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Technical Briefs

Accelerated Life Testing in Epoxy Packaged High Luminosity Light Emitting Diodes

[+] Author and Article Information
Eduardo Nogueira

EUIT Telecomunicación-Universidad Politécnica de Madrid

Manuel Vázquez1

EUIT Telecomunicación - Instituto de Energía Solar-Universidad Politécnica de Madridmanuel.vazquez@upm.es

Carlos Algora

ETSI Telecomunicación-Instituto de Energía Solar-Universidad Politécnica de Madrid

1

Also at: Electrónica Física, EUIT de Telecomunicación, Campus Sur-UPM, Km. 7 Carretera de Valencia, 28031 Madrid.

J. Electron. Packag 133(3), 034501 (Sep 14, 2011) (5 pages) doi:10.1115/1.4004659 History: Received July 20, 2010; Revised May 19, 2011; Published September 14, 2011; Online September 14, 2011

In this work, we have evaluated the reliability of epoxy packaged light emitting diodes (LEDs) for outdoor applications by specific tests to enhance catastrophic failures that appear under high temperature and humidity operation conditions. The different failure mechanisms were analyzed observing two main types: one is open circuit catastrophic failures induced by moisture and the other one power luminosity degradation. The influence of temperature and humidity on catastrophic failures was modelled using the Arrhenius–Peck law obtaining an activation energy of 0.87 eV and a Peck parameter of 2.29. MTTF value of 1.582 × 106 h at low bias current, 10 mA, has been evaluated.

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Copyright © 2011 by American Society of Mechanical Engineers
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References

Figures

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Figure 1

Weibull plot for tests at 120 °C/85%, 130 °C/85%, and 140 °C/85%

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Figure 2

Weibull plot for 140 °C/50% RH, 140 °C/70% RH, and 140/85% RH test conditions

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Figure 3

Weibull Arrhenius plot for 140 °C/85% RH, 130 °C/85% RH, and 120 °C/85% RH. Extrapolation of MTTF at 27 °C is also shown.

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Figure 4

Peck model representation for test results at 50%, 70%, and 85% RH, at 140 °C

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Figure 5

Average power luminosity as a function of time for LEDs in 140 °C/85% RH test conditions

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Figure 6

Example I–V curves at 0 h and after 55 h

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Figure 7

Voids in the package epoxy

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Figure 8

Anode oxidation caused by moisture penetrating the encapsulating housing

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