Technical Briefs

A Novel Low Cost Package for Radio Frequency Applications

[+] Author and Article Information
Sandeep Chaturvedi

Gallium Arsenide Enabling Technology Centre,
Vignyana Kancha Post,
Hyderabad 500069, India

Shiban K. Koul

Fellow IEEE
Centre for Applied Research in Electronics,
Indian Institute of Technology Delhi,
Hauz Khas, New Delhi 110016, India

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received December 15, 2011; final manuscript November 3, 2012; published online March 28, 2013. Assoc. Editor: Stephen McKeown.

J. Electron. Packag 135(2), 024501 (Mar 28, 2013) (3 pages) Paper No: EP-11-1096; doi: 10.1115/1.4023041 History: Received December 15, 2011; Revised November 03, 2012

Design, fabrication, and test results of a novel 3-layer RF package using a commonly available high frequency laminate are presented in this paper. The developed package can be manufactured using standard multilayer printed circuit board (PCB) manufacturing techniques making it cost effective for commercial applications. The package exhibits excellent RF characteristics up to 6 GHz.

Copyright © 2013 by ASME
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CST Microwave Studio, Computer Simulation Technology, GmbH, Darmstadt, Germany.


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Fig. 7

Equivalent circuit of the MS-SL-MS transition of the package

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Fig. 6

Comparison of simulated and measured performances of the proposed package

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Fig. 5

Through line measurements of the proposed package

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Fig. 4

Test board for the proposed three-layer package. OPEN and THRU structures are also seen for de-embedding purpose.

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Fig. 3

Photograph of the proposed package after final curing

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Fig. 2

Simulated insertion loss and return loss for through case in the proposed package

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Fig. 1

Structural details of the proposed package (a) and (d) base layer (b) and (e) cavity layer (c) and (f) wall layer. (g) 3D view of complete package (all dimensions in mm).




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