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Research Papers

Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling

[+] Author and Article Information
Gongnan Xie

e-mail: xgn@nwpu.edu.cn

Weihong Zhang

Engineering Simulation and
Aerospace Computing (ESAC),
The Key Laboratory of Contemporary Design and
Integrated Manufacturing Technology,
Northwestern Polytechnical University,
P.O. Box 552, 710072 Xi'an, Shaanxi, China

Bengt Sunden

Division of Heat Transfer,
Department of Energy Sciences,
Lund University. P.O. Box 118,
SE-22100 Lund, Sweden
e-mail: bengt.sunden@energy.lth.se

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the Journal of Electronic Packaging. Manuscript received July 4, 2012; final manuscript received October 15, 2012; published online December 6, 2012. Assoc. Editor: Giulio Lorenzini.

J. Electron. Packag 134(4), 041010 (Dec 06, 2012) (6 pages) doi:10.1115/1.4023035 History: Received July 04, 2012; Revised October 15, 2012

With the increasing output power of the integrated circuit chips, the heat flux involved is being accordingly increased. In such situation, the air has almost reached its limit of cooling capacity, and thus the liquid cooling technology incorporating microchannel heat sinks is desired to cool the electronic chips in order to remove more heat loads. However, these microchannel heat sinks are often designed to be straight with rectangular cross section. In this study, on the basis of a straight microchannel having rectangular cross section, a kind of transversal wavy microchannel is designed and then the laminar flow and heat transfer are investigated numerically. It is shown that for removing the identical load, the transversal wavy microchannel has great potential to reduce pressure drop compared to the straight microchannel, especially for higher wave amplitude at the same Reynolds number, indicating the overall thermal performance of the transversal wavy microchannel is superior to the traditional straight rectangular microchannel. It is suggested such wavy microchannel can be used to cool chips effectively with much smaller pressure drop penalty.

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References

Satish G.Kandlikar., 2005, “High Flux Heat Removal With Microchannels—A Roadmap of Challenges and Opportunities,” Heat Transfer Eng., 26, pp. 5–14. [CrossRef]
Mahajan, R., Chiu, C.-P., and Chrysler, G., 2006, “Cooling a Microprocessor Chip,” Proc.-IEEE, 94, pp. 1476–1486. [CrossRef]
Tuckerman, D. B., and Pease, R. F. W., 1981, “High Performance Heat Sinking for VLSI,” IEEE Electron Device Lett., 2, pp. 126–129. [CrossRef]
Sasaki, S., and Kishimoto, T., 1986, “Optimal Structure for Microgrooved Cooling Fin for High-Power LSI Devices,” Electron. Lett., 22, pp. 1332–1334. [CrossRef]
Xie, X. L., Liu, Z. J., He, Y. L., and Tao, W. Q., 2009, “Numerical Study of Laminar Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink,” Appl. Therm. Eng., 29, pp. 64–74. [CrossRef]
Xie, X. L., Tao, W. Q., and He, Y. L., 2007, “Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink,” ASME J. Electron. Packag., 129, pp. 247–255. [CrossRef]
Manglik, R. M., Zhang, J., and Muley, A., 2005, “Low Reynolds Number Forced Convection in Three-Dimensional Wavy-Plate-Fin Compact Channels: Fin Density Effects,” Int. J. Heat Mass Transfer, 48, pp. 1439–1449. [CrossRef]
Sui, Y., Teo, C. J., Lee, P. S., Chew, Y. T., and Shu, C., 2010, “Fluid Flow and Heat Transfer in Wavy Microchannels,” Int. J. Heat Mass Transfer, 53, pp. 2760–2772. [CrossRef]
Gong, L., Kota, K., Tao, W. Q., and Joshi, Y., 2011, “Parametric Numerical Study of Flow and Heat Transfer in Microchannels With Wavy Walls,” ASME J. Heat Transfer, 133, 051702. [CrossRef]
Zhang, H. Y., Pinjala, D., Wong, T. N., Toh, K. C., and Joshi, Y. K., 2005, “Single-Phase Liquid Cooled Microchannel Heat Sink for Electronic Packages,” Appl. Therm. Eng., 25, pp. 1472–1487. [CrossRef]
Xie, G. N., Liu, Y. Q., Zhang, W. H., and Sunden, B., “Computational Study and Optimization of Laminar Heat Transfer and Pressure Loss of Double-Layer Microchannels for Chip Liquid Cooling,” ASME J. Thermal Sci. Eng. Appl., (in press).
Xie, G. N., Liu, Y. Q., Sunden, B., Zhang, W. H., and Zhao, J., 2012, “Numerical Investigation of Heat Transfer and Pressure Loss of Double-Layer Microchannels for Chip Liquid Cooling,” Proceedings of 2012 ASME Summer Heat Transfer Conference (HT2012), Puerto Rico, July 8–12, ASME Paper No. HT2012-58021.
Lee, P. S., Garimella, S. V., and Liu, D., 2005, “Investigation of Heat Transfer in Rectangular Microchannels,” Int. J. Heat Mass Transfer, 48, pp. 1688–1704. [CrossRef]
Shah, R. K., 1975, “Laminar Flow Friction and Forced Convection Heat Transfer in Ducts of Arbitrary Geometry,” Int. J. Heat Mass Transfer, 18, pp. 849–862. [CrossRef]
Tamayol, A., and Bahrami, M., 2010, “Laminar Flow in Microchannels With Noncircular Cross Section,” ASME J. Fluids Eng., 132, p. 111201. [CrossRef]
McHale, J. P., and Garimella, S. V., 2010, “Heat Transfer in Trapezoidal Microchannels of Various Aspect Ratios,” Int. J. Heat Mass Transfer, 53, pp. 365–375. [CrossRef]
Ding, J., and Manglik, R. M., 1996, “Analytical Solutions for Laminar Fully Developed Flows in Double-Sine Shaped Ducts,” Heat Mass Transfer, 31, pp. 269–277. [CrossRef]

Figures

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Fig. 1

Schematic of a transversal wavy microchannel heat sink

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Fig. 2

Schematic of one-branch straight microchannel

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Fig. 3

Schematic of one-branch transversal wavy microchannel

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Fig. 4

Channel pressure drop varying with Reynolds number

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Fig. 5

Temperature distribution of TWC2 at u = 1.4 m/s

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Fig. 6

Nusselt numbers varying with Reynolds number

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Fig. 7

Overall thermal resistance varying with Reynolds number

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Fig. 8

Overall thermal resistances versus pumping power

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