A Comparison of Parametric and Multivariable Optimization Techniques in a Raised-Floor Data Center

Srinarayana Nagarathinam; Babak Fakhim; Masud Behnia; Steve Armfield

doi:10.1115/1.4023214

Journal of Electronic Packaging | Volume 135 | Issue 3 | research-article

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Research Papers

A Comparison of Parametric and Multivariable Optimization Techniques in a Raised-Floor Data Center

Srinarayana Nagarathinam, Babak Fakhim, Masud Behnia and Steve Armfield

[+] Author and Article Information

Srinarayana Nagarathinam

Post-doctoral Fellow

Babak Fakhim

PhD Student

Masud Behnia

Professor
e-mail: masud.behnia@sydney.edu.au

Steve Armfield

Professor School of Aerospace,
Mechanical and Mechatronic Engineering,
The University of Sydney,
Sydney, New South Wales 2006, Australia

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received December 28, 2011; final manuscript received November 12, 2012; published online July 24, 2013. Assoc. Editor: Saurabh Shrivastava.

J. Electron. Packag 135(3), 030905 (Jul 24, 2013) (8 pages) Paper No: EP-11-1103; doi: 10.1115/1.4023214 History: Received December 28, 2011; Revised November 12, 2012

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Abstract

It is well known that the flow distribution in data centers can be effected by a variety of parameters such as rack and computer room air conditioning (CRAC) positions, raised-floor height, ceiling height, and percentage opening of perforated tiles. In the present paper, numerical simulations are conducted to optimize the layout of a raised-floor data center with respect to these parameters. Two different approaches have been used: parametric optimization; and a multivariable approach using response surface optimization. In the parametric optimization procedure, the data center is optimized with respect to the maximum temperature in the room. While in the multivariable approach, a cost function is constructed from all the rack inlet temperatures and is minimized. The results show that the multivariable approach is computationally economical and the optimized layout gives a better thermal performance compared to that of parametric optimization.

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References

Schmidt, R., and Iyengar, M., 2005, “Effect of Data Center Layout on Rack Inlet Air Temperatures,” Proceedings of the ASME Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems Collocated With the ASME Heat Transfer Summer Conference, pp. 517–525, San Francisco, CA, July 17–22, ASME Paper No. IPACK2005-73385. [CrossRef]

Sharma, R. K., Bash, C. E., and Patel, C. D., 2002, “Dimensionless Parameters for the Evaluation of Thermal Design and Performance of Large-Scale Data Centers,” Proceedings of the 8th ASME/AIAA Joint Thermophysics and Heat Transfer Conference, St. Louis, MO, June 24–26, Paper No. AIAA-2002-3091. [CrossRef]

Rambo, J., and Joshi, Y., 2006, “Thermal Modeling of Technology Infrastructure Facilities: A Case Study of Data Centers,” Handbook of Numerical Heat Transfer, Vol. II, W. J.Minkowycz, E. M.Sparrow, and J. Y.Murthy, eds., 2nd ed., Taylor and Francis, New York, pp. 821–850.

Kang, S., Schmidt, R., Kelkar, K. M., Radmehr, A., and Patankar, S. V., 2001, “A Methodology for the Design of Perforated Tiles in a Raised Floor Data Center Using Computational Flow Analysis,” IEEE Trans. Compon. Packaging Technol., 24(2), pp. 177–183. [CrossRef]

Schmidt, R., 2001, “Effect of Data Center Characteristics on Data Processing Equipment Inlet Temperatures,” Proceedings of the ASME Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems Collocated With the ASME Heat Transfer Summer Conference, pp. 1097–1106, Kauai, HI, July 8–13, ASME Paper No. IPACK2001-15870.

Patel, C. D., Bash, C. E., Belady, C., Stahl, L., and Sullivan, D., 2001, “Computational Fluid Dynamics Modeling of High Compute Density Data Centers to Assure System Inlet Air Specifications,” Proceedings of the ASME Pacific Rim International Electronics Packaging Technical Conference and Exhibition, Kauai, HI, July 8–13, ASME Paper No. IPACK2001-15622.

Rambo, J., and Joshi, Y., 2003, “Physical Models in Data Centers Airflow Simulations,” Proceedings of the International Mechanical Engineering Congress and Exposition, pp. 153–159, Washington, DC, November 15–21, ASME Paper No. IMECE2003-41381. [CrossRef]

Shrivastava, S., Sammakia, B., Schmidt, R., and Iyengar, M., 2005, “Comparative Analysis of Different Data Center Airflow Management Configurations,” Proceedings of the ASME Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems Collocated With the ASME Heat Transfer Summer Conference, pp. 329–336, San Francisco, CA, July 17–22, ASME Paper No. IPACK2005-73234. [CrossRef]

Fakhim, B., Behnia, M., Armfield, S. W., and Srinarayana, N., 2011. “Cooling Solutions in an Operational Data Centre: A Case Study,” Appl. Thermal Eng., 31, pp. 2279–2291. [CrossRef]

Iyengar, M., Schmidt, R., Sharma, R., McVicker, G., Shrivastava, S., Shrijayantha, S., Amemiya, Y., Dang, H., Chainer, T., and Sammakia, B., 2005, “Thermal Characterization of Non-Raised Floor Air Cooled Data Centers Using Numerical Modeling,” Proceedings of the ASME Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems Collocated With the ASME Heat Transfer Summer Conference, pp. 535–543, San Francisco, CA, July 17–22, ASME Paper No. IPACK2005-73387. [CrossRef]

Schmidt, R., and Cruz, E., 2004, “Cluster of High Powered Racks Within a Raised Floor Computer Data Center: Effects of Perforated Tiles Flow Distribution on Rack Inlet Air Temperature,” ASME J. Electron. Packag., 126(4), pp. 510–518. [CrossRef]

Schmidt, R., Karki, K. C., and Patankar, S. V., 2004, “Raised Floor Data Center: Perforated Tile Flow Rates for Various Tile Layouts,” Proceedings of the 9th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 571–578, Las Vegas, NV, June 1–4, Paper No. ITHERM2004-1319226. [CrossRef]

Schmidt, R., Karki, K. C., Kelkar, K. M., Radmehr, A., and Patankar, S. V., 2001, “Measurements and Predictions of the Flow Distribution Through Perforated Tiles in Raised Floor Data Centers,” Proceedings of the ASME Pacific Rim International Electronics Packaging Technical Conference and Exhibition, Kauai, HI, July 8–13, ASME Paper No. IPACK2001-15728.

