Research Papers

Simplified Thermal Model of a Stacked Ball Grid Array Package

[+] Author and Article Information
Luigi P. M. Colombo1

Department of Energy,  Politecnico di Milano, Via Lambruschini 4, 20156 Milano, Italyluigi.colombo@polimi.it

Alexey Petrushin

Peroni Pompe S.p.A, Via Tacito 4, 20094 Corsico, Milano, Italya.petrushin@mail.ru

Davide Paleari

Replay S.p.A, Corso Francia 110, 10143 Torino, Italydavide.paleari@hotmail.it


Corresponding author.

J. Electron. Packag 133(2), 021006 (Jun 23, 2011) (7 pages) doi:10.1115/1.4003991 History: Received July 23, 2010; Revised April 05, 2011; Published June 23, 2011; Online June 23, 2011

Simplified integrated approaches to thermal modeling of electronics packages call for fast and easy thermal models. However, this is often in contrast with the complexity of the thermal problem to be solved, which prevents the application of simplified approaches. After a review of the available modeling strategies, steady state thermal analysis of a typical stacked ball grid array package based on a thermal resistance network is presented. The physical model is discussed in detail, together with its advantages and limitations. The results have been compared with detailed 3D-simulations performed by means of a commercial code: for thermal design purposes, the accuracy is satisfactorily, leading a prediction error of the junction temperature lower than 10%.

Copyright © 2011 by American Society of Mechanical Engineers
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Figure 1

Geometrical model for the estimate of the spreading thermal resistance

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Figure 2

Geometrical model of a single ball with the suitable boundary conditions

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Figure 3

Comparison between Eq. 10 (line) and numerical simulation (dots) for the spreading resistance of a single ball

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Figure 4

Typical cross-section of ball grid array package

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Figure 5

UM model thermal resistance network

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Figure 6

SM model thermal resistance network

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Figure 7

Different configurations of the ball grid array




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