Research Papers

Statistical Manufacturing Model of Printing Technology

[+] Author and Article Information
Nam-Soo Kim

e-mail: nkim@utep.edu

Sarah Luna

e-mail: sar01lun@gmail.com
Department of Metallurgical
and Materials Engineering,
The University of Texas at El Paso,
El Paso, TX 79968-0520

Jung-Hyou Lee

KEN Research Center,
Seokyeong University,
Seoul, 136-704, Korea
e-mail: mnet22@gmail.com

Tae-Eui Jeong

KEN Research Center,
Seokyeong University,
Seoul, 136-704, Korea;
Department of Nano Convergence Engineering,
Seokyeong University,
Seoul, 136-704, Korea
e-mail: tejeong@skuniv.ac.kr

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the Journal of Electronic Packaging. Manuscript received January 5, 2012; final manuscript received March 23, 2012; published online February 26, 2013. Assoc. Editor: Kyoung-sik (Jack) Moon.

J. Electron. Packag 135(1), 011004 (Feb 26, 2013) (5 pages) Paper No: EP-12-1005; doi: 10.1115/1.4007450 History: Received January 05, 2012; Revised March 23, 2012

There has been an evident increase in the demand for accurate and complex patterns for particles used in microsized electronic devices. Direct printing technology has been promoted as a solution for these needs, as the development of this technology provides both economical and environmental benefits, as well as being a time and energy saving process. Research in the field of printing technologies is still in the initial stages, involving the study of physical and chemical properties of printing materials. There are several methods currently using direct printing methods: microdispensing deposition write (MDDW), maskless mesoscale materials deposition (M3D), and inkjet printing. This study explores the direct printing methods of sequential and randomized printing associated with MDDW, M3D, and inkjet printing using computer simulations compared with actual experimentations. Sequential printing involves depositing particles onto the substrate in a specific order based on particle size. This method is associated with MDDW, where a relatively high viscous ink is dispensed onto the substrate so that particle sizes maintain an order in relation to one another, effectively producing a higher packing factor. Randomized printing involves the dispensing of various sizes of particles onto the substrate in a random order, as in inkjet printing. With this process, the probability of obtaining an efficient packing factor is unlikely and decreases even more with particle size. Therefore, the monolayer method, involving the deposition of individual particles, was developed to increase the packing factor when using the inkjet process. The results presented in this study proved that monolayering methods coincide with the projections predicted by the computer simulation. Sequential packing (MDDW) provides a shorter and higher range of packing factors than that of random packing sequences (ink jet); thus showing sequential packing to be the more efficient method. Sequential packing is closely related to the printing of high viscosity ink because of the higher packing factor that this method provides. An ink with increased viscosity allows for better conductivity which is essential in the development of improved nanoprinting technologies. This study provides evidence for the most efficient means of increasing the packing factor of particles; these methods offer the opportunity for technological advancement and commercialization of nanoprinting materials.

Copyright © 2013 by ASME
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Fig. 1

A schematic process for the packing simulation program

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Fig. 2

The three-dimensional shaping of a two-dimensional particle

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Fig. 3

Images of the sequential and randomized methods

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Fig. 4

Single- and binary-sized particle factors in a computer simulation and in empirical packing. r1 and r2 indicate small-sized particles and large-sized particles, respectively.

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Fig. 5

Two-dimensional packing factor of a binary-sized particle. r1 and r2 indicate small-sized particles and large-sized particles, respectively.

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Fig. 6

Results of two-dimensional packing factor for actual monolayer experiment using metal spheres. r1 and r2 are small- and large-sized particles, respectively.



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