Research Papers

An Artificial Neural Network Approach to Cooling Analysis of Electronic Components in Enclosures Filled With Nanofluids

[+] Author and Article Information
A. Kargar1

Engineering Faculty, Shahrekord University, P.O. Box 115, Shahrekord, Irankargar@ieee.org

B. Ghasemi

Engineering Faculty, Shahrekord University, P.O. Box 115, Shahrekord, Iranbehzadgh@yahoo.com

S. M. Aminossadati

School of Mechanical and Mining Engineering, The University of Queensland, Brisbane, Queensland 4072, Australiauqsamino@uq.edu.au


Corresponding author.

J. Electron. Packag 133(1), 011010 (Mar 10, 2011) (9 pages) doi:10.1115/1.4003215 History: Received January 05, 2010; Revised June 20, 2010; Published March 10, 2011; Online March 10, 2011

Computational fluid dynamics (CFD) and artificial neural network (ANN) are used to examine the cooling performance of two electronic components in an enclosure filled with a Cu-water nanofluid. The heat transfer within the enclosure is due to laminar natural convection between the heated electronic components mounted on the left and right vertical walls with a relatively lower temperature. The results of a CFD simulation are used to train and validate a series of ANN architectures, which are developed to quickly and accurately carry out this analysis. A comparison study between the results from the CFD simulation and the ANN analysis indicates that the ANN accurately predicts the cooling performance of electronic components within the given range of data.

Copyright © 2011 by American Society of Mechanical Engineers
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Figure 1

A schematic diagram of the physical model

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Figure 2

Validation of the present work against Oztop and Abu-Nada (5)

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Figure 3

Designed ANN architectures

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Figure 4

Local Nusselt number along the left wall from CFD and ANN for pure fluid and nanofluid (Ra=106, H1=0.25, H2=0.75)

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Figure 5

(a) Variation in average Nusselt numbers of heat sources with solid volume fraction from CFD and ANN (Ra=106, H1=0.25, H2=0.75). (b) Variation in maximum temperatures of heat sources with solid volume fraction from CFD and ANN (Ra=106, H1=0.25, H2=0.75).

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Figure 6

Streamlines (left) and isotherms (right) from CFD (—) and ANN (—) at different heat source locations (Ra=106, ϕ=0.05)

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Figure 7

A comparison between CFD and ANN results in terms of the average Nusselt number versus the position of the top heat source (Ra=106, ϕ=0.05, H1=0.1)




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