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Technical Briefs

A Creep Model for Solder Alloys

[+] Author and Article Information
Yongchang Lee

Electronic Packaging Laboratory, Department of Civil, Structural, and Environmental Engineering,  State University of New York at Buffalo,Buffalo, NY 14260; Nanotechnology Research Laboratory,University of Tabuk, Tabuk, Dhiba, 71421, Saudi Arabiayl83@buffalo.edu

Cemal Basaran

Electronic Packaging Laboratory, State University of New York at Buffalo

J. Electron. Packag 133(4), 044501 (Nov 17, 2011) (6 pages) doi:10.1115/1.4005288 History: Received December 01, 2009; Revised July 12, 2011; Published November 17, 2011; Online November 17, 2011

Demand for long-term reliability of electronic packaging has lead to a large number of studies on viscoplastic behavior of solder alloys. Various creep models for solder alloys have been proposed. They range from purely empirical to mechanism based models where dislocation motion and diffusion processes are taken into account. In this study, most commonly used creep models are compared with the test data and implemented in ABAQUS to compare their performance in cycling loading. Finally, a new creep model is proposed that combines best features of many models. It is also shown that, while two creep models may describe the same material stress–strain rate curves equally well, they may yield very different results when utilized for cycling loading. One interesting observation of this study is that the stress exponent, n., also depends on the grain size.

FIGURES IN THIS ARTICLE
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Copyright © 2011 by American Society of Mechanical Engineers
Topics: Creep , Alloys , Solders
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References

Figures

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Figure 7

Creep model I for different grain sizes; (a) model I on grain size = 9.7 μm and (b) model I on grain size = 28.4 μm

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Figure 8

Comparison between models G, H, and I for two complete cycles; (a) shear stress versus time and (b) shear stress versus temperature

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Figure 6

Creep model H for different grain sizes; (a) model H on grain size = 9.7 μm and (b) model H on grain size = 28.4 μm

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Figure 5

Creep model G for different grain sizes; (a) model G on grain size = 9.7 μm and (b) model G on grain size = 28.4 μm

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Figure 4

Representation of the experimental data for each model; (a) creep models G and H and (b) creep model I

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Figure 3

Coble creep model

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Figure 2

Nabarro and Herring creep model

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Figure 1

Creep-time curve for 63Sn/37Pb solder alloy, after Shi [14]

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