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Research Papers

Experimental and Modeling Studies of Looping Process for Wire Bonding

[+] Author and Article Information
Fuliang Wang

e-mail: wangfuliang@csu.edu.cn

Yun Chen

State Key Laboratory of High
Performance Complex Manufacturing,
School of Mechanical and Electrical Engineering,
Central South University,
Changsha 410083, China

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received July 16, 2013; final manuscript received September 17, 2013; published online November 18, 2013. Assoc. Editor: Yi-Shao Lai.

J. Electron. Packag 135(4), 041009 (Nov 18, 2013) (9 pages) Paper No: EP-13-1070; doi: 10.1115/1.4025667 History: Received July 16, 2013; Revised September 17, 2013

Looping is one of the key technologies for modern thermosonic wire bonders, and it has been affected by many interacting factors. In this study, the wire looping process was observed with a high-speed camera, and the evolution of wire profiles during looping and the capillary trace were obtained through experiments. A dynamic finite element (FE) model was developed to learn the details of the looping process, where real capillary geometry dimensions, capillary trace, diameter of bonded ball and the gold wire material were used, and the friction force and air tension force were considered. The simulated profiles were compared with those of the experiment. Using the verified FE model, the effects of material properties, capillary parameters, and capillary traces on the looping process were studied, and the relationships between the final profiles and parameters were discussed.

Copyright © 2013 by ASME
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References

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Figures

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Fig. 1

High-speed camera images of the looping process

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Fig. 3

Wire profile corresponding to the capillary at points B, C, D, E, and F

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Fig. 4

The wire looping model

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Fig. 5

Geometry of the capillary

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Fig. 6

2D FE model of the kink-forming process

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Fig. 7

Evolution of wire profiles during looping

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Fig. 8

Comparisons of wire profiles when capillary moves (a) to point B, (b) toward point E, and (c) to point F

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Fig. 9

Predicted effective plastic strain distribution on the wire when the capillary is at point B

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Fig. 10

Predicted effective plastic strain distribution on the final wire loop

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Fig. 11

3D FE model of looping process

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Fig. 12

Comparisons between 3D model and 2D model

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Fig. 13

Effects of yield stress on configuration of kinks

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Fig. 14

Effects of yield stress on the final wire profiles

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Fig. 15

Effects of the elastic modulus on the final wire profiles

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Fig. 16

Effects of the tangent modulus on the final wire profiles

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Fig. 17

Effects of friction on the final wire profiles

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Fig. 18

Necking of the wire for a capillary inner-hole size of 28 μm

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Fig. 19

Effects of the capillary inner-hole size on the final profiles

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Fig. 20

Effects of the reverse motion parameter (RMP) on the capillary traces

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Fig. 21

Effects of the RMP on the final profiles

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Fig. 22

Effects of the kink height parameter (KHP) on the capillary traces

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Fig. 23

Effects of the KHP on the final profiles

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