0
Research Papers

Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

[+] Author and Article Information
Hung-Jen Chang1

Department of Engineering Science,  National Cheng Kung University, Tainan 70101, TaiwanN9896123@mail.ncku.edu.tw

Chau-Jie Zhan, Tao-Chih Chang

Assembly and Reliability Technology Department,  Industrial Technology Research Institute, Hsinchu 31040, Taiwan

Jung-Hua Chou

Department of Engineering Science,  National Cheng Kung University, Tainan 70101, Taiwan

1

Corresponding author.

J. Electron. Packag 134(1), 011011 (Mar 19, 2012) (6 pages) doi:10.1115/1.4005956 History: Received November 01, 2011; Revised January 16, 2012; Published March 07, 2012; Online March 19, 2012

In this study, a lead-free dummy plastic ball grid array component with daisy-chains and Sn4.0 Ag0.5 Cu Pb-free solder balls was assembled on an halogen-free high density interconnection printed circuit board (PCB) by using Sn1.0 Ag0.5 Cu solder paste on the Cu pad surfaces of either organic solderable preservative (OSP) or electroless nickel immersion gold (ENIG). The assembly was tested for the effect of the formation extent of Ag3 Sn intermetallic compound. Afterward a board-level pulse-controlled drop test was conducted on the as-reflowed assemblies according to the JESD22-B110 and JESD22-B111 standards, the impact performance of various surface finished halogen-free printed circuit board assembly was evaluated. The test results showed that most of the fractures occurred around the pad on the test board first. Then cracks propagated across the outer build-up layer. Finally, the inner copper trace was fractured due to the propagated cracks, resulting in the failure of the PCB side. Interfacial stresses numerically obtained by the transient stress responses supported the test observation as the simulated initial crack position was the same as that observed.

FIGURES IN THIS ARTICLE
<>
Copyright © 2012 by American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Figure 1

132 mm × 77 mm PCB with assembled drop test IC packages

Grahic Jump Location
Figure 2

Board-level drop system

Grahic Jump Location
Figure 3

Board-level drop test model of halogen-free PCB assembly

Grahic Jump Location
Figure 4

Submodel of critical solder joint

Grahic Jump Location
Figure 5

Interfacial microstructures of (a) package side and (b) PCB-side when the SAC405 solder balls were soldered on PCB with OSP finish by SAC105 solder paste

Grahic Jump Location
Figure 6

Interfacial microstructures of PCB-side when the SAC405 solder balls were soldered on PCB with ENIG finish by SAC105 solder paste

Grahic Jump Location
Figure 7

Weibull distribution after drop test

Grahic Jump Location
Figure 8

Cross-section of solder joint failure with an anchored void on the ENIG pad

Grahic Jump Location
Figure 9

Cross-section of corner solder interconnect shown to fail at the package to solder interconnect interface

Grahic Jump Location
Figure 10

Cross-section of corner solder joint shown to fail at the halogen-free resin

Grahic Jump Location
Figure 11

Interconnect structure and potential failure modes from drop test

Grahic Jump Location
Figure 12

Z-axis peeling stress on top (up) and bottom (down) surfaces of solder joints

Grahic Jump Location
Figure 13

Peeling stress histories

Grahic Jump Location
Figure 14

PCB maximum warp distribution

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In