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Research Papers

Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling

[+] Author and Article Information
Gongnan Xie

e-mail: xgn@nwpu.edu.cn

Weihong Zhang

Engineering Simulation and
Aerospace Computing (ESAC),
The Key Laboratory of Contemporary Design and
Integrated Manufacturing Technology,
Northwestern Polytechnical University,
P.O. Box 552, 710072 Xi'an, Shaanxi, China

Bengt Sunden

Division of Heat Transfer,
Department of Energy Sciences,
Lund University. P.O. Box 118,
SE-22100 Lund, Sweden
e-mail: bengt.sunden@energy.lth.se

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the Journal of Electronic Packaging. Manuscript received July 4, 2012; final manuscript received October 15, 2012; published online December 6, 2012. Assoc. Editor: Giulio Lorenzini.

J. Electron. Packag 134(4), 041010 (Dec 06, 2012) (6 pages) doi:10.1115/1.4023035 History: Received July 04, 2012; Revised October 15, 2012

With the increasing output power of the integrated circuit chips, the heat flux involved is being accordingly increased. In such situation, the air has almost reached its limit of cooling capacity, and thus the liquid cooling technology incorporating microchannel heat sinks is desired to cool the electronic chips in order to remove more heat loads. However, these microchannel heat sinks are often designed to be straight with rectangular cross section. In this study, on the basis of a straight microchannel having rectangular cross section, a kind of transversal wavy microchannel is designed and then the laminar flow and heat transfer are investigated numerically. It is shown that for removing the identical load, the transversal wavy microchannel has great potential to reduce pressure drop compared to the straight microchannel, especially for higher wave amplitude at the same Reynolds number, indicating the overall thermal performance of the transversal wavy microchannel is superior to the traditional straight rectangular microchannel. It is suggested such wavy microchannel can be used to cool chips effectively with much smaller pressure drop penalty.

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References

Figures

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Fig. 1

Schematic of a transversal wavy microchannel heat sink

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Fig. 3

Schematic of one-branch transversal wavy microchannel

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Fig. 2

Schematic of one-branch straight microchannel

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Fig. 5

Temperature distribution of TWC2 at u = 1.4 m/s

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Fig. 4

Channel pressure drop varying with Reynolds number

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Fig. 6

Nusselt numbers varying with Reynolds number

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Fig. 7

Overall thermal resistance varying with Reynolds number

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Fig. 8

Overall thermal resistances versus pumping power

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