0
Journal of Electronic Packaging | Volume 135 | Issue 4 | research-article
Research Papers

Variable-Length Link-Spring Model for Kink Formation During Wire Bonding

[+] Author and Article Information
Fuliang Wang

e-mail: wangfuliang@csu.edu.cn

Lei Han

State Key Laboratory of High Performance
Complex Manufacturing,
Changsha 410083, China;School of Mechanical and Electrical Engineering,
Central South University,
Changsha 410083, China

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received June 5, 2012; final manuscript received July 13, 2013; published online September 19, 2013. Assoc. Editor: Kaustubh Nagarkar.

J. Electron. Packag 135(4), 041004 (Sep 19, 2013) (6 pages) Paper No: EP-12-1061; doi: 10.1115/1.4025308 History: Received June 05, 2012; Revised July 13, 2013
Article
References
Figures
Citing Articles

Kinks have a strong influence on the structural performance of wire bonds. In this study, a variable-length link-spring model has been developed to better understand kink formation. In this model, a gold wire was decomposed into segments that were represented by a link and a torsional spring. One end of the gold wire was fixed, and the other end was free. The friction and air tension forces at the wire ends were considered a function of the capillary position, and the wire segments and moment balance equations were added at the free end as the wire length increased. By using this model, the wire profile, moment, and curvature diagrams at the reverse motion stage were obtained to study the dynamical kink formation and wire-length increasing processes. The analysis result was verified experimentally. Good agreement is obtained between the analytical and the experimental wire profiles. This study indicates that a moment magnitude of several hundred mN·μm is required to form a kink, and the wire profile is the result of the residual curvature and the instantaneous bending moment.
FIGURES IN THIS ARTICLE
<>
Copyright © 2013 by ASME
Topics: Wire , Springs , Deformation
Your Session has timed out. Please sign back in to continue.

References

1
Kung, H. K., Sun, Y. P., Lee, J. N., and Chen, H. S., 2008, “A Method to Determine the Sweep Resistance of Wire Bonds for Microelectronic Packaging,” Microelectron. Eng., 85(9), pp. 1902–1909. [CrossRef]
2
Shu, B., 1992, “Wire Bond Development for High-Pincount Surface-Mount,” Proceedings 42nd Electronic Components and Technology Conference ('92 ECTC), San Diego, May 18–20, pp. 890–898. [CrossRef]
3
Groover, R., Shu, W. K., and Lee, S. S., 1994, “Wire Bond Loop Profile Development for Fine Pitch-Long Wire Assembly,” IEEE Trans. Semicond. Manuf., 7(3), pp. 393–399. [CrossRef]
4
Seuntjens., J., Lu, Z. P., Emily, R., Tok, C. W., Wulff, F., and San Sanda Aung, A. S. K., 1999, “Development of New Ultra-High Stiffness Gold Bonding Wire,” available at: www.utilisegold.com/assets/file/rs_archive/AW99_paper.PDF
5
Saraswati, E., Phyu, T., D.Stephan, F. W.Wulff, and C. D.Breach, A. D. R. M. C., 2004, “Looping Behaviour of Gold Ballbonding Wire,” Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004), Singapore, December 8–10, pp. 723–728. [CrossRef]
6
Ohno, Y., Ohzeki, Y., Aso, T., and Kitamura, O., 1992, “Factors Governing the Loop Profile in Au Bonding Wire,” Proceedings 42nd Electronic Components and Technology Conference ('92 ECTC), San Diego, CA, May 18–20, pp. 899–902. [CrossRef]
7
Tay, A. A. O., Seah, B. C., and Ong, S. H., 1997, “Finite Element Simulation of Wire Looping During Wirebonding,” 1997 Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference (InterPack'97), Kohala Coast, HI, June 15–19, Vol. 1, pp. 399–406.
8
Ng, B. H., Tay, A. A. O., and Ong, S. H., 2002, “Three Dimensional Finite Element Simulation of Wire Looping Process in Wirebonding,” Proceedings 4th Electronics Packaging Technology Conference (EPTC 2002), Singapore, December 10–12, pp. 334–337. [CrossRef]
9
Liu, D. S., and Chao, Y. C., 2003, “Effects of Dopant, Temperature, and Strain Rate on the Mechanical Properties of Micrometer Gold-Bonding Wire,” J. Electron. Mater., 32(3), pp. 159–165. [CrossRef]
10
Liu, D. S., Chao, Y. C., and Wang, C. H., 2004, “Study of Wire Bonding Looping Formation in the Electronic Packaging Process Using the Three-Dimensional Finite Element Method,” Finite Elem. Anal. Design, 40(3), pp. 263–286. [CrossRef]
11
Lo, Y. L., Ho, T. L., Chen, J. L., Lee, R. S., and Chen, T. C., 2001, “Linkage-Spring Model in Analyzing Wirebonding Loops,” IEEE Trans. Compon. Packag. Technol., 24(3), pp. 450–456. [CrossRef]
12
Lo, Y. L., Chen, T. C., and Ho, T. L., 2001, “Design in Triangle-Profiles and T-Profiles of a Wirebond Using a Linkage-Spring Model,” IEEE Trans. Compon. Packag. Technol., 24(3), pp. 457–467. [CrossRef]
13
Lo, Y. L., and Tsao, C. C., 2002, “Wirebond Profiles Characterized by a Modified Linkage-Spring Model Which Includes a Looping Speed Factor,” Microelectron. Reliab., 42(2), pp. 285–291. [CrossRef]
14
Wang, F., Chen, Y., and Han, L., 2012, “Experiment Study of Dynamic Looping Process for Thermosonic Wire Bonding,” Microelectron. Reliab., 52(6), pp. 1105–1111. [CrossRef]
15
Chucheepsakul, S., Buncharoen, S., and Huang, T., 1995, “Elastica of Simple Variable-Arc-Length Beam Subjected to End Moment,” J. Eng. Mech., 121(7), pp. 767–772. [CrossRef]
16
Athisakul, C., and Chucheepsakul, S., 2008, “Effect of Inclination on Bending of Variable-Arc-Length Beams Subjected to Uniform Self-Weight,” Eng. Struct., 30(4), pp. 902–908. [CrossRef]
17
Plaut, R. H., Dillard, D. A., and Borum, A. D., 2011, “Collapse of Heavy Cantilevered Elastica With Frictional Internal Support,” ASME J. Appl. Mech., 78(4), p. 041011. [CrossRef]
18
Humer, A., and Irschik, H., 2011, “Large Deformation and Stability of an Extensible Elastica With an Unknown Length,” Int. J. Solids Struct., 48(9), pp. 1301–1310. [CrossRef]
19
Humer, A., 2011, “Elliptic Integral Solution of the Extensible Elastica With a Variable Length Under a Concentrated Force,” Acta Mech., 222(3–4), pp. 209–233. [CrossRef]
20
Pulngern, T., Halling, M. W., and Chucheepsakul, S., 2005, “Large Deflections of Variable-Arc-Length Beams Under Uniform Self Weight: Analytical and Experimental,” Struct. Eng. Mech., 19, pp. 413–423. [CrossRef]
21
F.L.Wang, Y., C., and Lei, H., 2012, “Experiment Study of Dynamic Looping Process for Thermosonic Wire Bonding,” Microelectron. Reliab., 52, pp. 1105–1111. [CrossRef]
22
Tay, A. A. O., Yeo, K. S., Wu, J. H., and Lim, T. B., 1995, “Wirebond Deformation During Molding of IC Packages,” ASME J. Electron. Packag., 117(1), pp. 14–19. [CrossRef]

