0
Research Papers

A Thermomechanical Solver for Multilayer Power Electronic Assemblies Integrated Into the DJOSER Thermal Simulator

[+] Author and Article Information
Paolo Emilio Bagnoli

Department of Information Engineering, University of Pisa, Pisa 56100, Italy

Cristina Padovani, Andrea Pagni, Giuseppe Pasquinelli

Institute of Information Science and Technologies “A. Faedo,” ISTI-CNR, Pisa 56100, Italy

J. Electron. Packag 133(1), 011005 (Mar 09, 2011) (7 pages) doi:10.1115/1.4003516 History: Received November 30, 2009; Revised January 18, 2011; Published March 09, 2011; Online March 09, 2011

The DJOSER analytical thermal solver for multilayer mounting structures has been tested as a useful and friendly tool for the thermal analysis of power electronic devices and their packages, able to replace the onerous programs based on the finite element method (FEM) calculations. The other problem connected with the packaging evaluation is the calculation of the thermally induced stresses and strains in the various layers composing the assembling structures. This paper deals with the first step of the implementation of a thermomechanical solver to be connected with the DJOSER program, which is able to calculate the stresses at the layer interfaces, using the same strategy, i.e., a semianalytical mathematical approach, as well as the same structural models (stepped pyramidal structures and homogeneous layers). The basic theory is briefly exposed and the method is applied to some two-layer virtual structures. The obtained results are compared with those obtained using standard FEM analyses.

FIGURES IN THIS ARTICLE
<>
Copyright © 2011 by American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Figure 2

Temperature distributions T1+, T2−, and T2+ versus x for the three samples A, B, and C calculated using the DJOSER thermal solver

Grahic Jump Location
Figure 3

Distributions of the p1−,p1+,q1−,q1+ stresses versus x for the three samples A, B, and C, calculated using the THESIS solver

Grahic Jump Location
Figure 4

Comparison between the four stresses calculated with THESIS (continuous line) and with a finite element program (dashed line). Case C.

Grahic Jump Location
Figure 5

Relative error percentage plots for the stresses p1−,p1+,q1−,q1+ between the THESIS results of Sample C and those obtained using a finite element program on the same structure

Grahic Jump Location
Figure 1

(a) Coordinate system for each layer. (b) Cross-section of the two-layer structure. (c) Localization of temperatures, stresses, and displacements. (d) View of the virtual sample for the DJOSER thermal analysis.

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In