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Research Papers

Multi-Objective Optimization of Thermo-Ultrasonic Flip-Chip Bonding Process for High-Brightness Light Emitting Diodes

[+] Author and Article Information
Chung-Feng Jeffrey Kuo1

Department of Polymer Engineering, National Taiwan University of Science and Technology, No. 43, Section 4, Keelung Road, Taipei 106, Taiwanjeffreykuo@mail.ntust.edu.tw

Hui-Ta Chen

Laser Application Technology Center, Industrial Technology Research Institute South, No. 8, Gongyan Road, Lioujia Township, Tainan County 734, Taiwan

Te-Li Su

Department of Cosmetic Application and Management, St. Mary's Medicine, Nursing and Management College, Yilan County 266, Taiwan

Jr-Da Huang

Department of Polymer Engineering, National Taiwan University of Science and Technology, No. 43, Section 4, Keelung Road, Taipei 106, Taiwan

1

Corresponding author.

J. Electron. Packag 132(4), 041006 (Nov 24, 2010) (7 pages) doi:10.1115/1.4002727 History: Received March 03, 2009; Revised September 19, 2010; Published November 24, 2010; Online November 24, 2010

Flip-chip bonding is a kind of chip packaging technology, which can make fabricated chips lighter and smaller. Thermo-ultrasonic flip-chip bonding is a technology that directly joins gold pad and gold bump. This study combines principle component analysis and gray relational analysis to determine the optimal processing parameters for multiple quality characteristics of light emitting diodes (LEDs). The quality characteristics of this experiment include the candle light, forward voltage, and leakage current of LED and thrust value. First, this study determines the processing parameters that may affect the thermo-ultrasonic flip-chip bonding with the L18 orthogonal array, including substrate temperature, bonding downforce, ultrasonic working time, ultrasonic power, and rising and delay time of tool head bonding. Then, the gray relational analysis is applied to indicate the optimal processing parameters for the multiple quality characteristics of LED. Since the Taguchi method only takes one single quality characteristic into consideration, this study applies the Taguchi method to reduce the number of thermo-ultrasonic flip-chip bonding experiments. The experimental results prove that the optimal LED has good integral quality, which is above industrial standard.

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Figures

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Figure 1

Thermo-ultrasonic flip-chip bonding process

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Figure 2

Design and size of a single flip chip with submount

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Figure 3

Diagram of the thrust experiment

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Figure 4

Structure of prober measurement

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Figure 5

Practical bonding of the verification group

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Figure 6

Analysis of the destructive experiment of the verification group

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Figure 7

Fracture on the gold bump

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