0
Technical Briefs

A Novel Low Cost Package for Radio Frequency Applications

[+] Author and Article Information
Sandeep Chaturvedi

Mem. IEEE
Gallium Arsenide Enabling Technology Centre,
Vignyana Kancha Post,
Hyderabad 500069, India

Shiban K. Koul

Fellow IEEE
Centre for Applied Research in Electronics,
Indian Institute of Technology Delhi,
Hauz Khas, New Delhi 110016, India

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received December 15, 2011; final manuscript November 3, 2012; published online March 28, 2013. Assoc. Editor: Stephen McKeown.

J. Electron. Packag 135(2), 024501 (Mar 28, 2013) (3 pages) Paper No: EP-11-1096; doi: 10.1115/1.4023041 History: Received December 15, 2011; Revised November 03, 2012

Design, fabrication, and test results of a novel 3-layer RF package using a commonly available high frequency laminate are presented in this paper. The developed package can be manufactured using standard multilayer printed circuit board (PCB) manufacturing techniques making it cost effective for commercial applications. The package exhibits excellent RF characteristics up to 6 GHz.

FIGURES IN THIS ARTICLE
<>
Copyright © 2013 by ASME
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Fig. 1

Structural details of the proposed package (a) and (d) base layer (b) and (e) cavity layer (c) and (f) wall layer. (g) 3D view of complete package (all dimensions in mm).

Grahic Jump Location
Fig. 2

Simulated insertion loss and return loss for through case in the proposed package

Grahic Jump Location
Fig. 3

Photograph of the proposed package after final curing

Grahic Jump Location
Fig. 4

Test board for the proposed three-layer package. OPEN and THRU structures are also seen for de-embedding purpose.

Grahic Jump Location
Fig. 5

Through line measurements of the proposed package

Grahic Jump Location
Fig. 6

Comparison of simulated and measured performances of the proposed package

Grahic Jump Location
Fig. 7

Equivalent circuit of the MS-SL-MS transition of the package

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In