Research Papers

The Standardization of Printable Materials and Direct Writing Systems

[+] Author and Article Information
Jessica Hoffman

e-mail: jess.lynn.hoffman@gmail.com

Seyeon Hwang

e-mail: syking21@gmail.com

Ada Ortega

e-mail: ajortega4@gmail.com

Nam-Soo Kim

e-mail: nkim@utep.edu
Department of Metallurgical & Materials Engineering,
The University of Texas at El Paso,
El Paso, TX 79968

Kyoung-sik Moon

School of Materials Science & Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: ks.moon@mse.gatech.edu

Manuscript received February 20, 2012; final manuscript received August 14, 2012; published online March 26, 2013. Assoc. Editor: Jianmin Qu.

J. Electron. Packag 135(1), 011006 (Mar 26, 2013) (8 pages) Paper No: EP-12-1027; doi: 10.1115/1.4023809 History: Received February 20, 2012; Revised August 14, 2012

Direct-writing systems will be leading the future of additive manufacturing in that they have simple and cost-effective processes. There are various types of direct-writing systems, such as the roll-to-roll (R2R), microdispensing deposition write (MDDW), maskless mesoscale materials deposition (M3D), and ink-jet systems. These technologies are being used for the production of radio frequency identification tags (RFIDs), organic light-emitting diodes (OLEDs), light-emitting diodes (LEDs), flexible electronics, solar cells, antennas, etc. Recently, the standardization of printing materials and equipment has become a key issue in the printed electronics industry. The standardization of printed electronics can be categorized into four parts: equipment, materials, testing methods, and the education of this technology.

Copyright © 2013 by ASME
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Fig. 1

Schematic of the R2R gravure method [1]

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Fig. 2

Pictorial presentation of gravure-offset printing process

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Fig. 3

R2R reverse offset roll and stages. (a) Reverse offset roll; (b) stages.

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Fig. 4

Schematic of the R2R flexography method [11]

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Fig. 5

nScrypt dispensing tip [14]

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Fig. 6

The schematic for the M3D process [16]

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Fig. 7

Showing schematic representation of main division in printed electronics




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