Figures

Grahic Jump Location
Fig. 1

Wire-length increase and kink formation processes

+Wire-length increase and kink formation processes
View Large  |  Save Figure  |  Download Slide (.ppt)
Wire-length increase and kink formation processes
Grahic Jump Location
Fig. 2

Schematic of variable-length link-spring model

+Schematic of variable-length link-spring model
View Large  |  Save Figure  |  Download Slide (.ppt)
Schematic of variable-length link-spring model
Grahic Jump Location
Fig. 3

Relation between M and Δθ [11]

+Relation between M and Δθ [11]
View Large  |  Save Figure  |  Download Slide (.ppt)
Relation between M and Δθ [11]
Grahic Jump Location
Fig. 4

Wire profiles at different capillary positions

+Wire profiles at different capillary positions
View Large  |  Save Figure  |  Download Slide (.ppt)
Wire profiles at different capillary positions
Grahic Jump Location
Fig. 5

Images at four positions from the experiment

+Images at four positions from the experiment
View Large  |  Save Figure  |  Download Slide (.ppt)
Images at four positions from the experiment
Grahic Jump Location
Fig. 6

Comparison of loop profiles between the experimental and the analysis results

+Comparison of loop profiles between the experimental and the analysis results
View Large  |  Save Figure  |  Download Slide (.ppt)
Comparison of loop profiles between the experimental and the analysis results
Grahic Jump Location
Fig. 7

Moment and curvature distribution along the wire (−55 μm RM)

+Moment and curvature distribution along the wire (−55 μm RM)
View Large  |  Save Figure  |  Download Slide (.ppt)
Moment and curvature distribution along the wire (−55 μm RM)
Grahic Jump Location
Fig. 8

Moment and curvature distribution along the wire (−155 μm RM)

+Moment and curvature distribution along the wire (−155 μm RM)
View Large  |  Save Figure  |  Download Slide (.ppt)
Moment and curvature distribution along the wire (−155 μm RM)
Grahic Jump Location
Fig. 9

Moment and curvature distribution along the wire (−411.6 μm RM)

+Moment and curvature distribution along the wire (−411.6 μm RM)
View Large  |  Save Figure  |  Download Slide (.ppt)
Moment and curvature distribution along the wire (−411.6 μm RM)

Tables

Errata

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Development of Impacting Fatigue Test Device of Stranded Wires Helical Springs
International Conference on Information Technology and Management Engineering (ITME 2011)
Experimental Research of Dynamic Parameters of Stranded-Wire Helical Springs under Impact Load
International Conference on Mechanical Engineering and Technology (ICMET-London 2011)
Volumetric Self Organizing Feature Map for Modeling Deformable Solids
Intelligent Engineering Systems Through Artificial Neural Networks, Volume 17
Stress Concentration Factors in Multiple Row Joints
Structural Shear Joints> Chapter 17
Likelihood Assessment of Wire-to-Wire Shorts Causing Uncommanded RCS Firing while the Orbiter Is Docked at the ISS (PSAM-0019)
Proceedings of the Eighth International Conference on Probabilistic Safety Assessment & Management (PSAM)
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
This site uses cookies. By continuing to use our website, you are agreeing to our privacy policy. | Accept
Sign In