Research Papers

A Compact Modeling Approach to Enhance Collaborative Design of Thermal-Fluid Systems

[+] Author and Article Information
Jason Stafford

Bell Labs,
Thermal Management Research Group,
Alcatel-Lucent, Dublin, Ireland
e-mail: jason.stafford@alcatel-lucent.com

David Newport, Ronan Grimes

Stokes Institute,
University of Limerick,
Limerick, Ireland

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received April 10, 2013; final manuscript received November 10, 2013; published online December 16, 2013. Assoc. Editor: Pradip Dutta.

J. Electron. Packag 136(1), 011004 (Dec 16, 2013) (13 pages) Paper No: EP-13-1026; doi: 10.1115/1.4026051 History: Received April 10, 2013; Revised November 10, 2013

This paper presents an approach for reducing detailed numerical models of electronic equipment into compact thermal-fluid models. These compact models have been created using network analogies representing mass, momentum and energy transport to reduce computational demand, preserve manufacturer intellectual property, and enable software independent exchange of information between supplier and integrator. A strategic approach is demonstrated for a steady state case from reduction to model integration within a global environment. The compact model is robust to boundary condition variation by developing a boundary condition response matrix for the network layout. A practical example of electronic equipment cooled naturally in air is presented. Solution times were reduced from ∼100 to ∼10−3 CPU hours when using the compact model. Nodal information was predicted with O(10%) accuracy compared to detailed solutions. For parametric design studies, the reduced model can provide 1800 solutions in the same time required to run a single detailed numerical simulation. The information generated by the reduction process also enhances collaborative design by providing the equipment integrator with ordered initial conditions for the equipment in the optimization of the global design. Sensitivity of the compact model to spatial variations on the boundary node faces has also been assessed. Overall, the compact modeling approach developed extends the use of compact models beyond preliminary design and into detailed phases of the product design lifecycle.

Copyright © 2014 by ASME
Your Session has timed out. Please sign back in to continue.



Grahic Jump Location
Fig. 1

(a) Multiscale and multilevel modeling within the typical design lifecycle (route 1) and proposed approach to detailed product design stages (route 2). Adapted from Ref. [2]. (b) Reduction strategy for the proposed compact modeling approach.

Grahic Jump Location
Fig. 2

Optimization routine to minimize the difference between detailed and compact model solutions

Grahic Jump Location
Fig. 3

Integration of a compact model within a global modeling environment

Grahic Jump Location
Fig. 4

Exterior (a) and interior (b) temperature distributions of a complex thermal-fluid system that is a naturally cooled enclosure containing electronic devices

Grahic Jump Location
Fig. 5

Simplification of exterior features on the detailed numerical model of equipment (for the application of boundary conditions)

Grahic Jump Location
Fig. 6

Contrasting temperature distributions for two different boundary conditions in the defined set (Table 2)

Grahic Jump Location
Fig. 7

The compact model layout for the current prototype

Grahic Jump Location
Fig. 8

Variation of a compact model conductance link over the range of boundary conditions

Grahic Jump Location
Fig. 9

The contribution of boundary conditions to the variance of compact model conductances

Grahic Jump Location
Fig. 10

Improvements to the boundary condition response matrix through the inclusion of additional reduction trials in Table 5

Grahic Jump Location
Fig. 11

The boundary condition response matrix

Grahic Jump Location
Fig. 12

The contribution of boundary conditions to the internal temperature distribution of the electronic equipment

Grahic Jump Location
Fig. 13

A synthetic distribution applied to dominant external nodes

Grahic Jump Location
Fig. 14

Exterior surface temperature distributions predicted using (a) a full detailed model and (b) an integrated compact model of the electronic equipment

Grahic Jump Location
Fig. 15

Temperature fields in an XY plane for (a) a full detailed model and (b) an integrated compact model of the electronic equipment

Grahic Jump Location
Fig. 16

Temperature fields in an YZ plane for (a) a full detailed model and (b) an integrated compact model of the electronic equipment




Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In