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Technical Briefs

Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model

[+] Author and Article Information
Wataru Nakayama

Fellow ASME
ThermTech International,
920-7 Higashi Koiso, Oh-Iso,
Kanagawa 255-0004, Japan
e-mail: watnakayama@aol.com

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received December 23, 2011; final manuscript received April 24, 2013; published online June 4, 2013. Assoc. Editor: Gamal Refai-Ahmed.

J. Electron. Packag 135(3), 034501 (Jun 04, 2013) (5 pages) Paper No: EP-11-1100; doi: 10.1115/1.4024367 History: Received December 23, 2011; Revised April 24, 2013

Heat conduction analysis is performed on a model system to survey the effects of geometric and thermal parameters on the temperature of an embedded heat source. A box model has the geometric characteristics of hand-held devices and has a laminar organization composed of a printed circuit board (PCB), air gap, and a system casing. Exploiting the laminar organization and thinness of the laminate an approximate solution is derived. The solution is used to produce a guide for thermal design analysts, which is concerned with the sensitivity of the heat source temperature to the effective thermal conductivity of the PCB. Numerical examples are shown for the models that have typical dimensions and material properties of actual equipment and PCB.

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References

Nakayama, W., 1998, “Recent Japanese Thermal Solutions for Portable Computers,” Electron. Cooling, 4(3), pp. 14–22.
Lee, T.-Y. T., Chambers, B., and Ramakrishnan, K., 1998, “Thermal Management of Handheld Telecommunication Products,” Electron. Cooling, 4(2), May.
Elie, A., and Ferrario, J., 2003, “Electronic Components in Cell Phone Handsets: Thermal Solutions and Evaluation of Modeling Assumptions,” 53rd Electronic Components and Technology Conference, New Orleans, LA, May 27–30, pp. 449–451. [CrossRef]
Moon, S.-W., Prstic, S., and Chiu, C.-P., 2008, “Thermal Management of a Stacked-Die Package in a Handheld Electronic Device Using Passive Solutions,” IEEE Trans. Compon. Packag. Technol., 31(1), pp. 204–210. [CrossRef]
Incropera, F. P., and DeWitt, D. P., 1996, Fundamentals of Heat and Mass Transfer, 4th ed., John Wiley & Sons, New York.
Nakayama, W., Koizumi, K., Fukue, T., Ishizuka, M., and Nakajima, T., 2010, “Thermal Characterization of High-Density Interconnects: A Methodology Tested on a Model Coupon,” IEEE 12th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm2010), Las Vegas, NV, June 2–5. [CrossRef]

Figures

Grahic Jump Location
Fig. 1

A three-layer model of thin-flat electronic equipment

Grahic Jump Location
Fig. 2

Temperature distributions on the board (θB) and the casing (θC). dB= 1 mm, kB = 10 W/m K, and hS = 10 W/m2 K.

Grahic Jump Location
Fig. 3

Heat budget plotted for a range of board thermal conductivity. dB = 1 mm, hS = 10 W/m2 K.

Grahic Jump Location
Fig. 4

Maximum heat source temperature versus board thermal conductivity for dB = 0.5 mm and 1 mm, hS = 10 W/m2 K

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