Research Papers

Surface Topographical Characterization of Gold Aluminide Compound for Thermosonic Ball Bonding

[+] Author and Article Information
M. F. Rosle, M. A. A. Hamid, A. R. Daud

Faculty of Science and Technology, Universiti Kebangsaan Malaysia (UKM), Bangi, Selangor 43600, Malaysia

S. Abdullah, Z. Kornain

Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia (UKM), Bangi, Selangor 43600, Malaysia

A. Jalar

Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia (UKM), Bangi, Selangor 43600, Malaysiaazmanjalar@gmail.com

J. Electron. Packag 132(4), 041014 (Dec 09, 2010) (6 pages) doi:10.1115/1.4002728 History: Received July 29, 2009; Revised August 09, 2010; Published December 09, 2010; Online December 09, 2010

Relatively little information is available on the growth patterns of gold aluminide compound in accurate 3D measurement as compared with 2D images of the projected surface. A 3D surface imaging technique by using infinite focus microscope (IFM) was proposed in this study to observe and explain the effects of bonding parameters on growth pattern of gold aluminide compound formed between a 25.48μm 4N gold wire and an aluminum pad metallization. Two bonding factors, which were varied, were ball bonding force and ultrasonic current while bonding time and temperature were kept constant. The 3D surface measurement provides topographical and color information of the bonded region, which indicates that optimum bonding condition has a significant effect on uniform growth and wide coverage area of gold aluminide compound. Results illustrated by this technique were used as additional information to the results produce by the conventional methods such as cross section optical image and scanning electron microscope (SEM) micrographs, to gain a better understanding on the physical behavior of gold aluminide compound.

Copyright © 2010 by American Society of Mechanical Engineers
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Figure 1

Two-dimensional optical image underside of a typical gold ball after removal from a bond pad for five combinations of bonding parameters, as presented in Table 1, which are (a) run 1, (b) run 2, (c) run 3, (d) run 4, and (e) run 5

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Figure 2

Volume above (gray) and below (dark) the cutting plane represent the calculated volumes

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Figure 3

Three-dimensional images of bonded and unbonded regions separated by the cutting plane after being converted from two-dimensional optical image in Fig. 1

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Figure 4

Two-way interaction plots for all two-factor combinations

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Figure 5

Response optimization result for targeted AuAl IMC

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Figure 6

Roughness analysis area at four evaluation lines (A, B, C, and D) for sample of run 3

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Figure 7

The comparison of Ra values for sample of run 3 that represents various average roughness profiles over the evaluation length (A, B, C, and D) of Fig. 6

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Figure 8

(a) Average and (b) standard deviations of computed measurements over the evaluation length (A, B, C, and D) underside of the bonded ball for all five combination parameters




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