Van Gilder, J. W., and Schmidt, R., 2005, “Airflow Uniformity Through Perforated Tiles in a Raised-Floor Data Center,” Proceedings of the ASME Pacific Rim International Electronics Packaging Technical Conference and Exhibition, San Francisco, CA, July 17–22, ASME Paper No. IPACK2005-73375. [CrossRef]

Radmehr, A., Schmidt, R., Karki, K. C., and Patankar, S. V., 2005, “Distributed Leakage Flow in Raised-Floor Data Centers,” Proceedings of the ASME Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated With the ASME Heat Transfer Summer Conference, pp. 401–408, San Francisco, CA, July 17–22, ASME Paper No. IPACK2005-73273. [CrossRef]

Rambo, J., and Joshi, Y., 2006. “Convective Transport Processes in Data Centers,” Numer. Heat Transfer, Part A, 49, pp. 923–945. [CrossRef]

Bhopte, S., Agonafer, D., Schmidt, R., and Sammakia, B., 2006, “Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature,” J. Electron. Packag., 128, pp. 380–387. [CrossRef]

Romadhon, R., Ali, M., Mahdzir, A. M., and Abakr, Y. A., “Optimization of Cooling Systems in Data Centre by Computational Fluid Dynamics Model and Simulation,” Proceedings of the Conference on Innovative Technologies in Intelligent Systems and Industrial Applications, pp. 322–327, Monash, Australia, July 25–26, IEEE Paper No. CITISIA2009-5224189. [CrossRef]

Shah, A., and Krishnan, N., 2008. “Optimization of Global Data Center Thermal Management Workload for Minimal Environmental and Economic Burden,” IEEE Trans. Compon. Packag. Technol., 31, pp. 39–45. [CrossRef]

Mukherjee, T., Banerjee, A., Varsamopoulos, G., Gupta, K. S., and Rungta, S., 2009, “Spatio-Temporal Thermal-Aware Job Scheduling to Minimize Energy Consumption in Virtualized Heterogeneous Data Centers,” Comput. Netw., 53, pp. 1603–1627. [CrossRef]

Herrlin, M. K., and Khankari, K., 2008, “Method for Optimizing Equipment Cooling Effectiveness and HVAC Cooling Costs in Telecom and Data Centers,” ASHRAE Trans., 114(1), p. 17. http://www.ancis.us/images/New_York_08_Web.pdf

FloVENT v9.1, Mentor Graphics Mechanical Analysis Division, Wilsonville, OR, http://www.mentor.com/products/mechanical /products/flovent

Karki, K. C., Patankar, S. V., and Radmehr, A., 2003, “Techniques for Controlling Airflow Distributions in Raised Floor Data Centers,” Proceedings of the ASME Pacific Rim International Electronic Packaging Technical Conference and Exhibition, pp. 621–628, Maui, HI, July 6–11, ASME Paper No. IPACK2003-35282. [CrossRef]

Box, G., and Draper, N. R., 1987, Empirical Model-Building and Response Surfaces, Wiley, New York, p. 424.

Raymond, H. M., Montgomery, D. C., and Anderson-Cook, C. M., eds., 2009, Response Surface Methodology: Process and Product Optimization Using Designed Experiment, 3rd ed., Wiley, New York.

ASHRAE TC9.9 Mission Critical Facilities, Technology Spaces, and Electronic Equipment, 2011, Thermal Guidelines for Data Processing Environments, American Society of Heating, Refrigeration, and Air-Conditioning Engineers, Inc, Atlanta, GA.

Figures

Fig. 2

A schematic of the data center layout

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Fig. 7

Variation of the maximum temperature with % opening of perforated tile

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Fig. 6

Pressure field just below the raised-floor

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Fig. 5

Variation in perforated tile flow rates

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Fig. 1

Hot-aisle/cold-aisle configuration

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Fig. 8

Variation of the standard deviation of perforated tile flow rate with % opening of perforated tile

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Fig. 9

Variation of the standard deviation of perforated tile flow rate with raised-floor height

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Fig. 10

Variation of the maximum temperature with raised-floor height

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Fig. 4

Temperature field of data center base layout in XZ- and XY-planes

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Fig. 3

Variation of the maximum temperature in the data center with grid size

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Fig. 13

Comparison of pressure distribution between the symmetric and optimum CRAC positions just below the raised-floor

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Fig. 11

Variation of the maximum temperature with ceiling height

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Fig. 12

Temperature field at the top of the racks for three different ceiling heights

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Fig. 15

Multivariable optimization cost function scenarios

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Fig. 14

Comparison of pressure distribution just below the raised-floor for CRACs with and without turning vanes

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Nagarathinam S, Fakhim B, Behnia M, Armfield S. A Comparison of Parametric and Multivariable Optimization Techniques in a Raised-Floor Data Center. ASME. J. Electron. Packag. 2013;135(3):030905-030905-8. doi:10.1115/1.4023214.

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A Comparison of Parametric and Multivariable Optimization Techniques in a Raised-Floor Data Center

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