Research Papers

Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method

[+] Author and Article Information
Tong An

College of Mechanical Engineering and Applied Electronics Technology,
Beijing University of Technology,
Beijing 100124, China

Wenhui Zhu

Packaging Technology Research Institute,
Tianshui Hua Tian Technology Co. Ltd.,
Tianshui 741000, China

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received March 6, 2013; final manuscript received August 26, 2013; published online November 5, 2013. Assoc. Editor: Susan Lu.

J. Electron. Packag 135(4), 041007 (Nov 05, 2013) (6 pages) Paper No: EP-13-1018; doi: 10.1115/1.4025597 History: Received March 06, 2013; Revised August 26, 2013

A design of experiment (DOE) methodology based on numerical simulation is presented to improve thermal fatigue reliability of multirow quad flat nonlead (QFN) packages. In this method, the influences of material properties, structural geometries, and temperature cycling profiles on thermal fatigue reliability are evaluated, a L27(38) orthogonal array is built based on Taguchi method to figure out optimized factor combination design for promoting thermal fatigue reliability. Analysis of variance (ANOVA) is carried out to examine the influence of factors on the thermal fatigue reliability and to find the significant factors. Anand constitutive model is adopted to describe the viscoplastic behavior of lead-free solder Sn3.0Ag0.5Cu. The stress and strain in solder joints under temperature cycling are studied by 3D finite element (FE) model. The modified Coffin–Manson model is employed to predict the fatigue life of solder joints. Results indicate that the coefficients of thermal expansion (CTE) of printed circuit board (PCB), the height of solder joint, and CTE of epoxy molding compound (EMC) have critical influence on thermal fatigue life of solder joints. The fatigue life of multirow QFN package with original design is 767 cycles, which can be substantially improved by 5.43 times to 4165 cycles after the optimized factor combination design based on the presented method.

Copyright © 2013 by ASME
Your Session has timed out. Please sign back in to continue.



Grahic Jump Location
Fig. 1

Schematic of dual-row QFN package. (a) The bottom view and (b) the top view without EMC.

Grahic Jump Location
Fig. 3

The convergence of FE mesh

Grahic Jump Location
Fig. 4

The equivalent plastic strain of solder joint in dual-row QFN package

Grahic Jump Location
Fig. 5

QFN solder joint cracking failure

Grahic Jump Location
Fig. 6

History of equivalent plastic strain

Grahic Jump Location
Fig. 7

History of von Mises stress

Grahic Jump Location
Fig. 8

History of nonlinear strain energy density

Grahic Jump Location
Fig. 9

Stress–strain hysteretic curve

Grahic Jump Location
Fig. 10

Equivalent plastic strain increment and accumulated nonlinear strain energy density per cycle

Grahic Jump Location
Fig. 11

Average effect response for S/N




Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In