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Research Papers

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

[+] Author and Article Information
John H. Lau

Electronics and Optoelectronics Research Labs,  Industrial Technology Research Institute (ITRI), Hsinchu, 31040 Taiwanjohnlau@itri.org.tw

M. S. Zhang

Department of Mechanical Engineering,  The Hong Kong University of Science and Technologym, Hong Kong, 999077 China

S. W. Ricky Lee

Department of Mechanical Engineering,  The Hong Kong University of Science and Technologym, Hong Kong, 999077 Chinarickylee@ust.hk

J. Electron. Packag 133(3), 031010 (Sep 26, 2011) (7 pages) doi:10.1115/1.4004861 History: Received July 01, 2010; Revised May 04, 2011; Published September 26, 2011; Online September 26, 2011

A low-cost (with bare chips) and high (optical, electrical, thermal, and mechanical) performance optoelectronic system embedded into a PCB (printed circuit board) or an organic laminated substrate is designed and described. This system consists of a rigid PCB (or a substrate) with an embedded optical polymer waveguide, an embedded vertical cavity surface emitted laser (VCSEL), an embedded driver chip, an embedded serializer, an embedded photo-diode detector, an embedded tans-impedance amplifier (TIA), an embedded deserializer, embedded heat slugs, and a heat spreader. The bare VCSEL, driver chip, and serializer chip are 3D stacked and then attached on one end of the embedded optical polymer waveguide in the PCB. Similarly, the bare photo-diode detector, TIA chip, and deserializer chip are 3D stacked and then attached on the other end of the embedded optical polymer waveguide in PCB. The back-side of the driver or serializer and the TIA or deserializer chips is attached to a heat slug with or without a spreader. This novel structural design offers potential solutions for low-cost and high-performance semiconductor circuits with optical devices to realize wide-bandwidth and low-profile optoelectronic packaging for chip-to-chip optical interconnect applications. Optical, thermal management, and mechanical performances are demonstrated by simulations based on the optic theory, heat-transfer theory, and continuum mechanics.

Copyright © 2011 by American Society of Mechanical Engineers
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References

Figures

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Figure 1

Cutoff side view of the integrated planar optical waveguide PCB

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Figure 2

3D stacking of optoelectronics on optical printed circuit board

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Figure 3

Schematic of fully embedded board-level optical interconnects system

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Figure 4

Mirror forming by a dicing saw and then with metal coating before upper cladding

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Figure 5

The assembled optical/electrical circuit board (of Fig. 3) with an embedded waveguide

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Figure 6

Embedded 3D hybrid IC integration for opto-electronic interconnects

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Figure 7

Simulated model showing the direct coupling of the optical signal

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Figure 8

Coupling loss versus the height of VCSEL

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Figure 9

Finite element modeling of the embedded 3D SiP for opto-electronic interconnects in organic substrate

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Figure 10

Thermal boundary condition

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Figure 11

Temperature distribution at the critical location of the 3D hybrid IC SiP

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Figure 12

Geometry and temperature loading boundary conditions for mechanical analyses

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Figure 13

Undeformed (left) and deformed (right) shapes of the transmitter (100 X)

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Figure 14

Mismatch between the VCSEL and the mirror on the polymer waveguide as a function of waveguide length

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Figure 15

von Mises strain and stress at the critical solder joint of the transmitter

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