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TECHNICAL PAPERS

A Technique to Measure Interfacial Toughness Over a Range of Phase Angles

[+] Author and Article Information
Adam Kuhl, Jianmin Qu

The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405

J. Electron. Packag 122(2), 147-151 (Sep 15, 1999) (5 pages) doi:10.1115/1.483147 History: Received January 26, 1999; Revised September 15, 1999
Copyright © 2000 by ASME
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References

Cao,  H. C., and Evans,  A. G., 1989, “An Experimental Study of the Fracture Resistance of Bimaterial Interfaces,” Mech. Mater., 7, pp. 295–304.
Charalambides,  P. G., Lund,  J., Evans,  A. G., and McMeeking,  R. M., 1989, “A Test Specimen for Determining the Fracture Resistance of Bimaterial Interfaces,” ASME J. Appl. Mech., 56, pp. 77–82.
Suo,  Z., and Hutchinson,  J. W., 1989, “Sandwich Test Specimens for Measuring Interface Crack Toughness,” Mater. Sci. Eng., A107, pp. 135–143.
Liechti,  K. M., and Chai,  Y. S., 1991, “Biaxial Loading Experiments for Determining Interfacial Fracture Toughness,” ASME J. Appl. Mech., 58, pp. 680–687.
O’Dowd,  N. P., Shih,  F. C., and Stout,  M. G., 1992, “Test Geometries for Measuring Interfacial Fracture Toughness,” Int. J. Solids Struct., 29, pp. 571–589.
Sundararaman, V., and Davidson, B. D., 1995, “New Test Methods for Determining Fracture Toughness as a Function of Mode Mix for Bimaterial Interfaces,” Application of Fracture Mechanics in Electronic Packaging and Materials ASME 1995, EEP-Vol. 11/MD-Vol.64, pp. 141–154.
Pang,  H. L. J., and Seetoh,  C. W., 1997, “A Compact Mixed Mode (CMM) Fracture Specimen for Adhesive Bonded Joints,” Eng. Fract. Mech., 57, pp. 57–65.
Wang,  J. S., and Suo,  Z., 1990, “Experimental Determination of Interfacial Toughness Curves Using Brazil-Nut-Sandwiches,” Acta Metall. Mater., 38, pp. 1279–1290.
Dundurs, J., 1968, “Elastic Interaction of Dislocations With Inhomogeneities,” in Mathematics Theory of Dislocations, American Society of Mechanical Engineering, New York, pp. 70–115.
Rice,  J. R., 1988, “Elastic Fracture Mechanics Concepts for Interfacial Cracks,” ASME J. Appl. Mech., 55, pp. 98–103.
Atkinson,  C., Smelser,  R. E., and Sanchez,  J., 1982, “Combined Mode Fracture via the Cracked Brazilian Disk Test,” Int. J. Fract., 18, p. 279.
Kuhl, A., 1998, “A Technique to Measure Interfacial Fracture Toughness,” M.S. thesis, School of Mechanical Engineering, Georgia Inst. of Tech., Atlanta, GA.
Thurston,  M. E., and Zehnder,  A. T., 1993, “Experimental Determination of Silica/Copper Interfacial Toughness,” Acta Metall. Mater., 41, pp. 2985–2992.
Suo,  Z., and Hutchinson,  J. W., 1990, “Interface Crack Between Two Elastic Layers,” Int. J. Fract., 43, pp. 1–18.
Vincent, M. B., Meyers, L., and Wong, C. P., 1998, “Enhancement of Underfill Adhesion to Die and Substrate by Use of Silane Additives,” Proc. 4th Int. Symposium on Advanced Packaging Materials, Braselton, GA, IEEE, pp. 49–52.

Figures

Grahic Jump Location
Interfacial damage in a flip-chip assembly
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Homogeneous specimen with an edge crack
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Finite element mesh for calculating stress intensity factors
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Calibration functions fI(θ) and fII(θ)
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Phase angle relationship between cracks in homogeneous and sandwiched specimens
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Sandwiched specimen with an interfacial edge crack
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Loading fixture for Brazil-nut specimen
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Interfacial fracture toughness curves for copper/underfill interfaces (a) no. 1 interface; (b) no. 2 interface; (c) no. 3 interface; and (d) no. 4 interface

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