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Research Papers

Optimization of Parallel, Horizontal, and Laminar Forced Air-Cooled Heat Generating Boards

[+] Author and Article Information
M. O. Özdemir, H. Yüncü

Department of Mechanical Engineering,  Middle East Technical University, Ankara 06800, Turkey

J. Electron. Packag 133(3), 031006 (Sep 14, 2011) (10 pages) doi:10.1115/1.4004097 History: Received December 22, 2010; Revised April 12, 2011; Published September 14, 2011; Online September 14, 2011

The objective of this study is to predict numerically the optimal spacing between parallel heat generating boards. The isothermal boards are stacked in a fixed volume of electronic package enclosed by insulated lateral walls, and they are cooled by laminar forced convection of air with prescribed pressure drop. In the numerical procedure, governing equations for the solution of forced convection of constant property incompressible flow through one rectangular channel are solved. Resulting flow and temperature fields in each rectangular channel yield the optimal board-to-board spacing by which maximum heat dissipation rate from the package to the air is achieved. Next, generalized correlations for the determination of the maximum heat transfer rate from the package and optimal spacing between boards are derived in terms of prescribed pressure difference, board length, and density and kinematic viscosity of air. Finally, corresponding correlations are compared with the available two-dimensional studies in literature for infinite parallel plates.

Copyright © 2011 by American Society of Mechanical Engineers
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References

Figures

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Figure 1

Configuration of the total assembly

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Figure 2

Representation of a single channel and boundary conditions with given coordinates

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Figure 3

Computational domain used in the numerical algorithm with defined boundary conditions

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Figure 4

Friction factor in developing laminar flow (s/W=0 or infinite parallel plates condition)

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Figure 5

Friction factor in developing laminar flow (s/W=0.2)

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Figure 6

Friction factor in developing laminar flow (s/W=0.5)

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Figure 7

Friction factor in developing laminar flow (s/W=1)

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Figure 8

Nusselt number in thermally fully developed laminar flow for different channel aspect ratios

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Figure 9

The total heat transfer rate versus board-to-board spacing (L/W=0.5)

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Figure 10

The total heat transfer rate versus board-to-board spacing (L/W=5)

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Figure 11

The total heat transfer rate versus board-to-board spacing (L/W=10)

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Figure 12

Maximum total heat transfer rate versus optimum board-to-board spacing for different L/W values

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Figure 13

The optimum board-to-board spacing versus pressure drop

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Figure 14

Maximum total heat transfer rate versus pressure drop

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Figure 15

Coefficient B, in Eq. (41), versus L/W

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Figure 16

Coefficient C, in Eq. (42), versus L/W

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Figure 17

Coefficient B, in Eq. (41), versus L/W in the current study and its comparison with the other studies in literature

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