0
Technical Briefs

Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model

[+] Author and Article Information
Wei Han, Marc Rensing, Peter O’Brien

 Integrated Photonics Group, Tyndall National Institute, Cork, Ireland

Frank H. Peters

Integrated Photonics Group,  Tyndall National Institute, Cork, Ireland; Department of Physics,  University College Cork, Cork, Ireland

J. Electron. Packag 133(4), 044502 (Dec 09, 2011) (4 pages) doi:10.1115/1.4005292 History: Received October 11, 2010; Revised August 31, 2011; Published December 09, 2011; Online December 09, 2011

In this paper, the packaging aspects of directly modulated laser (DML) modules are investigated using detailed electromagnetic (EM) simulations. The packaging influences of the laser module are specified in two parts as RF connector and optoelectronic subsystem. By carefully optimizing the package structure, the simulation results show that the insertion loss of the proposed module is less than 1 dB up to 40 GHz. Then, a DML module is packaged and measured based on the optimized package scheme. A resonance free bandwidth of approximately 20 GHz is obtained with a 3 dB bandwidth of about 15 GHz.

FIGURES IN THIS ARTICLE
<>
Copyright © 2011 by American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Figure 1

EM model of the BTF package including the RF connector and glass bead

Grahic Jump Location
Figure 2

Assembly of RF connector and glass bead

Grahic Jump Location
Figure 3

Simulated reflection (S11 ) with different (a) ratios of D2/D1 and (b) air gap values

Grahic Jump Location
Figure 4

Assembly structure for the optoelectronic subsystem

Grahic Jump Location
Figure 5

(a) S21 and S11 of the MSL with different linewidths and (b) influence of the Au wire on reflection

Grahic Jump Location
Figure 6

Section plane of the RF signal transmission path

Grahic Jump Location
Figure 7

(a) Resonances due to the improper optoelectronic subsystem assembly, and (b) results with optimization

Grahic Jump Location
Figure 8

Packaged laser module based on the optimized simulation results

Grahic Jump Location
Figure 9

(a) Measured S21 of DML module with and without optimization and (b) measured S11 with different Au wire lengths

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In