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Research Papers

Thermal Performance of a Water-Cooled Microchannel Heat Sink With Grooves and Obstacles

[+] Author and Article Information
Yonghui Xie

School of Energy and Power Engineering,
Xi’an Jiaotong University,
Xi’an, Shaanxi Province 710049, China
e-mail: yhxie@mail.xjtu.edu.cn

Zhongyang Shen

School of Energy and Power Engineering,
Xi’an Jiaotong University,
Xi’an, Shaanxi Province 710049, China
e-mail: jiafei911207@stu.xjtu.edu.cn

Di Zhang

Associate Professor
School of Energy and Power Engineering,
Xi’an Jiaotong University,
Xi’an, Shaanxi Province 710049, China;
Key Laboratory of Thermo-Fluid Science
and Engineering,
Ministry of Education,
Xi’an Jiaotong University,
Xi’an, Shaanxi Province 710049, China
e-mail: zhang_di@mail.xjtu.edu.cn

Jibing Lan

School of Energy and Power Engineering,
Xi’an Jiaotong University,
Xi’an, Shaanxi Province 710049, China
e-mail: jibinglan@stu.xjtu.edu.cn

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received June 2, 2013; final manuscript received October 2, 2013; published online April 29, 2014. Assoc. Editor: Gongnan Xie.

J. Electron. Packag 136(2), 021001 (Apr 29, 2014) (8 pages) Paper No: EP-13-1044; doi: 10.1115/1.4025757 History: Received June 02, 2013; Revised October 02, 2013

With the rapid development of microelectromechanical systems (MEMS) in IT industry, the heat flux in microchannel has reached a high level which demands preferable cooling technology. Water cooling has become a favor cooling approach in electronic microdevices due to better thermal performance than air cooling method. In the present paper, thermal performance in microchannels with grooves and obstacles are investigated numerically. The height and width of the rectangular microchannel are 200 and 50 μm, respectively. As a simple modification of dimple/protrusion, the groove/obstacle diameter is 100 μm and the depth is 20 μm. Different arrangements of grooves and obstacles are considered on Reynolds range of 100–900. The numerical results show that groove/obstacle structure is effective for cooling enhancement in microchannel. Among the cases in this research, the normalized Nusselt number Nu/Nu0 is within the range of 1.446–26.19, while the pressure penalty f/f0 has a much larger range from 0.86 to 110.18 depending on specific orientation. Field synergy analysis and performance evaluation plot are adopted to discuss the mechanism of heat transfer enhancement and energy saving performance integrating the pumping performance. From the viewpoint of energy saving, groove on single surface (case 1) has the best performance. Furthermore, performances of grooved microchannels are compared with that of dimpled microchannels which were discussed in the author’s previous research. The results indicate grooved microchannels have larger range of both Nu/Nu0 and f/f0 and some grooved cases possess high TP than dimpled microchannels.

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Figures

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Fig. 1

Schematic diagrams of: (a) overall view of microchannel and groove arrangement, (b) cross section view of grooves/obstacles, and (c) minimum calculation domain of all cases

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Fig. 2

Coordinate system and details of the computational domain: case 2

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Fig. 3

Nu/Nu0 variations with Reynolds number

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Fig. 4

f/f0 variations with Reynolds number

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Fig. 5

Comparisons of the increase of form loss and decrease of friction loss

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Fig. 6

Streamlines and temperature contour on the middle span of microchannel when Re = 500: (a) case 1, (b) case 2, (c) case 3, (d) case 4, (e) case 5, and (f) case 6

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Fig. 7

Performance evaluation plot of grooved and dimpled cases

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Fig. 8

Field synergy angel [ave cos(θ)] for different cases

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Fig. 9

Computational domain of dimpled structure

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