M., Tang, C., and Golberg, D., 2010, “Alignment of Boron Nitride Nanotubes in Polymeric Composite Films for Thermal Conductivity Improvement,” J. Phys. Chem. C, 114(10), pp. 4340–4344. [CrossRef]
Deppisch, C., Fitzgerald, T., Raman, A., Hua, F., Zhang, C., Liu, P., and Miller, M., 2006, “The Material Optimization and Reliability Characterization of an Indium-Solder Thermal Interface Material for CPU Packaging,” JOM, 58(6), pp. 67–74. [CrossRef]
Chaowasakoo, T., Ng, T. H., Songninluck, J., Stern, M. B., and Ankireddi, S., 2009, “Indium Solder as A Thermal Interface Material Using Fluxless Bonding Technology,” 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2009), San Jose, CA, March 15–10, pp. 180–185. [CrossRef]
Too, S. S., Touzelbaev, M., Khan, M., Master, R., Diep, J., and Keok, K. H., 2009, “Indium Thermal Interface Material Development for Microprocessors,” 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2009), San Jose, CA, March 15–10, pp. 186–192. [CrossRef]
Bai, J. G., Zhang, Z. Z., Lu, G.-Q., and Hasselman, D. P. H., 2005, “Measurement of Solder/Copper Interfacial Thermal Resistance by the Flash Technique,” Int. J. Thermophys., 26(5), pp. 1607–1615. [CrossRef]
Kirschman, R. K., Sokolowski, W. M., and Kolawa, E. A., 2001, “Die Attachment for −120 °C to 20 °C Thermal Cycling of Microelectronics for Future Mars Rovers—An Overview,” ASME J. Electron. Packag., 123(2), pp. 105–111. [CrossRef]
Van Heerden, D., Rude, T., Newson, J., Knio, O., Weihs, T. P., and Gailus, D. W., 2004, “Thermal Behavior of A Soldered Cu–Si Interface,” 20th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2004), San Jose, CA, March 9–11, pp. 46–49. [CrossRef]
Stinson-Bagby, K., Huff, D., Katsis, D., Van Wyk, D., and Lu, G. Q., 2004, “Thermal Performance and Microstructure of Lead Versus Lead-Free Solder Die Attach Interface in Power Device Packages,” 2004 IEEE International Symposium on Electronics and the Environment, Scottsdale, AZ, May 10–13, pp. 27–32. [CrossRef]
Hu, X., Jiang, L., and Goodson, K. E., 2004, “Thermal Characterization of Eutectic Alloy Thermal Interface Materials With Void-Like Inclusions,” 20th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2004), San Jose, CA, March 9–11, pp. 98–103. [CrossRef]
Dutchak, Y. I., Osipenko, V. P., and Panasyuk, P. V., 1968, “Thermal Conductivity of Sn-Bi Alloys in the Solid and Liquid States,” Soviet Phys. J., 11(10), pp. 145–147. [CrossRef]
Chiu, C. P., Maveety, J. G., and Tran, Q. A., 2002, “Characterization of Solder Interfaces Using Laser Flash Metrology,” Microelectron. Reliab., 42(1), pp. 93–100. [CrossRef]
Chase, M. W., 1998, NIST—JANAF Thermochemical Tables (Journal of Physical and Chemical Reference Data Monograph No. 9), 4th ed., American Chemical Society, Washington, DC.
Hua, F., Mei, Z., and Glazer, J., 1998, “Eutectic Sn-Bi as An Alternative to Pb-Free Solders,” 48th IEEE Electronic Components and Technology Conference (ECTC), Seattle, WA, May 25–28, pp. 277–283. [CrossRef]
Ousten, J. P., and KhatirZ., 2011, “Investigations of Thermal Interfaces Aging Under Thermal Cycling Conditions for Power Electronics Applications,” Microelectron. Reliab., 51(9–11), pp. 1830–1835. [CrossRef]
“ImageJ: Image Processing and Analysis in Java,” 2004, National Institutes of Health, Washington, DC, http://rsb.info.nih.gov/ij/
Smith, J. H., and Woodhouse, J., 2000, “The Tribology of Rosin,” J. Mech. Phys. Solids, 48(8), pp. 1633–1681. [CrossRef]
Lemmon, E. W., and Jacobsen, R. T., 2004, “Viscosity and Thermal Conductivity Equations for Nitrogen, Oxygen, Argon, and Air,” Int. J. Thermophys., 25(1), pp. 21–69. [CrossRef]
Pritchard, L. S., Acarnley, P. P., and Johnson, C. M., 2004, “Effective Thermal Conductivity of Porous Solder Layers,” IEEE Trans. Compon. Packag. Technol., 27(2), pp. 259–267. [CrossRef]
Fleischer, A. S., Chang, L. H., and Johnson, B. C., 2006, “The Effect of Die Attach Voiding on the Thermal Resistance of Chip Level Packages,” Microelectron. Reliab., 46(5–6), pp. 794–804. [CrossRef]
Ciampolini, L., Ciappa, M., Malberti, P., Regli, P., and Fichtner, W., 1999, “Modelling Thermal Effects of Large Contiguous Voids in Solder Joints,” Microelectron. J., 30(11), pp. 1115–1123. [CrossRef]

Figures

Grahic Jump Location
Fig. 1

Actual temperature–time curve during thermal cycling

Grahic Jump Location
Fig. 2

SAM images of the samples listed in Table 1. (a) ID 2 before thermal cycling; (b) ID 4 before thermal cycling; (c) ID 7 before thermal cycling; (d) ID 8 before thermal cycling; (e) ID 1 after thermal cycling; (f) ID 2 after thermal cycling; (g) ID 3 after thermal cycling; (h) ID 4 after thermal cycling; (i) ID 5 after thermal cycling; (j) ID 6 after thermal cycling; (k) ID 7 after thermal cycling; (l) ID 8 after thermal cycling; (m) ID 9 after thermal cycling; and (n) ID 10 after thermal cycling.

Grahic Jump Location
Fig. 3

(a) Optical image of the Sn-Bi layer between two Cu plates and (b) thermal conduction model of TIM for the Sn-Bi layer with a defect

Grahic Jump Location
Fig. 4

Dependence of RTIM on d and x: (a) top view of the fitting plane and (b) side view of the fitting plane

Tables

Errata

Discussions

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