Research Papers

Optimization of a Hybrid Double-Side Jet Impingement Cooling System for High-Power Light Emitting Diodes

[+] Author and Article Information
Sun-Min Kim

Department of Mechanical Engineering,
Graduate School of Inha University,
253 Yonghyun-Dong,
Nam-Gu, Incheon 402-751, South Korea
e-mail: sunmin@inha.edu

Kwang-Yong Kim

Fellow ASME
Department of Mechanical Engineering,
Inha University,
253 Yonghyun-Dong,
Nam-Gu, Incheon 402-751, South Korea
e-mail: kykim@inha.ac.kr

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received June 26, 2013; final manuscript received January 8, 2014; published online February 14, 2014. Assoc. Editor: Mehmet Arik.

J. Electron. Packag 136(1), 011010 (Feb 14, 2014) (7 pages) Paper No: EP-13-1054; doi: 10.1115/1.4026536 History: Received June 26, 2013; Revised January 08, 2014

Optimization of a hybrid double-side jet impingement cooling system for high-power light emitting diodes (LEDs) was performed using a hybrid multi-objective evolutionary approach and three-dimensional numerical analysis for steady incompressible laminar flow and conjugate heat transfer using Navier–Stokes equations. For optimization, two design variables, i.e., ratios of the diameter of jet holes and the distance from the exit of upper impinging hole to chips to thickness of substrate were chosen out of the various geometric parameters affecting the performance of the cooling system. To evaluate cooling performance and pressure loss of the system, two objective functions, viz., the ratio of the maximum temperature to average temperature on the chips and pressure coefficient, were selected. Surrogate modeling of the objective functions was performed using response surface approximation. The Pareto-optimal solutions were obtained using a multi-objective evolutionary algorithm, and performances of three representative Pareto-optimal designs were discussed compared to a reference design. In the optimal designs, higher level of uniform cooling was generally achieved with higher pressure coefficient. The Pareto-sensitivity analysis between the objective function and design variable was also performed.

Copyright © 2014 by ASME
Your Session has timed out. Please sign back in to continue.



Grahic Jump Location
Fig. 1

Schematic diagram of hybrid double-side jet cooling system (reference design, α = 1.613, β = 2.419)

Grahic Jump Location
Fig. 2

Computational domain and boundary conditions for hybrid double-side jet cooling

Grahic Jump Location
Fig. 3

An example of computational grid: (a) lateral view; (b) top view

Grahic Jump Location
Fig. 4

Grid independency test; temperature distribution along the x-axis on the line 1 in Fig. 3

Grahic Jump Location
Fig. 5

Validation of numerical results using experimental data [11]

Grahic Jump Location
Fig. 6

The effects of the design variables on each objective function

Grahic Jump Location
Fig. 7

Pareto-optimal front with representative PODs and their corresponding Navier–Stokes calculations

Grahic Jump Location
Fig. 8

Pareto-optimal sensitivities of design variables (normalized) over the Pareto-optimal front

Grahic Jump Location
Fig. 9

Distributions of temperature on the chips: (a) POD-A; (b) POD-C

Grahic Jump Location
Fig. 10

Velocity vectors on midplane of the cooling system: (a) POD-A; (b) POD-C




Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In