Birzer, C., Rakow, B., Steiner, R., and Walter, J., 2005, “Drop Test Reliability Improvement of Lead-Free Fine Pitch BGA Using Different Solder Ball Composition,” "Proceedings of the 55th Electronic Components and Technology Conference", Orlando, FL, pp. 1194–1200.
Yueli, L., 2006, “High Temperature Aging Affects on Lead Free CSPs—Drop Test Reliability,” "IPC/JEDEC Conference", Santa Clara, CA.
Chiu, T. C., Zeng, K., Stierman, R., Edwards, D., and Ano, K., 2004, “Effect of Thermal Aging on Board Level Drop Reliability for Pb-Free BGA Packages,” "Proceeding of the 54th Electronic Components and Technology Conference, Las Vegas", NV, pp. 1256–1262.
Xu, L., and Pang, J. H. L., 2006, “Effect of Intermetallic and Kirkendall Voids Growth on Board Level Drop Reliability for SnAgCu Lead-Free BGA Solder Joint,” "Proceedings of the 56th Electronic Components and Technology Conference", San Diego, CA, pp. 275–282.
Wong, E. H., Rajoo, R., Mai, Y. W., Sean, S. K. W., Tsai, K. T., and Yap, L. M., 2005, “Drop Impact: Fundamentals and Impact Characterization of Solder Joints,” "Proceedings of the 55th Electronic Components and Technology Conference", Lake Buena Vista, FL, pp. 1202–1209.
JEDEC Standard for Drop Testing—JESD22-B11, 2003, www.jedec.org, accessed November 2009.
Borgesen, P., Cotts, E., Yin, L., Kondos, P., Roggeman, B., Tumne, P., Li, J., and Srihari, K., 2008, “Interconnect Reliability in Medical Microelectronics Applications,” "SMTA Medical Electronics Conference", Anaheim, CA.
Ebeling, C. E., 1997, "An Introduction to Reliability and Maintainability Engineering", McGraw Hill Publishing Company, New York.
Tumne, P., Venkatadri, V., Kudtarkar, S., Delaus, M., Natale, S., Santos, D., Havens, R., and Srihari, K., 2010, “Reliability Analysis of Censored Data for Drop Testing in Wafer Level Chip Scale Packaging (WLCSP),” "Proceedings of the 15th Annual International Conference on Industrial Engineering Theory, Applications and Practice, Mexico City", Mexico, Oct. 17–20, 2010.
Song, F., Lee, S. W. R., Newman, K., Clark, S., and Sykes, B., 2007, “Comparison of Joint Strength and Fracture Energy of Lead Free Solder Balls in High Speed Ball Shear/Pull Tests and Their Correlation With Board Level Drop Test,” "9th Electronics Packaging Technology Conference", Singapore.
Neville, D. J., 1987, “A New Statistical Distribution Function for Fracture Toughness,” Proc. R. Soc. London, Ser. A, 410 , pp. 421–442.
Neville, D. J., 2008, “A Group of Processes Related to the Poisson Process,” Proc. R. Soc. London, Ser. A, 464 (2097), pp. 2457–2466.
Neville, D. J., 1990, “Applications of a New Statistical Function for Fracture Toughness to Failures at Microcracks in Brittle Materials,” Int. J. Fracture, 44 (2), pp. 79–96.
Alajoki, M., Nguyen, L., and Kivilahti, J., 2005, “Drop Test Reliability of Wafer Level Chip Scale Packages,” "Proceedings of the 55th Electronic Components and Technology Conference", Lake Buena Vista, FL, May 31–June 3, pp. 637–644.
Venkatadri, V., Yin, L., Xing, Y., Cotts, K., Srihari, K., and Borgesen, P., 2009, “Accelerating the Effects of Aging on the Reliability of Lead Free Solder Joints in a Quantitative Fashion,” "59th Electronic Components and Technology Conference", San Diego.
Venkatadri, V., Yin, L., Borgesen, P., and Srihari, K., 2010, “Quantitative Assessment of Effects of Long Term Aging on Sn-Ag-Cu Solder Joint Reliability,” "IMAPS Mid-Atlantic Microelectronics Conference", Atlantic City, NJ, June 17–18, 2010.
Kim, H., Zhang, M., Kumar, C. M., Suh, D., Liu, P., Kim, D., Xie, M., and Wang, Z., 2007, “Improved Drop Reliability Performance With Lead Free Solders of Low Ag Content and Their Failure Modes,” "Proceedings of the 57th Electronic Components and Technology Conference", Reno, NV, May 29–June 1, 2007, pp. 962–996.