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TECHNICAL PAPERS

A Technique to Measure Interfacial Toughness Over a Range of Phase Angles

[+] Author and Article Information
Adam Kuhl, Jianmin Qu

The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405

J. Electron. Packag 122(2), 147-151 (Sep 15, 1999) (5 pages) doi:10.1115/1.483147 History: Received January 26, 1999; Revised September 15, 1999
Copyright © 2000 by ASME
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References

Figures

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Interfacial damage in a flip-chip assembly
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Homogeneous specimen with an edge crack
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Finite element mesh for calculating stress intensity factors
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Calibration functions fI(θ) and fII(θ)
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Phase angle relationship between cracks in homogeneous and sandwiched specimens
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Sandwiched specimen with an interfacial edge crack
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Loading fixture for Brazil-nut specimen
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Interfacial fracture toughness curves for copper/underfill interfaces (a) no. 1 interface; (b) no. 2 interface; (c) no. 3 interface; and (d) no. 4 interface

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