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Research Papers

Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages

[+] Author and Article Information
Arun Prakash Raghupathy

 Electronic Cooling Solutions Incorporated, Santa Clara, CA 95051arun@ecooling.com

John Janssen

 NXP Semiconductors, The Netherlandsj.h.j.janssen@nxp.com

Attila Aranyosi

 Electronic Cooling Solutions Incorporated, Santa Clara, CA 95051aaranyosi@ecooling.com

Urmila Ghia

Department of Mechanical Engineering, Computational Fluid Dynamics Research Laboratory,University of CincinnatiUrmila.ghia@uc.edu

Karman Ghia

Department of Aerospace Engineering, Computational Fluid Dynamics Research Laboratory,University of Cincinnatikghia@cfdrl.uc.edu

William Maltz

 Electronic Cooling Solutions Incorporated, Santa Clara, CA 95051wmaltz@ecooling.com

J. Electron. Packag 133(1), 011003 (Mar 03, 2011) (10 pages) doi:10.1115/1.4003217 History: Received February 22, 2010; Revised November 12, 2010; Published March 03, 2011; Online March 03, 2011

In the current study, a network-based resistor model has been developed for thermal analysis of a complex opto-electronic package called small form-factor pluggable device (SFP). This is done using the DEvelopment of Libraries of PHysical models for an Integrated design (DELPHI) methodology. The SFP is an optical transceiver widely used in telecommunication equipments such as switches and routers. The package has a detailed construction and typically has four fixed heat generating sources. The detailed model for the SFP is constructed and calibrated using a natural convection experiment. The calibrated detailed model is used for generating the limited boundary-condition-independent compact thermal model (CTM). Limited boundary-condition-independence, in this case, refers only to a small subset of all “thinkable” boundary conditions that are experienced by the SFP device in practical situations. The commercial optimization tool developed by the DELPHI team, DOTCOMP , is used for generating the compact thermal model. A detailed validation of the CTM of the SFP in real-time applications using FLOTHERM 7.2, a computational fluid dynamics-based thermal analysis software package, is performed. The results show excellent agreement between the results predicted by the SFP CTM with the data from the detailed model. The SFP CTM predicts the junction temperature of the four power-dissipating components and the heat flows through the sides with relative error less than 10%.

Copyright © 2011 by American Society of Mechanical Engineers
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Figures

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Figure 1

Generic layout of an optical transceiver (page 2)

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Figure 2

Small form-factor pluggable optical transceiver (page 3)

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Figure 3

Complete experimental setup

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Figure 4

Close-up of the first stage setup

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Figure 5

Close-up of the second stage setup

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Figure 6

Infrared thermal profile of the SFP

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Figure 7

Infrared thermal profile of the complete SFP

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Figure 8

Exploded CAD model of the complete SFP

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Figure 9

Computational setup for first stage modeling

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Figure 10

Simulated thermal profile of the first stage model

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Figure 11

Computational setup for second stage modeling

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Figure 12

Simulated thermal profile of second stage model

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Figure 13

Thermal behavior of the SFP housing

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Figure 14

Isometric view showing the setup of the SFP inside the duct for natural convection

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Figure 15

Side view showing the setup of the SFP with heat sink inside the duct for natural convection

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Figure 16

View showing the setup of the SFP inside the duct for forced convection

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Figure 17

Plane at which the flow and temperature fields are analyzed

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Figure 18

Comparison of flow fields predicted by the detailed and compact models for simulation of natural convection: (a) detailed SFP model and (b) SFP CTM

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Figure 19

Comparison of temperature fields predicted by the detailed and compact models for simulation of natural convection: (a) detailed SFP model and (b) SFP CTM

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