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Research Papers

Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes

[+] Author and Article Information
Chaoran Yang, Fubin Song

Department of Mechanical Engineering,
Hong Kong University of Science and Technology,
Clear Water Bay,
Kowloon, Hong Kong

S. W. Ricky Lee

Department of Mechanical Engineering,
Hong Kong University of Science and Technology,
Clear Water Bay,
Kowloon, Hong Kong e-mail: rickylee@ust.hk

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received February 5, 2012; final manuscript received October 5, 2013; published online November 28, 2013. Assoc. Editor: Bongtae Han.

J. Electron. Packag 136(1), 011003 (Nov 28, 2013) (7 pages) Paper No: EP-12-1017; doi: 10.1115/1.4025915 History: Received February 05, 2012; Revised October 05, 2013

SnCuNi is one of the most common ternary intermetallic compounds formed in the Sn-based solder joint, and its formation and properties can be greatly influenced by the amount of Ni. Ni can participate in the interfacial reaction and diffuse into the intermetallic compound layer from either the solder or from the pad. In this research, comparative studies of different SnCuNi intermetallic compounds were conducted using two kinds of SnCuNi solders with organic solderability preservatives pad finish and a SnCu solder with electroless nickel/immersion gold pad finish. In the former case, Ni can only diffuse into the intermetallic compound from the solder matrix, while in the latter the Ni is only from the metallization layer on the Cu base. Scanning electron microscopy and transmission electron microscopy were employed to inspect the morphologies and interfacial microstructures of the intermetallic compounds. The thermal aging test was conducted to investigate their growth behavior under elevated temperature conditions. Mechanical strength after different aging hours was also evaluated via high speed ball pull test.

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References

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Song, F., Lee, S. W. R., Newman, K., Clark, S., and Sykes, B., 2007, “Comparison of Joint Strength and Fracture Energy of Lead-Free Solder Balls in High Speed Ball Shear/Pull Tests and Their Correlation With Board Level Drop Test,” 9th Electronics Packaging Technology Conference (EPTC 2007), Singarpore, December 10–12, pp. 450–458. [CrossRef]

Figures

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Fig. 1

Reflow temperature profile

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Fig. 2

Morphology and element analysis of different SnCuNi IMC layers: (a) Sn0.7Cu0.05Ni + OSP [9], (b) Sn0.7Cu1.0Ni + OSP [9], and (c) Sn0.7Cu + ENIG

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Fig. 3

Interface analysis of the SnCuNi IMC: (a) Sn0.7Cu1.0Ni + OSP [9] and (b) Sn0.7Cu + EING

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Fig. 4

IMC Growth of SnCuNi subject to thermal aging: (a) Sn0.7Cu0.05Ni + OSP [9], (b) Sn0.7Cu1.0Ni + OSP [9], and (c) Sn0.7Cu + ENIG

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Fig. 5

Typical failure modes of ball pull test

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Fig. 6

Ball pull test results: (a) Sn0.7Cu0.05Ni + OSP [9], (b) Sn0.7Cu1.0Ni + OSP [9], and (c) Sn0.7Cu + ENIG

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Fig. 7

Comparison of ball pull strength of brittle failure

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