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Research Papers

Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications

[+] Author and Article Information
S. Pashah

Mechanical Engineering Department,
King Fahd University of Petroleum & Minerals,
Dhahran, Saudi Arabia

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the Journal of Electronic Packaging. Manuscript received August 11, 2010; final manuscript received July 7, 2012; published online October 30, 2012. Assoc. Editor: Koneru Ramakrishna.

J. Electron. Packag 134(4), 041005 (Oct 30, 2012) (10 pages) doi:10.1115/1.4007258 History: Received August 11, 2010; Revised July 07, 2012

Thermally conductive composites as compared to metals have reduced density, decreased oxidation, and improved chemical resistance, as well as adjustable properties to fit a given application. However, there are several challenges that need to be addressed before they can be successfully implemented in heat sink design. The interface between the device and heat sink is an important factor in the thermal design of microelectronics cooling. Depending on the thermal interface conditions and material properties, the contact pressure and thermal stress level can attain undesirable values. In this paper, we investigate the effect of thermal interface between the fin and base plate on thermal-structural behavior of heat sinks. A coupled-field (thermal-structural) analysis using finite element method is performed to predict temperature as well as stress fields in the interface region. In addition temperature and heat flow rate predictions are supported through analytical results. effect of various interface geometrical (such as slot-depth, axial-gap, and radial-gap) and contact properties (such as air gap with surface roughness and gaps filled with interface material) on the resulting thermal-structural response is investigated with respect to four interface materials combinations, and it is found that the thermal performance is most sensitive to the slot-depth compared to any other parameter.

Copyright © 2012 by ASME
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Figures

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Fig. 1

Fin pin diagram showing two thermal interfaces

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Fig. 2

Schematic diagram of the pin fin

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Fig. 3

Dimensionless temperature contour plots for a 2D orthotropic pin fin having an aspect ratio, L/R = 10

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Fig. 4

Temperature distribution in pin fin for composite 4

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Fig. 5

Pin fin heat sink assembly

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Fig. 6

Temperature distribution for four cases

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Fig. 7

Temperature distribution along axial direction at r = 0

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Fig. 8

Equivalent plastic strain distribution for A-E-C for base plate material (a) Al-6063 and (b) Al-6061

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Fig. 9

Equivalent plastic strain distribution for (a) A-A-A and (b) A-E-A combinations

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Fig. 10

von Mises stress distribution for four cases

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Fig. 11

von Mises strain distribution for four cases

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Fig. 12

Stress distribution along axial direction at r = 0

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Fig. 13

Variations for A-E-C case (a) thermal performance, (b) von Mises stress, and (c) von Mises plastic strain

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Fig. 14

Effect of unit thermal resistance on A-E-C (a) thermal performance, (b) von Mises stress, and (c) von Mises plastic strain

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Fig. 15

Variation for C-E-C (a) thermal performance and (b) von Mises stress

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Fig. 16

Effect of unit thermal resistance on C-E-C (a) thermal performance and (b) von Mises stress

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