Technical Brief

Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink

[+] Author and Article Information
Bengt Sundén

Division of Heat Transfer,
Department of Energy Sciences,
Lund University,
P.O. Box 118,
Lund SE-22100, Sweden
e-mail: bengt.sunden@energy.lth.se

Gongnan Xie

Engineering Simulation and Aerospace
Computing (ESAC),
The Key Laboratory of Contemporary Design
and Integrated Manufacturing Technology,
Northwestern Polytechnical University,
P.O. Box 552,
Xi'an, Shaanxi 710072, China
e-mail: xgn@nwpu.edu.cn

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received June 29, 2013; final manuscript received January 12, 2014; published online April 29, 2014. Assoc. Editor: Gary Miller.

J. Electron. Packag 136(2), 024501 (Apr 29, 2014) (5 pages) Paper No: EP-13-1058; doi: 10.1115/1.4026538 History: Received June 29, 2013; Revised January 12, 2014

This short communication addresses a numerical investigation of the thermal behavior of an electronic unit. The unit consists of several parallel planes and on the top and bottom planes heat is generated by a number of electronic chips. The heat is transported by conduction through plastic and copper-invar layers. Finally, the heat is rejected by a forced air stream in the center of the unit. The channel system for the cooling air is designed as an offset strip fin surface. A three-dimensional numerical method based on a thermal resistance or conductance network has been developed. The grid points on the cooling air side are staggered compared to the grid points in the solid materials. Details of the numerical method as well as some temperature distributions on the chip planes are provided.

Copyright © 2014 by ASME
Your Session has timed out. Please sign back in to continue.


Asako, Y., and Faghri, M., 1994, “Parametric Study of Turbulent Three-Dimensional Heat Transfer of Arrays of Heated Blocks Encountered in Electronic Equipment,” Int. J. Heat Mass Transfer, 37(3), pp. 469–478. [CrossRef]
Faghri, M., and Asako, Y., 1994, “Prediction of Turbulent Three-Dimensional Heat Transfer of Heated Blocks Using Low-Reynolds Number Two-Equation Model,” Numer. Heat Transfer, Part A, 26(1), pp. 87–101. [CrossRef]
Ashiwake, N., Nakayama, W., Daikoku, T., and Kobayashi, F., 1983, “Forced Convective Heat Transfer Form LSI Packages in An Air-Cooled Wiring Card Array,” ASME Heat Transfer in Electronic Equipment, Boston, MA, November 13–18 (ASME Heat Transfer Symposia Series, HTD Vol. 28), pp. 35–42.
Nelson, R. D., Sommerfeld, S., and Bar-Cohen, A., 1992, “Thermal Performance of an Integral Immersion Cooled Multichip Module Package,” Microelectronics and Computer Technology Corporation, Austin, TX, Technical Report No. HVE-253-92.
Kim, Y. J., Joshi, Y. K., Fedorov, A. G., Lee, Y. J., and Lim, S. K., 2010, “Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional Integrated Circuits With Nonuniform Heat Flux,” ASME J. Heat Transfer, 132(4), p. 041009. [CrossRef]
Mizunuma, H., Lu, Y. C., and Yang, C. L., 2011, “Thermal Modeling and Analysis for 3-D ICs With Integrated Microchannel Cooling,” IEEE Comput.-Aided Des. Integr. Circuits Syst., 30(9), pp. 1293–1306. [CrossRef]
Jain, A., Jones, R. E., Chatterjee, R., and Pozder, S., 2010, “Analytical and Numerical Modeling of the Thermal Performance of Three-Dimensional Integrated Circuits,” IEEE Compon., Compon. Packag. Technol., 33(1), pp. 56–63. [CrossRef]
Choobinech, L., and Jain, A., 2012, “Analytical Solution for Steady-State and Transient Temperature Fields in Vertically Stacked 3-D Integrated Circuits,” IEEE Compon. Packag. Manuf. Technol., 2(12), pp. 2031–2039. [CrossRef]
Choobinech, L., and Jain, A., 2013, “Determination of Temperature Distribution in Three-Dimensional Integrated Circuits (3D ICs) With Unequally-Sized Die,” Appl. Therm. Eng., 56(1–2), pp. 176–184. [CrossRef]
Venkatadri, V., Sammakia, B., Srihari, K., and Santos, D., 2011, “A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems,” ASME J. Electron. Packag., 133(4), p. 040011. [CrossRef]
Xie, X. L., Tao, W. Q., and He, Y. L., 2007, “Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink,” ASME J. Electron. Packag., 129(3), pp. 247–255. [CrossRef]
Xie, G. N., Liu, J., Zhang, W. H., and Sunden, B., 2012, “Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling,” ASME J. Electron. Packag., 134(4), p. 041010. [CrossRef]
Arif, A. F. M., Zubair, S. M., and Pashah, S., 2012, “Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications,” ASME J. Electron. Packag., 134(4), p. 041005. [CrossRef]
Wieting, A. R., 1975, “Empirical Correlations for Heat Transfer and Flow Friction Characteristics of Rectangular Offset Fin Heat Exchangers,” ASME J. Heat Transfer, 97, pp. 488–490. [CrossRef]
Manglik, R. M., and Bergles, A. E., 1990, “The Thermal-Hydraulic Design of The Rectangular Offset Strip Fin Compact Heat Exchangers,” Compact Heat Exchangers, R. K.Shah, A. D.Kraus, and D.Metzger, eds., Hemisphere Publ. Corp., Washington, DC, pp. 123–149.


Grahic Jump Location
Fig. 1

Principal sketch of an air-cooled chassi

Grahic Jump Location
Fig. 2

(a) Sketch of the considered electronic unit and the cooling system and (b) thermal resistance or conductance network

Grahic Jump Location
Fig. 3

Offset strip fin insert

Grahic Jump Location
Fig. 4

Coordinate system shown on a chip plane

Grahic Jump Location
Fig. 6

Staggered grid arrangement

Grahic Jump Location
Fig. 9

Temperature distribution, upper plane

Grahic Jump Location
Fig. 10

Temperature distribution, lower plane




Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In